Abstract: A semiconductor device includes: a sense amplifier; a branched line selectively connectable to the sense amplifier; a recycling arrangement selectively connectable to the branched line; an array of bit lines connected to corresponding memory cells; a multiplexer configured to selectively connect the branched line to a selected one of the memory cells through a corresponding line amongst the array of bit lines; and a controller. The controller is configured to: permit, during a recovery phase in which a gleaned amount of charge (gleaned charge) is recovered, flow of charge (charge-flow) between the recycling arrangement and the branched line; interrupt, during a drainage phase in which the gleaned charge is preserved, charge-flow between the recycling arrangement and the branched line; and permit, during a reuse phase in which the gleaned charge is reused, charge-flow between the recycling arrangement and the branched line.

Abstract: A embodiment package includes a three dimensional integrated circuit (3D IC) with first input/output pads on a first side and second input/output pads on a second side, a first fan out structure electrically coupled to the first input/output pads on the first side of the three dimensional integrated circuit, and a second fan out structure electrically coupled to the second input/output pads on the second side of the three dimensional integrated circuit.

Abstract: Some embodiments relate to a system that includes write circuitry, read circuitry, and comparison circuitry. The write circuitry is configured to attempt to write an expected multi-bit word to a memory location in a memory device. The read circuitry is configured to read an actual multi-bit word from the memory location. The comparison circuitry is configured to compare the actual multi-bit word read from the memory location with the expected multi-bit word which was previously written to the memory location to distinguish between a number of erroneous bits in the actual multi-bit word and a number of correct bits in the actual multi-bit word. The write circuitry is further configured to re-write the number of erroneous bits to the memory location without attempting to re-write the number of correct bits to the memory location.

Abstract: A semiconductor arrangement and a method of forming the same are described. A semiconductor arrangement includes a first layer including a first optical transceiver and a second layer including a second optical transceiver. A first serializer/deserializer (SerDes) is connected to the first optical transceiver and a second SerDes is connected to the second optical transceiver. The SerDes converts parallel data input into serial data output including a clock signal that the first transceiver transmits to the second transceiver. The semiconductor arrangement has a lower area penalty than traditional intra-layer communication arrangements that do not use optics for alignment, and mitigates alignment issues associated with conventional techniques.

Abstract: A stabilizing circuit is provided that is connected to a biased voltage. The stabilizing circuit is configured to inhibit a change in voltage of the biased voltage caused by a first change in voltage of one or more nodes that are connected to the biased voltage through a first parasitic capacitance. In some embodiments, the stabilizing circuit induces a voltage on the biased voltage through a second parasitic capacitance that changes from a first voltage level to a second voltage level during the first change in voltage such that a total change in parasitic voltage that is induced at the biased voltage during the first change in voltage is close to 0 V.

Abstract: A memory device is provided which comprises a memory array, a first scrambling circuit and a second scrambling circuit. The first scrambling circuit is configured to provide first scrambled data with a first scrambling pattern in response to input data. The second scrambling circuit is configured to provide second scrambled data with a second scrambling pattern in response to the first scrambled data.

Abstract: A sensing circuit having a reduced bias clamp and method of operating the sensing circuit are provided. The sensing circuit may include a reference path and a sensing path. The sensing path may include a first transistor, clamping capacitor and a pair of switches. The reference path may include a second transistor, clamping capacitor and another pair of switches. A common gain stage receiving a bias voltage charges the clamping capacitors for the respective paths in a charging mode. The clamping capacitors may be charged in a serial or partially parallel manner during the charging mode. Each path may be coupled to a comparator, which may sense current or voltage changes between the paths during a sense mode. The sensing circuit may be configured to provide for sensing current or voltage changes between multiple sensing and/or reference paths in a parallel or serial manner.

Abstract: A semiconductor arrangement and a method of forming the same are described. A semiconductor arrangement includes a first layer including a first optical transceiver and a second layer including a second optical transceiver. A first serializer/deserializer (SerDes) is connected to the first optical transceiver and a second SerDes is connected to the second optical transceiver. The SerDes converts parallel data input into serial data output including a clock signal that the first transceiver transmits to the second transceiver. The semiconductor arrangement has a lower area penalty than traditional intra-layer communication arrangements that do not use optics for alignment, and mitigates alignment issues associated with conventional techniques.

Abstract: The present disclosure provides a method of fabricating a resistive memory array. In one embodiment, a method of fabricating a resistive memory array includes forming a plurality of insulators and a conductive structure on a first substrate, performing a resistor-forming process to transform the insulators into a plurality of resistors, polishing the conductive structure to expose a plurality of contact points respectively electrically connected to the resistors, providing a second substrate having a plurality of transistors and a plurality of interconnect pads, bonding respectively the interconnect pads and the contact points, and removing the first substrate from the resistors and the conductive structure.

Abstract: A semiconductor arrangement and a method of forming the same are described. A semiconductor arrangement includes a first layer including a first optical transceiver and a second layer including a second optical transceiver. A first serializer/deserializer (SerDes) is connected to the first optical transceiver and a second SerDes is connected to the second optical transceiver. The SerDes converts parallel data input into serial data output including a clock signal that the first transceiver transmits to the second transceiver. The semiconductor arrangement has a lower area penalty than traditional intra-layer communication arrangements that do not use optics for alignment, and mitigates alignment issues associated with conventional techniques.

Abstract: A trimming process for setting a reference current used in operating an MRAM module comprising an operational MRAM cell coupled to a bit line, multiple reference MRAM cells coupled to a reference bit line, and a sense amplifier coupled to the bit line and the reference bit line is disclosed in some embodiments. The process includes applying a bit line reference voltage to the reference bit line to provide a reference cell current formed by a sum of respective currents through the plurality of reference MRAM cells. The reference cell current is detected. A determination is made as to whether the detected reference cell current differs from a target reference cell current. The bit line reference voltage is varied, or a sensing ratio of the sense amplifier is varied, if it is determined that the detected reference cell current differs from the target reference cell current.

Abstract: A embodiment package includes a three dimensional integrated circuit (3D IC) with first input/output pads on a first side and second input/output pads on a second side, a first fan out structure electrically coupled to the first input/output pads on the first side of the three dimensional integrated circuit, and a second fan out structure electrically coupled to the second input/output pads on the second side of the three dimensional integrated circuit.

Abstract: A method of fabricating a resistive memory array includes forming a plurality of insulators and a conductive structure on a first substrate, performing a resistor-forming process to transform the insulators into a plurality of resistors, polishing the conductive structure to expose a plurality of contact points respectively electrically connected to the resistors, providing a second substrate having a plurality of transistors and a plurality of interconnect pads, bonding respectively the interconnect pads and the contact points, and removing the first substrate from the resistors and the conductive structure.

Abstract: A circuit that includes a current source module, a current sink module and a memory bank is disclosed. Each of the current source module, the current sink module and the memory bank is connected to the first bit/source line and the second bit/source line. The memory bank is bounded by the current source module and the current sink module. When the current source module and the current sink module receive a triggering pulse from the first bit/source line and a select signal with a first state, the current source module is activated to generate an operating current to the first bit/source line that transmits through a conducted memory cell of the memory bank and the current sink module is activated to drain the operating current from the second bit/source line.

Abstract: A embodiment package includes a three dimensional integrated circuit (3D IC) with first input/output pads on a first side and second input/output pads on a second side, a first fan out structure electrically coupled to the first input/output pads on the first side of the three dimensional integrated circuit, and a second fan out structure electrically coupled to the second input/output pads on the second side of the three dimensional integrated circuit.

Abstract: A sensing circuit having a reduced bias clamp and method of operating the sensing circuit are provided. The sensing circuit may include a reference path and a sensing path. The sensing path may include a first transistor, clamping capacitor and a pair of switches. The reference path may include a second transistor, clamping capacitor and another pair of switches. A common gain stage receiving a bias voltage charges the clamping capacitors for the respective paths in a charging mode. The clamping capacitors may be charged in a serial or partially parallel manner during the charging mode. Each path may be coupled to a comparator, which may sense current or voltage changes between the paths during a sense mode. The sensing circuit may be configured to provide for sensing current or voltage changes between multiple sensing and/or reference paths in a parallel or serial manner.

Abstract: A trimming process for setting a reference current used in operating an MRAM module comprising an operational MRAM cell coupled to a bit line, multiple reference MRAM cells coupled to a reference bit line, and a sense amplifier coupled to the bit line and the reference bit line is disclosed in some embodiments. The process includes applying a bit line reference voltage to the reference bit line to provide a reference cell current formed by a sum of respective currents through the plurality of reference MRAM cells. The reference cell current is detected. A determination is made as to whether the detected reference cell current differs from a target reference cell current. The bit line reference voltage is varied, or a sensing ratio of the sense amplifier is varied, if it is determined that the detected reference cell current differs from the target reference cell current.

Abstract: A sensing circuit having a reduced bias clamp and method of operating the sensing circuit are provided. The sensing circuit may include a reference path and a sensing path. The sensing path may include a first transistor, clamping capacitor and a pair of switches. The reference path may include a second transistor, clamping capacitor and another pair of switches. A common gain stage receiving a bias voltage charges the clamping capacitors for the respective paths in a charging mode. The clamping capacitors may be charged in a serial or partially parallel manner during the charging mode. Each path may be coupled to a comparator, which may sense current or voltage changes between the paths during a sense mode. The sensing circuit may be configured to provide for sensing current or voltage changes between multiple sensing and/or reference paths in a parallel or serial manner.

Abstract: Some embodiments relate to a system that includes write circuitry, read circuitry, and comparison circuitry. The write circuitry is configured to attempt to write an expected multi-bit word to a memory location in a memory device. The read circuitry is configured to read an actual multi-bit word from the memory location. The comparison circuitry is configured to compare the actual multi-bit word read from the memory location with the expected multi-bit word which was previously written to the memory location to distinguish between a number of erroneous bits in the actual multi-bit word and a number of correct bits in the actual multi-bit word. The write circuitry is further configured to re-write the number of erroneous bits to the memory location without attempting to re-write the number of correct bits to the memory location.

Abstract: A memory comprising a word line having a word line voltage, a charge pump coupled to the word line, and a dynamic feedback control circuit coupled to the charge pump. The dynamic feedback control circuit is configured to boost the word line voltage to a predetermined voltage value greater than a target threshold voltage, change a clock frequency of a clock signal supplied to the charge pump from a non-zero frequency to a zero frequency if the word line voltage is above the predetermined voltage value, and change the clock frequency from the zero frequency to the non-zero frequency if the word line voltage is below the target threshold voltage.