Abstract: The present disclosure is directed to a semiconductor device. The semiconductor device includes a substrate, an insulating layer disposed on the substrate, a first conductive feature disposed in the insulating layer, and a capacitor structure disposed on the insulating layer. The capacitor structure includes a first electrode, a first dielectric layer, a second electrode, a second dielectric layer, and a third electrode sequentially stacked. The semiconductor device also includes a first via connected to the first electrode and the third electrode, a second via connected to the second electrode, and a third via connected to the first conductive feature. A part of the first via is disposed in the insulating layer. A portion of the first conductive feature is directly under the capacitor structure.

Abstract: A waterproof zipper is provided with two halves, each including a half tape member and a row of protruding teeth along an inner edge of the half tape member; and a waterproof layer is secured to an inner surface of the halves. A process of manufacturing the waterproof zipper is also provided, including the steps of: (a) guiding the waterproof layer to a position above the two halves on a continuous flow production line, each half having a half tape member and a row of protruding teeth along an inner edge of the half tape member; (b) coating a waterproof layer on a releasing layer; (c) drying both the waterproof layer and the releasing layer in an oven.

Abstract: A waterproof zipper is provided with two halves, each including a half tape member and a row of protruding teeth along an inner edge of the half tape member; and a waterproof layer is secured to an inner surface of the halves. The waterproof layer coated on the inner surfaces of the halves may prevent the liquid from penetrating into the interior of the waterproof zipper, and simplify the structure of the waterproof zipper. A process of manufacturing the waterproof zipper is also provided.

Abstract: A waterproof zipper is provided with two halves, each including a half tape member and a row of protruding teeth along an inner edge of the half tape member; and a waterproof layer is secured to an inner surface of the halves. A process of manufacturing the waterproof zipper is also provided.

Abstract: A waterproof structure for zippers includes a waterproof layer formed on one side surface of two tapes of a half-finished zipper. The waterproof layer is formed by coating a layer of bonding glue on the one side surface of the two tapes and then the bonding glue has its upper layer stuck with an electroplating membrane. By so designing, external water can be prevented from seeping in the two tapes of the zipper, thus elevating waterproof effect of a zipper.

Abstract: A waterproof structure for zippers includes a waterproof layer formed on one side surface of two tapes of a half-finished zipper. The waterproof layer is formed by coating a layer of bonding glue on the one side surface of the two tapes and then the bonding glue has its upper layer stuck with an electroplating membrane. By so designing, external water can be prevented from seeping in the two tapes of the zipper, thus elevating waterproof effect of a zipper.