Patents by Inventor Hung Chen

Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162071
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 16, 2024
    Inventors: Chih-Hung HUANG, Cheng-Lung WU, Yi-Fam SHIU, Yu-Chen CHEN, Yang-Ann CHU, Jiun-Rong PAI
  • Publication number: 20240160068
    Abstract: A display device is provided. The display device includes a first electrode and a second electrode. The first electrode includes a first main portion, a first peripheral portion, and a plurality of first extending portions. Part of the first extending portions extend into the first peripheral portion and are connected to each other via a first vertically-extending portion. Other part of the first extending portions do not extend into the first peripheral portion and are separated from each other. The second electrode includes a second main portion, a second peripheral portion, and a plurality of second extending portions. Part of the second extending portions extend into the second peripheral portion and are connected to each other via a second vertically-extending portion. Other part of the second extending portions do not extend into the second peripheral portion and are separated from each other.
    Type: Application
    Filed: January 24, 2024
    Publication date: May 16, 2024
    Inventors: Tsung-Han TSAI, Chien-Hung CHEN, Mei-Chun SHIH
  • Publication number: 20240158968
    Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 16, 2024
    Inventors: Ying-Chi LIN, Wei-Hung CHEN, Li-Chen CHU, Rih-Sheng CHIANG
  • Publication number: 20240156440
    Abstract: A method of reconstructing transcranial images using a dual-mode ultrasonic phased array includes steps of: controlling channels to emit energy toward an intracranial target point of a patient; respectively generating backscattered radiofrequency (RF) data by using the channels to receive backscattered energy reflected from the intracranial target; and reconstructing an acoustic distribution image based on those backscattered RF data in real-time. Compared with Pre-Treatment Ray Tracing Method, the present invention can display intracranial pressure distribution in real-time; compared with MR Thermometry, the present invention can be applied to low-energy applications without temperature change; and compared with Passive Cavitation Imaging, the present invention can stably present acoustic distribution images without relying on microbubbles.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 16, 2024
    Inventors: HAO-LI LIU, HSIANG-CHING LIN, ZHEN-YUAN LIAO, HSIANG-YANG MA, CHIH-HUNG TSAI, CHUN-HAO CHEN
  • Publication number: 20240162903
    Abstract: An electronic switch device and an electronic switch system are provided, wherein the electronic switch system includes: an electronic switch device, which includes: a sensing module, which includes: a pressure sensing module for providing a pressure sensing signal; and a touch control sensing module disposed on the pressure sensing module for providing a touch control sensing signal; and a comparator circuit coupled to the sensing module for receiving the pressure sensing signal.
    Type: Application
    Filed: March 30, 2023
    Publication date: May 16, 2024
    Inventors: Chia-Tsun Huang, Keng-Kuei Liang, chih-hung Liu, Yi-Feng Chen
  • Publication number: 20240157063
    Abstract: A drug delivery device including a main housing and a drug delivery module is provided. The main housing has an internal space. The drug delivery module is disposed in the internal space so as to be isolated from an external environment. The drug delivery module includes a drug bottle that contains a liquid drug and a driver that is connected to the drug bottle. The driver is configured to push the liquid drug to pass through a drug nebulization structure of the drug bottle such that the liquid drug is nebulized into a nebulized drug.
    Type: Application
    Filed: November 14, 2023
    Publication date: May 16, 2024
    Inventors: Chieh-Sheng Cheng, JUI-SHUI CHEN, YI-HUNG WANG
  • Publication number: 20240162003
    Abstract: A passivation equipment and a passivation method for a semiconductor device are provided in the present invention. The passivation equipment for the semiconductor device includes a chamber housing and a splitter disposed in the chamber housing. The splitter divides the chamber housing to a first chamber and a second chamber. The passivation equipment further includes a first intake tube connected to the first chamber, a plasma producing unit disposed in the first chamber and a pressure detecting unit connected to the first chamber. By using the passivation equipment of the present invention, high-pressure plasma is used to increase a passivation efficiency of the semiconductor device and decrease a temperature of a passivation reaction.
    Type: Application
    Filed: November 9, 2023
    Publication date: May 16, 2024
    Inventors: Chi-Wen CHEN, Chun-Huai LI, Chih-Hung CHEN, Chun-Hung HUNG
  • Publication number: 20240162169
    Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.
    Type: Application
    Filed: December 12, 2023
    Publication date: May 16, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
  • Publication number: 20240162171
    Abstract: A device die including a first semiconductor die, a second semiconductor die, an anti-arcing layer and a first insulating encapsulant is provided. The second semiconductor die is stacked over and electrically connected to the first semiconductor die. The anti-arcing layer is in contact with the second semiconductor die. The first insulating encapsulant is disposed over the first semiconductor die and laterally encapsulates the second semiconductor die. Furthermore, methods for fabricating device dies are provided.
    Type: Application
    Filed: January 21, 2024
    Publication date: May 16, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Wei Chen, Tzuan-Horng Liu, Chia-Hung Liu, Hao-Yi Tsai
  • Publication number: 20240163850
    Abstract: Certain aspects of the present disclosure provide techniques for randomization of reconfigurable intelligent surface (RIS) signals. A method for wireless communication includes determining a random reflection parameter for each of one or more RISs. The random reflection parameter is random over time for the one or more RISs. The method includes applying random values of the random reflection parameter at different times at each of the one or more RISs.
    Type: Application
    Filed: November 16, 2022
    Publication date: May 16, 2024
    Inventors: Ahmed ELSHAFIE, Muhammad Sayed Khairy ABDELGHAFFAR, Yu ZHANG, Hung Dinh LY, Alexandros MANOLAKOS, Wanshi CHEN, Peter GAAL
  • Publication number: 20240164068
    Abstract: A power control system of a rack heat-dissipation system, which receives output voltages of a rack power supply and a module power supply, includes a first control module and a second control module operating in parallel. The first control module includes a first switching unit, a first voltage converting unit and a first monitoring unit. The second control module includes a second switching unit, a second voltage converting unit and a second monitoring unit. The first monitoring unit is connected to the rack power supply, the module power supply, the first switching unit and the first voltage converting unit, and the second monitoring unit is connected to the rack power supply, the module power supply, the second switching unit and the second voltage converting unit. The heat dissipation system can be kept in the normal operation even if one of the control modules is failed.
    Type: Application
    Filed: December 14, 2022
    Publication date: May 16, 2024
    Inventors: YUNG-HUNG HSIAO, CHIA-HSIEN YEN, DA-SHIAN CHEN, HAO-CHIEH CHANG
  • Patent number: 11980338
    Abstract: An endoscope device includes a hollow tube, a thermal-conductive member, an image-capturing module, and a heat-dissipation tube. The hollow tube includes an insertion end. The thermal-conductive member is in the hollow tube and adjacent to the insertion end. The thermal-conductive member includes a first end, a second end, and a receiving groove. The first end is near to the insertion end as compared with the second end, and the receiving groove is between the first end and the second end. The image-capturing module includes a camera module and a circuit board in the receiving groove. The camera module is at the insertion end and electrically connected to the circuit board. The first end contacts the camera module. The heat-dissipation tube is in the hollow tube. One end of the heat-dissipation tube contacts the thermal conductive member, and the other end of the heat-dissipation tube extends away from the insertion end.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: May 14, 2024
    Assignee: CHICONY ELECTRONICS CO., LTD.
    Inventor: Hsin-Hung Chen
  • Patent number: 11984485
    Abstract: A semiconductor device includes a substrate, a gate structure on the substrate, a source/drain (S/D) region and a contact. The S/D region is located in the substrate and on a side of the gate structure. The contact lands on and connected to the S/D region. The contact wraps around the S/D region.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hsien Cheng, Jr-Hung Li, Tai-Chun Huang, Tze-Liang Lee, Chung-Ting Ko, Jr-Yu Chen, Wan-Chen Hsieh
  • Patent number: 11984323
    Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Te-Chien Hou, Yu-Ting Yen, Cheng-Yu Kuo, Chih Hung Chen, William Weilun Hong, Kei-Wei Chen
  • Patent number: 11983475
    Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
  • Patent number: 11983726
    Abstract: A consumption prediction method includes the following steps: calculating a personal preference correlation coefficient; inputting historical environment data, a historical consumption record and the personal preference correlation coefficient into a first neural network model; a training model is generated by the first neural network model; and determining whether the accuracy rate of the training model is higher than the training threshold. When the accuracy rate of the training model is higher than the training threshold, the training model is regarded as a prediction model.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: May 14, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Wen-Kuang Chen, Chien-Kuo Hung, Chun-Hung Chen, Chen-Chung Lee
  • Patent number: 11980694
    Abstract: A sterilization apparatus for a portable electronic device including a cabinet and a carrier is provided. The carrier includes a base slidably disposed on the cabinet, multiple first positioning elements and multiple second positioning elements disposed in parallel on the base, multiple sterilization light sources corresponding to the second positioning elements and multiple pressure sensors disposed in parallel in the base. The base is configured to carry at least one portable electronic device. One second positioning element is disposed between any two adjacent first positioning elements, and any first positioning element and any second positioning element adjacent to each other are separated by a positioning space. The pressure sensors are respectively located in the positioning spaces. One sterilization light source is disposed between any two adjacent pressure sensors, and the pressure sensors are configured to sense a pressure from the portable electronic device.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: May 14, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yi-Hung Chen, Chih-Wen Chiang, Yun-Tung Pai, Yen-Hua Hsiao, Yao-Kuang Su, Yi-Hsuan Lin, Han-Sheng Siao
  • Patent number: 11982107
    Abstract: A system and method for controlling a locking device used in logistic management, the method including the step of receiving a command associated with an operation of a mechanical locking device; validating the received command and a protocol associated with the command; and manipulating the mechanical locking device operable in at least a locking state and an unlocking state; wherein the mechanical locking device is arranged to operate in response to a successful validation of the command associated with one of at least two protocols.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: May 14, 2024
    Assignee: Logistics and Supply Chain MultiTech R&D Centre Limited
    Inventors: Chi Hung Tong, Hung Kwan Chen, Wai Tong Luk
  • Patent number: 11980920
    Abstract: Embodiments of the present disclosure relate to apparatus and methods for cleaning an exhaust path of a semiconductor process tool. One embodiment provides an exhaust pipe section and a pipe cleaning assembly connected between a semiconductor process tool and a factory exhaust. The pipe cleaning assembly includes a residue remover disposed in the exhaust pipe section. The residue remover is operable to move in the exhaust pipe section to dislodge accumulated materials from an inner surface of the exhaust pipe section.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wei Chang Cheng, Cheng-Kuang Chen, Chi-Hung Liao
  • Patent number: D1026916
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: May 14, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hao-Jen Fang, Kung-Ju Chen, Wei-Yi Chang, Chun-Chieh Chen, Chih-Wen Chiang, Sheng-Hung Lee