Patents by Inventor Hung Chien

Hung Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical imaging lens
    Patent number: 11555985
    Abstract: An optical imaging lens may include a first, a second, a third, a fourth, a fifth and a sixth lens elements positioned in an order from an object side to an image side. The optical imaging lens may satisfy AAG/(T3+T6)?2.500, wherein a sum of five air gaps from the first lens element to the sixth lens element along the optical axis is represented by AAG, a thickness of the third lens element along the optical axis is represented by T3, and a thickness of the sixth lens element along the optical axis is represented by T6.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: January 17, 2023
    Assignee: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Hung Chien Hsieh, Wenbin Lin, Xinming Liu
  • Optical imaging lens
    Patent number: 11550128
    Abstract: Present embodiments provide for optical imaging lenses. An optical imaging lens may include at least seven lens elements positioned sequentially from an object side to an image side. Through arrangement of the convex or concave surfaces of the lens elements, the length of the optical imaging lens may be shortened while providing better optical characteristics and imaging quality.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: January 10, 2023
    Assignee: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Hung-Chien Hsieh, Fensha Cai, Xue Li
  • TRANSMIT POWER OF WIRELESS COMMUNICATION
    Publication number: 20230007598
    Abstract: Approaches for controlling the transmit power of antennas of a communication device, are described. The communication device may include a first wireless communication module and a second wireless communication module. In an example, the first wireless communication module may be coupled to a first antenna.
    Type: Application
    Filed: December 20, 2019
    Publication date: January 5, 2023
    Inventors: KUN-JUNG WU, HUNG-WEN CHENG, CHIH-HUNG CHIEN
  • POWER REDUCTION MODES
    Publication number: 20220413587
    Abstract: In some examples, the disclosure describes a device, comprising: a processor, and a non-transitory memory resource storing machine-readable instructions stored thereon that, when executed, cause the processor to: activate a dynamic power reduction mode for a device in response to identifying the device is in a first power state associated with a first account, and deactivate the dynamic power reduction mode for the device in response to identifying the device is in a second power state associated with a second account.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 29, 2022
    Inventors: Isaac Lagnado, Chih-Hung Chien, Danny Farnyih Meng, Steven Petit
  • MAPPING INFORMATION MANAGEMENT METHOD, MEMORY STORAGE DEVICE AND MEMORY CONTROL CIRCUIT UNIT
    Publication number: 20220413763
    Abstract: A mapping information management method, a memory storage device, and a memory control circuit unit are provided. The method includes: receiving a write command instructing storing of first data from a host system; storing the first data to a rewritable non-volatile memory module according to the write command; updating mapping information corresponding to the storing of the first data; storing the mapping information to the rewritable non-volatile memory module; generating assistant information according to first part information of the mapping information, where the assistant information is not stored into the rewritable non-volatile memory module; and transmitting second part information of the mapping information and the assistant information to the host system to provide information related to the storing of the first data.
    Type: Application
    Filed: July 19, 2021
    Publication date: December 29, 2022
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Chia-Hung Chien, Yi-Cheng Wu, Chia-Hsiang Cheng
  • Driving circuit of display panel
    Patent number: 11538414
    Abstract: A driving circuit of a display panel comprises a scanning driving circuit, a data driving circuit, and a control circuit. The scanning driving circuit is coupled to a plurality of scanning lines of the display panel, and scans the scanning lines. The data driving circuit is coupled to a plurality of data lines of the display panel and provides at least one data signal corresponding to each scanning line to at least one data line of the data lines for driving at least one pixel of the display panel. The control circuit is coupled to the scanning driving circuit and the data driving circuit, controls the scanning driving circuit and the data driving circuit, and determines a scanning order of the scanning driving circuit to scan the scanning lines according to a driving number of the pixels to be driven by the data driving circuit corresponding to each scanning line.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: December 27, 2022
    Assignee: Sitronix Technology Corp.
    Inventors: Chih-Te Hung, I-Chen Lin, Chun-Chi Yeh, Chia-Hung Chien
  • OPTICAL IMAGING LENS
    Publication number: 20220397743
    Abstract: An optical imaging lens includes a first lens element, a second lens, an aperture stop, a third lens element and a fourth lens element from an object side to an image side in order along an optical axis, and each lens element has an object-side surface and an image-side surface. An optical axis of the image-side surface of the first lens element is convex and an optical axis of the image-side surface of the fourth lens element is concave. HFOV stands for the half field of view of the entire optical imaging lens and TTL is a distance from the object-side surface of the first lens element to an image plane along the optical axis to satisfy HFOV/TTL?1.500°/mm.
    Type: Application
    Filed: July 1, 2022
    Publication date: December 15, 2022
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Hung-Chien Hsieh, Ou Zhou, Lanlan Zhang
  • Sealed vacuum MEMS die
    Patent number: 11528546
    Abstract: A MEMS die includes a substrate having an opening formed therein, and a diaphragm attached around a periphery thereof to the substrate and over the opening, wherein the diaphragm comprises first and second spaced apart layers. A backplate is disposed between the first and second spaced apart layers. One or more columnar supports are disposed through holes disposed through the backplate and connecting the first and second spaced apart layers. At least a partial vacuum exists between at least a portion of the first and second spaced apart layers. The first layer further comprises interior and exterior sub-layers at least proximate to each of the one or more columnar supports, wherein the interior sub-layers include one or more apertures disposed therethrough.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: December 13, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Hung Chien Lin, Richard Li-Chen Chen
  • OPTICAL IMAGING LENS
    Publication number: 20220390714
    Abstract: An optical imaging lens includes a first lens element to a sixth lens element from an object side to an image side along an optical axis. An optical axis region of the object-side surface of the first lens element is concave, a periphery region of the object-side surface of the second lens element is convex, a periphery region of the image-side surface of the fourth lens element is concave, an optical axis region of the object-side surface of the fifth lens element is convex and a periphery region of the image-side surface of the sixth lens element is convex. Lens elements included by the optical imaging lens are only six lens elements described above. ImgH is an image height of the optical imaging lens and AAG is a sum of five air gaps from the first lens element to the sixth lens element along the optical axis to satisfy ImgH/AAG?3.200.
    Type: Application
    Filed: July 28, 2021
    Publication date: December 8, 2022
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Qingzhi Zhu, Lanlan Zhang, Hai Lin, Hung-Chien Hsieh
  • CABLE END CONNECTOR
    Publication number: 20220393385
    Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.
    Type: Application
    Filed: August 18, 2022
    Publication date: December 8, 2022
    Applicant: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
  • Connector with high heat dissipation efficiency
    Patent number: 11523538
    Abstract: A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: December 6, 2022
    Assignee: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • OPTICAL IMAGING LENS
    Publication number: 20220382014
    Abstract: An optical imaging lens includes a first lens element, a second lens, an aperture stop, a third lens element and a fourth lens element from an object side to an image side in order along an optical axis, and each lens element has an object-side surface and an image-side surface. An optical axis region of the object-side surface of the second lens element is convex. Only the above-mentioned four lens elements of the optical imaging lens have refracting power to satisfies the relationship: HFOV?15.000?15.000°, 3.000?TL/(G12+T2+G23) and TTL/BFL?3.500.
    Type: Application
    Filed: August 8, 2022
    Publication date: December 1, 2022
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Hung-Chien Hsieh, Ou Zhou, Lanlan Zhang
  • Optical imaging lens
    Patent number: 11500181
    Abstract: An optical imaging lens includes a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has negative refracting power, the periphery region of the object-side surface of the second lens element is concave and the optical-axis region of the object-side surface of the third lens element is concave. The Abbe number of the first lens element is ?1, the Abbe number of the second lens element is ?2, the Abbe number of the third lens element is ?3 and the Abbe number of the fourth lens element is ?4 to satisfy ?1+?2+?3+?4?150.000.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: November 15, 2022
    Assignee: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Hung-Chien Hsieh, Qingzhi Zhu, Fensha Cai
  • WORKING STATE DETERMINATION OF ELECTRONIC COMPONENTS
    Publication number: 20220349958
    Abstract: Techniques for determining a working state of an electronic component of an electronic device are described. The electronic component is coupled to the electronic device via a connection interface and a connector. The electronic device further comprises a contact detection assembly. The contact detection assembly detects a position of the connector relative to a connection interface. Based on the position of the connector relative to the connection interface, a state of connection between the connector and the connection interface is determined.
    Type: Application
    Filed: May 29, 2019
    Publication date: November 3, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chih-Hung Chien, Shih Huang Wu, Po Chao Chen
  • OPTICAL IMAGING LENS
    Publication number: 20220342184
    Abstract: The present invention provides an optical imaging lens. The optical imaging lens comprises five lens elements positioned in an order from an object side to an image side. Through controlling the convex or concave shape of the surfaces of the lens elements and satisfying an inequality, the optical imaging lens may be provided with smaller volume and great field of view.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 27, 2022
    Applicant: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Huabin Liao, Hai Lin, Hung-Chien Hsieh
  • SEALED VACUUM MEMS DIE
    Publication number: 20220321986
    Abstract: A MEMS die includes a substrate having an opening formed therein, and a diaphragm attached around a periphery thereof to the substrate and over the opening, wherein the diaphragm comprises first and second spaced apart layers. A backplate is disposed between the first and second spaced apart layers. One or more columnar supports are disposed through holes disposed through the backplate and connecting the first and second spaced apart layers. At least a partial vacuum exists between at least a portion of the first and second spaced apart layers. The first layer further comprises interior and exterior sub-layers at least proximate to each of the one or more columnar supports, wherein the interior sub-layers include one or more apertures disposed therethrough.
    Type: Application
    Filed: April 5, 2021
    Publication date: October 6, 2022
    Inventors: Hung Chien Lin, Richard Li-Chen Chen
  • Optical imaging lens including seven lenses of +?+?++? or +?+?+??, or eight lenses of +?+?+++?, +?+?++++, +?+??++?, +?+?++??, +????++? or ??+++?+? refractive powers
    Patent number: 11460670
    Abstract: An optical imaging lens may include a first, a second, a third, a fourth, a fifth, a sixth and a seventh lens element positioned in an order from an object side to an image side along an optical axis. Through designing concave and/or convex surface of the lens elements, the optical imaging lens may have improved imaging quality and improved assembly yield while the optical imaging lens may satisfy (|Sag51/ER51|+|Sag52/ER52|)/2?20.000%, wherein a Sag of an optical boundary of the object-side surface of the fifth lens element is represented by Sag51, a Sag of an optical boundary of the image-side surface of the fifth lens element is represented by Sag52, an effective radius of the object-side surface of the fifth lens element is represented by ER51, and an effective radius of the image-side surface of the fifth lens element is represented by ER52.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: October 4, 2022
    Assignee: Genius Electronic Optical (Xiamen) Co., Ltd.
    Inventors: Hung-Chien Hsieh, Lanlan Zhang, Ou Zhou
  • Connector with heat sink
    Patent number: 11454774
    Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: September 27, 2022
    Assignee: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • MELTING FURNACE ELECTRODE PUSH ASSEMBLY WITH TORQUE LIMITER
    Publication number: 20220289611
    Abstract: An assembly for pushing an electrode into a glass melting vessel can include a frame, a shaft, a pusher actuator, a contact mechanism, a master actuator, and a torque limiter. The contact mechanism can be attached to the shaft. The pusher actuator can be mounted to the frame and configured to cause translation of the shaft and the contact mechanism relative to the frame. The master actuator can be operatively connected to the pusher actuator such that operation of the master actuator causes operation of the pusher actuator. The torque limiter can be operatively connected between the master actuator and the pusher actuator, and can be configured to disengage when a rotational force on the master actuator exceeds a predetermined amount.
    Type: Application
    Filed: September 8, 2020
    Publication date: September 15, 2022
    Inventors: Chih Hung Chien, Hyun-taek Han, JinSoo Kim, Yong-hyeon Park
  • FRONT-END MODULES WITH GROUND PLANE SLOTS
    Publication number: 20220278454
    Abstract: An example radio frequency (RF) front-end module is described, which may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.
    Type: Application
    Filed: May 19, 2022
    Publication date: September 1, 2022
    Inventors: Chin-Hung MA, Chien-Pai LAI, Chih Hung CHIEN