Patents by Inventor Hung-Chuan Chen

Hung-Chuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10932358
    Abstract: A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: February 23, 2021
    Assignee: MediaTek Inc.
    Inventors: Duen-Yi Ho, Hung-Chuan Chen, Shang-Pin Chen
  • Publication number: 20200168548
    Abstract: A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.
    Type: Application
    Filed: October 23, 2019
    Publication date: May 28, 2020
    Inventors: Po-Hao CHANG, Yi-Jou LIN, Hung-Chuan CHEN
  • Patent number: 10596171
    Abstract: Provided is a compound of Formula (I) below, or a pharmaceutically acceptable salt, metabolite, or prodrug thereof: wherein: A1 is CR4 or N; A2 is CR5R6 or NR7; A3 is CR5?R6? or NR7?; each of R1, R2, R2?, R3, R3?, R4, R5, R5?, R6, R6?, R7, and R7?, independently, is hydrogen, deuterium, halogen, cyano, hydroxyl, carboxyl, amino, formyl, nitro, C1-6 alkyl, C2-6 alkenyl, C2-6 alkynyl, C1-6 alkoxy, C2-6 alkenyloxy, C1-6 alkylcarbonyl, C1-6 alkyloxycarbonyl, C1-6 alkylamine, C3-20 carbocyclyl, or C3-20 heterocyclyl; or R5 and R6, R5? and R6?, or R5 and R5?, together with the adjacent atom to which they are each attached, form C3-10 carbocyclyl or C3-10 heterocyclyl. Further provided are a method of using the above-described compound, or the pharmaceutically acceptable salt, metabolite, or prodrug thereof for treating influenza and a pharmaceutical composition containing same.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: March 24, 2020
    Assignee: TaiGen Biotechnology Co., Ltd.
    Inventors: Chu-Chung Lin, Hung-Chuan Chen, Chiayn Chiang, Chi-Feng Yen, Ming-Chu Hsu
  • Publication number: 20190224198
    Abstract: Provided is a compound of Formula (I) below, or a pharmaceutically acceptable salt, metabolite, or prodrug thereof: wherein: A1 is CR4 or N; A2 is CR5R6 or NR7; A3 is CR5?R6? or NR7?; each of R1, R2, R2?, R3, R3?, R4, R5, R5?, R6, R6?, R7, and R7?, independently, is hydrogen, deuterium, halogen, cyano, hydroxyl, carboxyl, amino, formyl, nitro, C1-6 alkyl, C2-6 alkenyl, C2-6 alkynyl, C1-6 alkoxy, C2-6 alkenyloxy, C1-6 alkylcarbonyl, C1-6 alkyloxycarbonyl, C1-6 alkylamine, C3-20 carbocyclyl, or C3-20 heterocyclyl; or R5 and R6, R5? and R6?, or R5 and R5?, together with the adjacent atom to which they are each attached, form C3-10 carbocyclyl or C3-10 heterocyclyl. Further provided are a method of using the above-described compound, or the pharmaceutically acceptable salt, metabolite, or prodrug thereof for treating influenza and a pharmaceutical composition containing same.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 25, 2019
    Inventors: Chu-Chung Lin, Hung-Chuan Chen, Chiayn Chiang, Chi-Feng Yen, Ming-Chu Hsu
  • Publication number: 20190098747
    Abstract: A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 28, 2019
    Inventors: Duen-Yi HO, Hung-Chuan CHEN, Shang-Pin CHEN
  • Patent number: 9622385
    Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: April 11, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Wei Hsu, Hung-Chuan Chen
  • Patent number: 9568624
    Abstract: A method for predicting electromagnetic radiation characteristics, a computer-readable recording medium and a simulator are provided. The method includes the steps of obtaining a plurality of first radiation currents in an equivalent circuit model of an electronic component, calculating a radiation resistance according to the first radiation currents, inserting the radiation resistance into the equivalent circuit model, and then obtaining a plurality of second radiation currents in the equivalent circuit model, and predicting electromagnetic radiation characteristics of the electronic component according to the second radiation currents.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: February 14, 2017
    Assignee: National Taiwan University
    Inventors: Tzong-Lin Wu, Hung-Chuan Chen
  • Publication number: 20160192515
    Abstract: A circuit board assembly includes a casing, a first circuit board, a second circuit board, plural connectors and at least one fastening element. The casing includes plural openings and at least one first coupling part. The first circuit board includes at least one second coupling part. The second circuit board includes at least one conductive part. The plural connectors are partially penetrated through the corresponding openings and electrically connected with the second circuit board. The second circuit board is assembled with the casing through the plural connectors. The conductive part of the second circuit board is electrically connected with the first circuit board, and the second circuit board is perpendicular to the first circuit board. The first coupling part of the casing and the second coupling part of the first circuit board are connected with each other through the fastening element.
    Type: Application
    Filed: July 17, 2015
    Publication date: June 30, 2016
    Inventors: Hung-Chuan Chen, Sheng-Yao Jiang, Kuo-Hua Lin
  • Publication number: 20160170047
    Abstract: A method for predicting electromagnetic radiation characteristics, a computer-readable recording medium and a simulator are provided. The method includes the steps of obtaining a plurality of first radiation currents in an equivalent circuit model of an electronic component, calculating a radiation resistance according to the first radiation currents, inserting the radiation resistance into the equivalent circuit model, and then obtaining a plurality of second radiation currents in the equivalent circuit model, and predicting electromagnetic radiation characteristics of the electronic component according to the second radiation currents.
    Type: Application
    Filed: January 21, 2015
    Publication date: June 16, 2016
    Inventors: Tzong-Lin Wu, Hung-Chuan Chen
  • Publication number: 20160014927
    Abstract: In a heat dissipating module and a method of combining the heat dissipating module, the heat dissipating module includes a circuit board, a heat generating component, a heat dissipating element, and a surface mount layer. The circuit board has a through hole, and the heat generating component is corresponsive to the through hole and installed on the circuit board, and the heat dissipating element has a protruding embedding portion formed on the other side of the circuit board and embedded into the through hole. The surface mount layer is formed on a surface of the circuit board and the internal periphery of the through hole, and the heat generating component and heat dissipating element are combined with both surfaces of the circuit board respectively, and the heat generating component and the embedding portion are contacted with each other through the surface mount layer.
    Type: Application
    Filed: September 11, 2014
    Publication date: January 14, 2016
    Inventors: Hung-Chuan CHEN, Shih-Ching LIAO
  • Patent number: 9210828
    Abstract: A power supply device structure includes a casing with a front panel and an insertion port formed on the front panel, an elastic plate installed on an internal side of the casing, and a pull handle with an end pivoted to the casing by a first pivot and the other end pivoted to the movable end of the elastic plate by a second pivot. Both ends of the elastic plate are a fixed end and a movable end respectively, and the fixed end is disposed on an internal side of the casing, and the movable end is protruded from the front panel. A portion of the pull handle is bent into a U-shaped clamp portion which is corresponsive to the insertion port, and the pull handle is pivoted by the first and second pivots, such that the clamp portion is situated at an external side of the insertion port.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: December 8, 2015
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Ching Liao, Hung-Chuan Chen
  • Publication number: 20150208544
    Abstract: A power supply device structure includes a casing with a front panel and an insertion port formed on the front panel, an elastic plate installed on an internal side of the casing, and a pull handle with an end pivoted to the casing by a first pivot and the other end pivoted to the movable end of the elastic plate by a second pivot. Both ends of the elastic plate are a fixed end and a movable end respectively, and the fixed end is disposed on an internal side of the casing, and the movable end is protruded from the front panel. A portion of the pull handle is bent into a U-shaped clamp portion which is corresponsive to the insertion port, and the pull handle is pivoted by the first and second pivots, such that the clamp portion is situated at an external side of the insertion port.
    Type: Application
    Filed: May 19, 2014
    Publication date: July 23, 2015
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Shih-Ching LIAO, Hung-Chuan CHEN
  • Publication number: 20150181765
    Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.
    Type: Application
    Filed: May 13, 2014
    Publication date: June 25, 2015
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Wei Hsu, Hung-Chuan Chen
  • Publication number: 20140254104
    Abstract: A heat dissipating module comprises at least one substrate and a heat dissipating layer. The substrate has a first surface and a second surface. The heat dissipating layer is disposed on the second surface. At least one heat generating device is electrically connected to the first surface, and the heat dissipating module is disposed on a main board uprightly. The heat dissipating module is advantageous for shortening the manufacturing time, raising the efficiency of automated production, decreasing the assembling cost and further achieving high heat dissipating efficiency.
    Type: Application
    Filed: August 26, 2013
    Publication date: September 11, 2014
    Applicant: Delta Electronics, Inc.
    Inventors: Hung-Chuan CHEN, Cheng-Wei HSU
  • Publication number: 20130279117
    Abstract: A heat dissipating structure includes a heat dissipating element, a first insulating element, a second insulating element, an electronic element and at least one fixing element. The first insulating element is disposed on one side of the heat dissipating element, while the second insulating element is disposed on another side of the heat dissipating element. The electronic element is disposed on the first insulating element. The fixing element fixes the electronic element on the heat dissipating element.
    Type: Application
    Filed: March 29, 2013
    Publication date: October 24, 2013
    Applicant: DELTA ELECTRONICS, INC.
    Inventor: Hung-Chuan CHEN
  • Patent number: 8059396
    Abstract: The present invention is related to a removable electronic device with handle structure suitable for an electronic apparatus, including a housing having an accommodating trough, a handle structure, an elastic engaging device, and an engaging component corresponding to the elastic engaging device, wherein the handle structure is pivotally mounted on and received in the accommodating trough through an engagement between the elastic engaging device and the engaging component.
    Type: Grant
    Filed: January 7, 2009
    Date of Patent: November 15, 2011
    Assignee: Delta Electronics, Inc.
    Inventors: Hung-Chuan Chen, Chih-Chi Wu
  • Patent number: 7972163
    Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body.
    Type: Grant
    Filed: June 23, 2009
    Date of Patent: July 5, 2011
    Assignee: Delta Electronics, Inc.
    Inventors: Hung-Chuan Chen, Chin-Hsing Lin, Hung-Chang Hsieh
  • Publication number: 20110155422
    Abstract: There is disclosed a wire insulating terminal which includes a wire insulating terminal member having an inner insulating wall and an outer insulating wall, and at least one conducting wire having a bared wire end. The inner insulating wall forms a perforation channel with a first opening and a second opening which are respectively disposed on the two opposite ends of the perforation channel to accommodate the at least one conducting wire with the bared wire end partially protruding out from the second opening. The outer insulating wall includes a first connecting member and a second connecting member which are configured to be corresponsive to and engageable with each other.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 30, 2011
    Applicant: DELTA ELECTRONICS, INC.
    Inventor: Hung-Chuan Chen
  • Patent number: 7901242
    Abstract: A power supply apparatus includes a power converting circuit and a modular power connection interface. By the power converting circuit, an input voltage is converted into several output voltages required for powering corresponding electronic devices. The modular power connection interface includes an output member and a connecting member. The output member includes a plurality of pins and a daughter board. The pins are arranged on at least one surface of the daughter board and electrically connected to the power converting circuit so as to transmit the output voltages. The connecting member has a first connecting part and multiple second connecting parts. The first connecting part is electrically connected with the pins of the output member, and the second connecting parts are electrically connected with corresponding electronic devices, so that the output voltages are transmitted from the power converting circuit to the electronic devices through the modular power connection interface.
    Type: Grant
    Filed: October 2, 2008
    Date of Patent: March 8, 2011
    Assignee: Delta Electronics, Inc.
    Inventor: Hung-Chuan Chen
  • Patent number: 7780481
    Abstract: A power supply apparatus includes a main body, a power input device, a first power output device and a second power output device. The first power output device includes a first cable and a first connector. The first cable is connected to a first surface of the first connector and includes at least a stop block and at least a fastening element. The second power output device includes a second cable and a second connector. The second cable is connected to a first surface of the second connector and includes an extension part and a retaining wall. An edge of the retaining wall is confined by the stop block and the extension part is clamped by the fastening element so as to selectively combine the first connector with the second connector as a composite connector assembly and facilitate securely fixing the composite connector assembly in a common power socket.
    Type: Grant
    Filed: December 4, 2007
    Date of Patent: August 24, 2010
    Assignee: Delta Electronics, Inc.
    Inventors: Hung-Chuan Chen, Hung-Chang Hsieh