Patents by Inventor Hung-Chuan Chen

Hung-Chuan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11996375
    Abstract: An integrated circuit structure is provided. The integrated circuit structure includes a die that contains a substrate, an interconnection structure, active connectors and dummy connectors. The interconnection structure is disposed over the substrate. The active connectors and the dummy connectors are disposed over the interconnection structure. The active connectors are electrically connected to the interconnection structure, and the dummy connectors are electrically insulated from the interconnection structure.
    Type: Grant
    Filed: February 22, 2023
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Chao Mao, Chin-Chuan Chang, Szu-Wei Lu, Kun-Tong Tsai, Hung-Chih Chen
  • Publication number: 20240101527
    Abstract: A compound of Formula (I) below, or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof: in which R1, R2, R3, R5, R6, and R7 are defined as in the SUMMARY section. Further disclosed are a method of using the above-described compound, salt, stereoisomer, solvate, or prodrug for treating microbial infections and a pharmaceutical composition containing the same.
    Type: Application
    Filed: October 23, 2020
    Publication date: March 28, 2024
    Applicant: TAIGEN BIOTECHNOLOGY CO., LTD.
    Inventors: Chu-Chung Lin, Hung-Chuan Chen, Chiayn Chiang, Chih-Ming Chen
  • Publication number: 20240018149
    Abstract: This disclosure relates to bivalent compounds (e.g., bi-functional small molecule compounds), compositions comprising one or more of the bivalent compounds, and to methods of use the bivalent compounds for the degrading target proteins associated with a disease or condition.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 18, 2024
    Inventors: Chu-Chiang LIN, Hung-Chuan CHEN, Pei-Chin Xizhou, Chih-Chang CHOU
  • Publication number: 20220238446
    Abstract: A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Applicant: MediaTek Inc.
    Inventors: Po-Hao CHANG, Yi-Jou Lin, Hung-Chuan Chen
  • Patent number: 11342267
    Abstract: A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: May 24, 2022
    Assignee: MediaTek Inc.
    Inventors: Po-Hao Chang, Yi-Jou Lin, Hung-Chuan Chen
  • Patent number: 10932358
    Abstract: A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: February 23, 2021
    Assignee: MediaTek Inc.
    Inventors: Duen-Yi Ho, Hung-Chuan Chen, Shang-Pin Chen
  • Publication number: 20200168548
    Abstract: A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.
    Type: Application
    Filed: October 23, 2019
    Publication date: May 28, 2020
    Inventors: Po-Hao CHANG, Yi-Jou LIN, Hung-Chuan CHEN
  • Patent number: 10596171
    Abstract: Provided is a compound of Formula (I) below, or a pharmaceutically acceptable salt, metabolite, or prodrug thereof: wherein: A1 is CR4 or N; A2 is CR5R6 or NR7; A3 is CR5?R6? or NR7?; each of R1, R2, R2?, R3, R3?, R4, R5, R5?, R6, R6?, R7, and R7?, independently, is hydrogen, deuterium, halogen, cyano, hydroxyl, carboxyl, amino, formyl, nitro, C1-6 alkyl, C2-6 alkenyl, C2-6 alkynyl, C1-6 alkoxy, C2-6 alkenyloxy, C1-6 alkylcarbonyl, C1-6 alkyloxycarbonyl, C1-6 alkylamine, C3-20 carbocyclyl, or C3-20 heterocyclyl; or R5 and R6, R5? and R6?, or R5 and R5?, together with the adjacent atom to which they are each attached, form C3-10 carbocyclyl or C3-10 heterocyclyl. Further provided are a method of using the above-described compound, or the pharmaceutically acceptable salt, metabolite, or prodrug thereof for treating influenza and a pharmaceutical composition containing same.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: March 24, 2020
    Assignee: TaiGen Biotechnology Co., Ltd.
    Inventors: Chu-Chung Lin, Hung-Chuan Chen, Chiayn Chiang, Chi-Feng Yen, Ming-Chu Hsu
  • Publication number: 20190224198
    Abstract: Provided is a compound of Formula (I) below, or a pharmaceutically acceptable salt, metabolite, or prodrug thereof: wherein: A1 is CR4 or N; A2 is CR5R6 or NR7; A3 is CR5?R6? or NR7?; each of R1, R2, R2?, R3, R3?, R4, R5, R5?, R6, R6?, R7, and R7?, independently, is hydrogen, deuterium, halogen, cyano, hydroxyl, carboxyl, amino, formyl, nitro, C1-6 alkyl, C2-6 alkenyl, C2-6 alkynyl, C1-6 alkoxy, C2-6 alkenyloxy, C1-6 alkylcarbonyl, C1-6 alkyloxycarbonyl, C1-6 alkylamine, C3-20 carbocyclyl, or C3-20 heterocyclyl; or R5 and R6, R5? and R6?, or R5 and R5?, together with the adjacent atom to which they are each attached, form C3-10 carbocyclyl or C3-10 heterocyclyl. Further provided are a method of using the above-described compound, or the pharmaceutically acceptable salt, metabolite, or prodrug thereof for treating influenza and a pharmaceutical composition containing same.
    Type: Application
    Filed: January 18, 2019
    Publication date: July 25, 2019
    Inventors: Chu-Chung Lin, Hung-Chuan Chen, Chiayn Chiang, Chi-Feng Yen, Ming-Chu Hsu
  • Publication number: 20190098747
    Abstract: A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 28, 2019
    Inventors: Duen-Yi HO, Hung-Chuan CHEN, Shang-Pin CHEN
  • Patent number: 9622385
    Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.
    Type: Grant
    Filed: May 13, 2014
    Date of Patent: April 11, 2017
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Wei Hsu, Hung-Chuan Chen
  • Patent number: 9568624
    Abstract: A method for predicting electromagnetic radiation characteristics, a computer-readable recording medium and a simulator are provided. The method includes the steps of obtaining a plurality of first radiation currents in an equivalent circuit model of an electronic component, calculating a radiation resistance according to the first radiation currents, inserting the radiation resistance into the equivalent circuit model, and then obtaining a plurality of second radiation currents in the equivalent circuit model, and predicting electromagnetic radiation characteristics of the electronic component according to the second radiation currents.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: February 14, 2017
    Assignee: National Taiwan University
    Inventors: Tzong-Lin Wu, Hung-Chuan Chen
  • Publication number: 20160192515
    Abstract: A circuit board assembly includes a casing, a first circuit board, a second circuit board, plural connectors and at least one fastening element. The casing includes plural openings and at least one first coupling part. The first circuit board includes at least one second coupling part. The second circuit board includes at least one conductive part. The plural connectors are partially penetrated through the corresponding openings and electrically connected with the second circuit board. The second circuit board is assembled with the casing through the plural connectors. The conductive part of the second circuit board is electrically connected with the first circuit board, and the second circuit board is perpendicular to the first circuit board. The first coupling part of the casing and the second coupling part of the first circuit board are connected with each other through the fastening element.
    Type: Application
    Filed: July 17, 2015
    Publication date: June 30, 2016
    Inventors: Hung-Chuan Chen, Sheng-Yao Jiang, Kuo-Hua Lin
  • Publication number: 20160170047
    Abstract: A method for predicting electromagnetic radiation characteristics, a computer-readable recording medium and a simulator are provided. The method includes the steps of obtaining a plurality of first radiation currents in an equivalent circuit model of an electronic component, calculating a radiation resistance according to the first radiation currents, inserting the radiation resistance into the equivalent circuit model, and then obtaining a plurality of second radiation currents in the equivalent circuit model, and predicting electromagnetic radiation characteristics of the electronic component according to the second radiation currents.
    Type: Application
    Filed: January 21, 2015
    Publication date: June 16, 2016
    Inventors: Tzong-Lin Wu, Hung-Chuan Chen
  • Publication number: 20160014927
    Abstract: In a heat dissipating module and a method of combining the heat dissipating module, the heat dissipating module includes a circuit board, a heat generating component, a heat dissipating element, and a surface mount layer. The circuit board has a through hole, and the heat generating component is corresponsive to the through hole and installed on the circuit board, and the heat dissipating element has a protruding embedding portion formed on the other side of the circuit board and embedded into the through hole. The surface mount layer is formed on a surface of the circuit board and the internal periphery of the through hole, and the heat generating component and heat dissipating element are combined with both surfaces of the circuit board respectively, and the heat generating component and the embedding portion are contacted with each other through the surface mount layer.
    Type: Application
    Filed: September 11, 2014
    Publication date: January 14, 2016
    Inventors: Hung-Chuan CHEN, Shih-Ching LIAO
  • Patent number: 9210828
    Abstract: A power supply device structure includes a casing with a front panel and an insertion port formed on the front panel, an elastic plate installed on an internal side of the casing, and a pull handle with an end pivoted to the casing by a first pivot and the other end pivoted to the movable end of the elastic plate by a second pivot. Both ends of the elastic plate are a fixed end and a movable end respectively, and the fixed end is disposed on an internal side of the casing, and the movable end is protruded from the front panel. A portion of the pull handle is bent into a U-shaped clamp portion which is corresponsive to the insertion port, and the pull handle is pivoted by the first and second pivots, such that the clamp portion is situated at an external side of the insertion port.
    Type: Grant
    Filed: May 19, 2014
    Date of Patent: December 8, 2015
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Shih-Ching Liao, Hung-Chuan Chen
  • Publication number: 20150208544
    Abstract: A power supply device structure includes a casing with a front panel and an insertion port formed on the front panel, an elastic plate installed on an internal side of the casing, and a pull handle with an end pivoted to the casing by a first pivot and the other end pivoted to the movable end of the elastic plate by a second pivot. Both ends of the elastic plate are a fixed end and a movable end respectively, and the fixed end is disposed on an internal side of the casing, and the movable end is protruded from the front panel. A portion of the pull handle is bent into a U-shaped clamp portion which is corresponsive to the insertion port, and the pull handle is pivoted by the first and second pivots, such that the clamp portion is situated at an external side of the insertion port.
    Type: Application
    Filed: May 19, 2014
    Publication date: July 23, 2015
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Shih-Ching LIAO, Hung-Chuan CHEN
  • Publication number: 20150181765
    Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.
    Type: Application
    Filed: May 13, 2014
    Publication date: June 25, 2015
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Cheng-Wei Hsu, Hung-Chuan Chen
  • Publication number: 20140254104
    Abstract: A heat dissipating module comprises at least one substrate and a heat dissipating layer. The substrate has a first surface and a second surface. The heat dissipating layer is disposed on the second surface. At least one heat generating device is electrically connected to the first surface, and the heat dissipating module is disposed on a main board uprightly. The heat dissipating module is advantageous for shortening the manufacturing time, raising the efficiency of automated production, decreasing the assembling cost and further achieving high heat dissipating efficiency.
    Type: Application
    Filed: August 26, 2013
    Publication date: September 11, 2014
    Applicant: Delta Electronics, Inc.
    Inventors: Hung-Chuan CHEN, Cheng-Wei HSU
  • Patent number: D1024932
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: April 30, 2024
    Assignee: WALSIN LIHWA CORPORATION
    Inventors: Ko-Ming Chen, Shih-Hsiang Wang, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin, Chien-Chung Ni, Chun-Ying Lin