Abstract: A compound of Formula (I) below, or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof: in which R1, R2, R3, R5, R6, and R7 are defined as in the SUMMARY section. Further disclosed are a method of using the above-described compound, salt, stereoisomer, solvate, or prodrug for treating microbial infections and a pharmaceutical composition containing the same.

Abstract: This disclosure relates to bivalent compounds (e.g., bi-functional small molecule compounds), compositions comprising one or more of the bivalent compounds, and to methods of use the bivalent compounds for the degrading target proteins associated with a disease or condition.

Abstract: A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.

Abstract: A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.

Abstract: A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.

Abstract: A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the second edge of the first semiconductor die, a fourth edge opposite the third edge, and a second metal layer exposed from the third edge. The first metal layer of the first semiconductor die is electrically connected to the second metal layer of the second semiconductor die.

Abstract: Provided is a compound of Formula (I) below, or a pharmaceutically acceptable salt, metabolite, or prodrug thereof: wherein: A1 is CR4 or N; A2 is CR5R6 or NR7; A3 is CR5?R6? or NR7?; each of R1, R2, R2?, R3, R3?, R4, R5, R5?, R6, R6?, R7, and R7?, independently, is hydrogen, deuterium, halogen, cyano, hydroxyl, carboxyl, amino, formyl, nitro, C1-6 alkyl, C2-6 alkenyl, C2-6 alkynyl, C1-6 alkoxy, C2-6 alkenyloxy, C1-6 alkylcarbonyl, C1-6 alkyloxycarbonyl, C1-6 alkylamine, C3-20 carbocyclyl, or C3-20 heterocyclyl; or R5 and R6, R5? and R6?, or R5 and R5?, together with the adjacent atom to which they are each attached, form C3-10 carbocyclyl or C3-10 heterocyclyl. Further provided are a method of using the above-described compound, or the pharmaceutically acceptable salt, metabolite, or prodrug thereof for treating influenza and a pharmaceutical composition containing same.

Abstract: Provided is a compound of Formula (I) below, or a pharmaceutically acceptable salt, metabolite, or prodrug thereof: wherein: A1 is CR4 or N; A2 is CR5R6 or NR7; A3 is CR5?R6? or NR7?; each of R1, R2, R2?, R3, R3?, R4, R5, R5?, R6, R6?, R7, and R7?, independently, is hydrogen, deuterium, halogen, cyano, hydroxyl, carboxyl, amino, formyl, nitro, C1-6 alkyl, C2-6 alkenyl, C2-6 alkynyl, C1-6 alkoxy, C2-6 alkenyloxy, C1-6 alkylcarbonyl, C1-6 alkyloxycarbonyl, C1-6 alkylamine, C3-20 carbocyclyl, or C3-20 heterocyclyl; or R5 and R6, R5? and R6?, or R5 and R5?, together with the adjacent atom to which they are each attached, form C3-10 carbocyclyl or C3-10 heterocyclyl. Further provided are a method of using the above-described compound, or the pharmaceutically acceptable salt, metabolite, or prodrug thereof for treating influenza and a pharmaceutical composition containing same.

Abstract: A semiconductor device includes a substrate, a die and multiple conductive traces. The die is mounted on the substrate. The conductive traces are routed on the substrate and connected to the die. The conductive traces at least include a plurality of first conductive traces and a plurality of second conductive traces. The second conductive traces are coupled to a predetermined voltage for providing a shielding pattern. The first conductive traces and the second conductive traces are disposed on the substrate in a substantially interlaced pattern.

Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.

Abstract: A method for predicting electromagnetic radiation characteristics, a computer-readable recording medium and a simulator are provided. The method includes the steps of obtaining a plurality of first radiation currents in an equivalent circuit model of an electronic component, calculating a radiation resistance according to the first radiation currents, inserting the radiation resistance into the equivalent circuit model, and then obtaining a plurality of second radiation currents in the equivalent circuit model, and predicting electromagnetic radiation characteristics of the electronic component according to the second radiation currents.

Abstract: A circuit board assembly includes a casing, a first circuit board, a second circuit board, plural connectors and at least one fastening element. The casing includes plural openings and at least one first coupling part. The first circuit board includes at least one second coupling part. The second circuit board includes at least one conductive part. The plural connectors are partially penetrated through the corresponding openings and electrically connected with the second circuit board. The second circuit board is assembled with the casing through the plural connectors. The conductive part of the second circuit board is electrically connected with the first circuit board, and the second circuit board is perpendicular to the first circuit board. The first coupling part of the casing and the second coupling part of the first circuit board are connected with each other through the fastening element.

Abstract: A method for predicting electromagnetic radiation characteristics, a computer-readable recording medium and a simulator are provided. The method includes the steps of obtaining a plurality of first radiation currents in an equivalent circuit model of an electronic component, calculating a radiation resistance according to the first radiation currents, inserting the radiation resistance into the equivalent circuit model, and then obtaining a plurality of second radiation currents in the equivalent circuit model, and predicting electromagnetic radiation characteristics of the electronic component according to the second radiation currents.

Abstract: In a heat dissipating module and a method of combining the heat dissipating module, the heat dissipating module includes a circuit board, a heat generating component, a heat dissipating element, and a surface mount layer. The circuit board has a through hole, and the heat generating component is corresponsive to the through hole and installed on the circuit board, and the heat dissipating element has a protruding embedding portion formed on the other side of the circuit board and embedded into the through hole. The surface mount layer is formed on a surface of the circuit board and the internal periphery of the through hole, and the heat generating component and heat dissipating element are combined with both surfaces of the circuit board respectively, and the heat generating component and the embedding portion are contacted with each other through the surface mount layer.

Abstract: A power supply device structure includes a casing with a front panel and an insertion port formed on the front panel, an elastic plate installed on an internal side of the casing, and a pull handle with an end pivoted to the casing by a first pivot and the other end pivoted to the movable end of the elastic plate by a second pivot. Both ends of the elastic plate are a fixed end and a movable end respectively, and the fixed end is disposed on an internal side of the casing, and the movable end is protruded from the front panel. A portion of the pull handle is bent into a U-shaped clamp portion which is corresponsive to the insertion port, and the pull handle is pivoted by the first and second pivots, such that the clamp portion is situated at an external side of the insertion port.

Abstract: A power supply device structure includes a casing with a front panel and an insertion port formed on the front panel, an elastic plate installed on an internal side of the casing, and a pull handle with an end pivoted to the casing by a first pivot and the other end pivoted to the movable end of the elastic plate by a second pivot. Both ends of the elastic plate are a fixed end and a movable end respectively, and the fixed end is disposed on an internal side of the casing, and the movable end is protruded from the front panel. A portion of the pull handle is bent into a U-shaped clamp portion which is corresponsive to the insertion port, and the pull handle is pivoted by the first and second pivots, such that the clamp portion is situated at an external side of the insertion port.

Abstract: A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.

Abstract: A heat dissipating module comprises at least one substrate and a heat dissipating layer. The substrate has a first surface and a second surface. The heat dissipating layer is disposed on the second surface. At least one heat generating device is electrically connected to the first surface, and the heat dissipating module is disposed on a main board uprightly. The heat dissipating module is advantageous for shortening the manufacturing time, raising the efficiency of automated production, decreasing the assembling cost and further achieving high heat dissipating efficiency.

Abstract: A heat dissipating structure includes a heat dissipating element, a first insulating element, a second insulating element, an electronic element and at least one fixing element. The first insulating element is disposed on one side of the heat dissipating element, while the second insulating element is disposed on another side of the heat dissipating element. The electronic element is disposed on the first insulating element. The fixing element fixes the electronic element on the heat dissipating element.