Abstract: The present invention is related to a removable electronic device with handle structure suitable for an electronic apparatus, including a housing having an accommodating trough, a handle structure, an elastic engaging device, and an engaging component corresponding to the elastic engaging device, wherein the handle structure is pivotally mounted on and received in the accommodating trough through an engagement between the elastic engaging device and the engaging component.

Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body.

Abstract: There is disclosed a wire insulating terminal which includes a wire insulating terminal member having an inner insulating wall and an outer insulating wall, and at least one conducting wire having a bared wire end. The inner insulating wall forms a perforation channel with a first opening and a second opening which are respectively disposed on the two opposite ends of the perforation channel to accommodate the at least one conducting wire with the bared wire end partially protruding out from the second opening. The outer insulating wall includes a first connecting member and a second connecting member which are configured to be corresponsive to and engageable with each other.

Abstract: A power supply apparatus includes a power converting circuit and a modular power connection interface. By the power converting circuit, an input voltage is converted into several output voltages required for powering corresponding electronic devices. The modular power connection interface includes an output member and a connecting member. The output member includes a plurality of pins and a daughter board. The pins are arranged on at least one surface of the daughter board and electrically connected to the power converting circuit so as to transmit the output voltages. The connecting member has a first connecting part and multiple second connecting parts. The first connecting part is electrically connected with the pins of the output member, and the second connecting parts are electrically connected with corresponding electronic devices, so that the output voltages are transmitted from the power converting circuit to the electronic devices through the modular power connection interface.

Abstract: A power supply apparatus includes a main body, a power input device, a first power output device and a second power output device. The first power output device includes a first cable and a first connector. The first cable is connected to a first surface of the first connector and includes at least a stop block and at least a fastening element. The second power output device includes a second cable and a second connector. The second cable is connected to a first surface of the second connector and includes an extension part and a retaining wall. An edge of the retaining wall is confined by the stop block and the extension part is clamped by the fastening element so as to selectively combine the first connector with the second connector as a composite connector assembly and facilitate securely fixing the composite connector assembly in a common power socket.

Abstract: The present invention provides a case assembly structure of an electronic device. The case assembly structure includes a first case, a second case and a heat-dissipating element. The first case has an engaging hole and a first opening. The second case has an engaging element engaged with the engaging hole of the first case and a second opening aligned with the first opening of the first case. The heat-dissipating element includes a fastening hole aligned with the first opening of the first case and the second opening of the second case. The first case, the second case and the heat-dissipating element are combined together by penetrating a fastening element through the first opening, the second opening and the fastening hole.

Abstract: The present invention is related to a removable electronic device with handle structure suitable for an electronic apparatus, including a housing having an accommodating trough, a handle structure, an elastic engaging device, and an engaging component corresponding to the elastic engaging device, wherein the handle structure is pivotally mounted on and received in the accommodating trough through an engagement between the elastic engaging device and the engaging component.

Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body includes a receiving part. The receiving part is arranged at a front edge of the isolation body and has a first engaging element. The latching mechanism has a second engaging element engaged with the first engaging element, so that the latching mechanism is fixed onto the isolation body.

Abstract: A power supply apparatus includes a power converting circuit and a modular power connection interface. By the power converting circuit, an input voltage is converted into several output voltages required for powering corresponding electronic devices. The modular power connection interface includes an output member and a connecting member. The output member includes a plurality of pins and a daughter board. The pins are arranged on at least one surface of the daughter board and electrically connected to the power converting circuit so as to transmit the output voltages. The connecting member has a first connecting part and multiple second connecting parts. The first connecting part is electrically connected with the pins of the output member, and the second connecting parts are electrically connected with corresponding electronic devices, so that the output voltages are transmitted from the power converting circuit to the electronic devices through the modular power connection interface.

Abstract: The present invention provides a case assembly structure of an electronic device. The case assembly structure includes a first case, a second case and a heat-dissipating element. The first case has an engaging hole and a first opening. The second case has an engaging element engaged with the engaging hole of the first case and a second opening aligned with the first opening of the first case. The heat-dissipating element includes a fastening hole aligned with the first opening of the first case and the second opening of the second case. The first case, the second case and the heat-dissipating element are combined together by penetrating a fastening element through the first opening, the second opening and the fastening hole.

Abstract: This invention relates to the compounds of formula (I) shown below. Each variable in formula (I) is defined in the specification. These compounds can be used to treat a kinesin Eg5 protein-mediated disorder.

Abstract: A flat cable assembly includes a plurality of power cables and a bonding medium. The plurality of power cables are parallel with each other, wherein every two adjacent power cables are separated from each other. The bonding medium is used for boding every two adjacent power cables together, thereby cooperatively forming the flat cable assembly having a first surface and a second surface. A first gap is formed between the first surface and the bonding medium and a second gap is formed between the second surface and the bonding medium.

Abstract: This invention relates to the compounds of formula (I) shown below. Each variable in formula (I) is defined in the specification. These compounds can be used to treat a kinesin Eg5 protein-mediated disorder.

Abstract: A power supply apparatus includes a main body, a power input device, a first power output device and a second power output device. The first power output device includes a first cable and a first connector. The first cable is connected to a first surface of the first connector and includes at least a stop block and at least a fastening element. The second power output device includes a second cable and a second connector. The second cable is connected to a first surface of the second connector and includes an extension part and a retaining wall. An edge of the retaining wall is confined by the stop block and the extension part is clamped by the fastening element so as to selectively combine the first connector with the second connector as a composite connector assembly and facilitate securely fixing the composite connector assembly in a common power socket.

Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body has a specified side including a first portion, a second portion and an indentation. The second portion is higher than the first portion. The indentation is formed in the first portion and the second portion. The latching mechanism has an end fixed onto the second portion and extended above a bottom surface of the indentation, wherein the latching mechanism includes at least a fastening part.

Abstract: An electrical connector includes a plurality of pins, an isolation body and a latching mechanism. The isolation body has a specified side including a first portion, a second portion and an indentation. The second portion is higher than the first portion. The indentation is formed in the first portion and the second portion. The latching mechanism has an end fixed onto the second portion and extended above a bottom surface of the indentation, wherein the latching mechanism includes at least a fastening part.

Abstract: The invention provides a method of making a transistor. A gate dielectric layer is formed on a semiconductor substrate. A gate is formed on the dielectric layer, the gate having an exposed upper surface and exposed side surfaces. A first silicon nitride layer having a first thickness is deposited over the gate, for example over an oxide layer on the gate, at a first deposition rate. A second silicon nitride layer having a second thickness is deposited over the first silicon nitride layer at a second deposition rate, the second thickness being more that the first thickness and the second deposition rate being more than the first deposition rate. The first silicon nitrogen layer then has a lower hydrogen concentration. At least the second silicon nitride layer (or a silicon oxide layer in the case of an ONO spacer) is etched to leave spacers next to the side surfaces while exposing the upper surface of the gate and areas of the substrate outside the spacers.

Abstract: In a method of forming silicon nitride on a substrate, a substrate is provided in a reaction chamber and a nitrogen-containing gas is introduced into the chamber so that a portion of the nitrogen-containing gas is chemically adsorbed on the substrate surface. Thereafter, the reaction chamber is pumped down to remove the nitrogen-containing gas. A silicon-containing gas is introduced into the reaction chamber to react with the adsorbed nitrogen-containing gas to form a silicon nitride layer on the substrate. Thereafter, the silicon-containing gas may be removed and the cycle repeated to deposit additional silicon nitride layers on the substrate.

Abstract: In a method of forming silicon nitride on a substrate, a substrate is provided in a reaction chamber and a nitrogen-containing gas is introduced into the chamber so that a portion of the nitrogen-containing gas is chemically adsorbed on the substrate surface. Thereafter, the reaction chamber is pumped down to remove the nitrogen-containing gas. A silicon-containing gas is introduced into the reaction chamber to react with the adsorbed nitrogen-containing gas to form a silicon nitride layer on the substrate. Thereafter, the silicon-containing gas may be removed and the cycle repeated to deposit additional silicon nitride layers on the substrate.

Abstract: A short period of low power plasma-activated process is imposed after film-forming to remove residual chemical compound. This method includes flowing one or more carrier gases with one or more reaction gases into the chamber, reducing plasma power to react the residual chemical compound with the reaction gases, and pumping to evacuate reaction product from the reaction chamber. The reduced plasma can be achieved by increasing gap spacing at a constant power or gradient power. Alternatively, it can be obtained by keeping the same spacing as the main process with a small power source.