Abstract: A computer system is employed to manage semiconductor manufacturing cases. After receiving a log-in signal of a user, the computer system opens a case related to a manufacturing process according to an order from the user. Contents, procedures or adjusted results of the manufacturing process is then recorded in the case to form a response report of the case. Finally, after receiving a confirmation message and a signature information related to the response report of the case from the user, the computer system stores the response report of the case and closes the case.

Abstract: A method for analyzing final test parameters includes the following steps: To retrieve the final test parameters of each product lots by searching a database. To compare the final test parameters to select a representative final test parameter and a representative final test item. To determine if the representative final test item is correlated to a packaging process step. To classify the plurality of product lots into at least a first qualified group and a first failed group according to the representative final test item if there is correlation. To search for the equipment through which the first qualified group or the first failed group had passed in the packaging process step. To determine the equipment having a probability of having processed the first failed group being greater than a probability of having processed the first qualified group.

Abstract: The claimed invention method is for analyzing defect inspection parameters. The method includes searching for the defect inspection parameters of a plurality of lots of products from a database, classifying the plurality of lots of products into at least a qualified group and a failed group according to the defect inspection parameters, searching for a process step correlated to a defect inspection item from the database, searching for manufacturing equipment through which the qualified group has passed in the process step and the manufacturing equipment through which the failed group has passed in the process step, and determining the manufacturing equipment through which the probability that the failed group having passed which is greater than that of the qualified group.

Abstract: An automatic intelligent yield improving and process parameter multivariate analysis system and the analysis method thereof. The system is applied to a computer to set up analysis procedures for analyzing process parameters obtained from each measuring machine in semiconductor testing process by utilizing data mining technology. The system includes a plurality of semiconductor processing nodes having different functions. The system links each of the semiconductor processing node to another semiconductor processing node by a logic means so that the computer can process the semiconductor processing nodes sequentially. The system also links the semiconductor processing nodes by a data connection means to allow microprocessors to load necessary parameter data or wafer lot numbers from corresponding semiconductor processing nodes by a data connection means.