Abstract: The present disclosure generally relates to a dual free layer two dimensional magnetic recording read head. The read head comprises a first lower shield, a first sensor disposed over the first lower shield, a first upper shield disposed over the first sensor, a read separation gap (RSG) disposed on the first upper shield, a second lower shield disposed over the RSG, a second sensor disposed over the second lower shield, and a second upper shield disposed over the second sensor. In some embodiments, the second lower shield comprises a CoFeHf layer. In another embodiment, the second lower shield is a synthetic antiferromagnetic multilayer comprising a first shield layer, a second shield layer, and a CoFe/Ru/CoFe anti-ferromagnetic coupling layer or a Ru layer disposed therebetween, the first and second shield layers comprising NiFe and CoFe. In yet another embodiment, the second lower shield comprises layers of Ru, IrMn, and NiFe.

Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer and a second semiconductor layer; a first reflective layer formed on the first semiconductor layer and including a plurality of vias; a plurality of contact structures respectively filled in the vias and electrically connected to the first semiconductor layer; a second reflective layer including metal material formed on the first reflective layer and contacting the contact structures; a plurality of conductive vias surrounded by the semiconductor stack; a connecting layer formed in the conductive vias and electrically connected to the second semiconductor layer; a first pad portion electrically connected to the second semiconductor layer; and a second pad portion electrically connected to the first semiconductor layer, wherein a shortest distance between two of the conductive vias is larger than a shortest distance between the first pad portion and the second pad portion.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a die, an underfill layer, a patterned dielectric layer and a plurality of conductive terminals. The die has a front surface and a back surface opposite to the front surface. The underfill layer encapsulates the die, wherein a surface of the underfill layer and the back surface of the die are substantially coplanar to one another. The patterned dielectric layer is disposed on the back surface of the die. The conductive terminals are disposed on and in contact with a surface of the patterned dielectric layer and partially embedded in the patterned dielectric layer to be in contact with the die, wherein a portion of the surface of the patterned dielectric layer that directly under each of the conductive terminals is substantially parallel with the back surface of the die.

Abstract: Various proposed schemes pertaining to extreme high-throughput (EHT) preamble designs for transmissions to mixed clients in wireless communications are described. In one example, an aggregated Physical Layer Convergence Procedure (PLCP) protocol data unit (PPDU), which is transmitted over a plurality of 80-MHz bandwidths with data for a plurality of stations (STAs), is received. A preamble of a specific one of the plurality of 80-MHz bandwidths is then decoded.

Abstract: A slider may include a first side-edge surface, a second side-edge surface, and an air-bearing surface (ABS) comprising: a first side cavity adjacent to the first side-edge surface, and a first island side blocker situated at a mouth of the first side cavity, wherein: a first outer surface of the first island side blocker forms a portion of the first side-edge surface, a second outer surface of the first island side blocker is recessed from the first side-edge surface, a first side opening is situated on a leading side of the first island side blocker, and a second side opening is situated on a trailing side of the first island side blocker.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: In an embodiment, a method includes: attaching a package component to a package substrate, the package component includes: a first die being disposed over an interposer; a second die being disposed over the interposer and laterally adjacent to the first die; and an encapsulant being disposed around the first die and the second die; attaching a thermal interface material to the first die and the second die; and attaching a lid structure to the package substrate, the lid structure includes: a lid cap being disposed over the thermal interface material; and a plurality of lid feet connecting the lid cap to the package substrate, in a plan view the plurality of lid feet forming a discontinuous loop around the package component.

Abstract: The present disclosure generally relates to a dual free layer (DFL) read head and methods of forming thereof. In one embodiment, a method of forming a DFL read head comprises depositing a DFL sensor, defining a stripe height of the DFL sensor, depositing a rear bias (RB) adjacent to the DFL sensor, defining a track width of the DFL sensor and the RB, and depositing synthetic antiferromagnetic (SAF) soft bias (SB) side shields adjacent to the DFL sensor. In another embodiment, a method of forming a DFL read head comprises depositing a DFL sensor, defining a track width of the DFL sensor, depositing SAF SB side shields adjacent to the DFL sensor, defining a stripe height of the DFL sensor and the SAF SB side shield, depositing a RB adjacent to the DFL sensor and the SAF SB side shield, and defining a track width of the RB.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.

Abstract: A bicycle front derailleur is provided, including: a base, configured to be mounted to a bicycle frame; a linkage mechanism, including a connection portion configured to be connected with a cable, the linkage mechanism being swingably connected to the base; a chain guide, swingably connected to the linkage mechanism; and an adjustment assembly, disposed on the base, including a holder movably disposed on the base and an adjustment member, the holder being configured to be connected with a sheath for driving the cable, the adjustment member being movably disposed on the base and adjustable to drive the holder to move relative to the base.

Abstract: A rear derailleur is provided, including: a base, configured to be mounted to a bicycle; a linkage assembly, connected to the base; a movable member, rotatably connected to the linkage assembly; a chain guide, rotatably connected to the movable member by an axle assembly; a biasing member, located between the movable member and the chain guide, positioned to the movable member and the chain guide; a resistance mechanism, connected to the movable member; and a cap member, covering the resistance mechanism and driving the resistance mechanism, rotatably positionable in either of a first position and a second position, wherein when the cap member is positioned in the first position, the resistance mechanism provides a first resistance, and when the cap member is positioned in the second position, the resistance mechanism provides a second resistance which is different from the first resistance.

Abstract: A rear derailleur is provided, including: a base, configured to be mounted to a bicycle; a linkage assembly, connected to the base; a movable member, rotatably connected to the linkage assembly; a chain guide, rotatably connected to the movable member by an axle assembly; a biasing member, located between the movable member and the chain guide, positioned to the movable member and the chain guide; a resistance mechanism, connected to the movable member; and a cap member, covering the resistance mechanism and driving the resistance mechanism, rotatably positionable in either of a first position and a second position, wherein when the cap member is positioned in the first position, the resistance mechanism provides a first resistance, and when the cap member is positioned in the second position, the resistance mechanism provides a second resistance which is different from the first resistance.

Abstract: A rear derailleur is provided, including: a base, configured to be mounted to a bicycle; a movable member, movably disposed on the base; a shaft, rotatably connected to the movable member; a chain guide, connected to the shaft; a biasing member, disposed between the chain guide and the movable member; a resistance mechanism, connected to the movable member to apply frictional resistance to the shaft.

Abstract: A bicycle operating device includes a main body, a speed shafting unit, a brake lever, a fluid pressure generating assembly, a first operation assembly and a second operation assembly. The speed shafting unit is disposed on the main body and includes a reel and a shaft. The reel is disposed on the shaft. The brake lever is rotatably connected to the main body. The fluid pressure generating assembly is disposed on the main body and includes a cylinder, a piston assembly and a reservoir. The reservoir is located above the cylinder.

Abstract: A bicycle front derailleur is provided, including: a base, configured to be mounted to a bicycle frame; a linkage mechanism, including a connection portion configured to be connected with a cable, the linkage mechanism being swingably connected to the base; a chain guide, swingably connected to the linkage mechanism; and an adjustment assembly, disposed on the base, including a holder movably disposed on the base and an adjustment member, the holder being configured to be connected with a sheath for driving the cable, the adjustment member being movably disposed on the base and adjustable to drive the holder to move relative to the base.

Abstract: A multi-stage amplifier circuit includes: a front stage amplification circuit, for generating a front stage amplification signal according to a difference between a primary reference signal and a primary feedback signal; an output adjustment circuit, for generating a driving signal according to the front stage amplification signal; and an output transistor, controlled by the driving signal to generate an output signal. The output adjustment circuit includes: an adjustment transistor biased by a differential current of the front stage amplification signal; and an impedance adjustment device biased by the differential current. A resistance of the impedance adjustment device is determined by a difference between an adjustment feedback signal and an adjustment reference signal. The driving signal is determined by a product of a resistance of the impedance adjustment device multiplied by the differential current of the front stage amplification signal, and a drain-source voltage of the adjustment transistor.

Abstract: An impedance-tracking circuit includes a voltage divider, a first dynamic resistor, and a first amplifier. The voltage divider divides a voltage difference between a first voltage and a second voltage to generate a divided voltage. The first dynamic resistor has a first resistance value and is coupled between the first voltage and a third voltage. The first dynamic resistor adjusts the first resistance value according to a first control signal. The first amplifier compares the divided voltage with the third voltage to generate the first control signal.

Abstract: A manufacturing method of an integrated driving module with energy conversion function includes providing a carrier board and forming an integrated electromagnetic induction component layer having a first dielectric layer, a plurality of conductive coil layers and a plurality of conductive connecting components on a surface of the carrier board. A patterned conductive circuit layer is formed on the integrated electromagnetic induction component layer, and electrically connecting to each other through the conductive connecting components. An embedded electrical component is patterned on the patterned conductive circuit layer. A conductive component is disposed on the patterned conductive circuit layer. Thereafter, the method forms a second dielectric layer to cover the embedded electrical component and the conductive component and removes the carrier board to form a plurality of integrated driving modules.

Abstract: A multi-stage amplifier circuit includes a pre-stage amplifier circuit and a floating control circuit. The pre-stage amplifier circuit amplifies a voltage difference between its input terminals, to generate plural pre-stage transconductance currents flowing through corresponding plural pre-stage transconductance nodes. The floating control circuit includes: a floating reference transistor configured as a source follower and a floating amplifier. The floating amplifier and the floating reference transistor are coupled to form feedback control and to generate an upper driving signal and a lower driving signal according to a floating reference level in the floating control circuit. The upper driving signal is higher than the lower driving signal with a predetermined voltage difference. The floating control circuit is electrically connected to the plural pre-stage transconductance nodes and is floating in common mode relative to the pre-stage transconductance nodes.

Abstract: A parallel input and dynamic cascaded OTA (operational transconductance amplifier includes: plural sub-OTAs which generate corresponding plural transconductance output currents according to corresponding plural differential input voltages; and at least one cascading capacitor which is cascaded between a first sub-OTA and a second sub-OTA. A second transconductance output current generated by the second sub-OTA is coupled through the cascading capacitor to generate a transient bias current on a common mode bias node of the first sub-OTA, thus providing the transient bias current to a differential pair circuit of the first sub-OTA in a case when a transient variation occurs in the differential input voltage corresponding to the first sub-OTA, so that a loop bandwidth and a response speed during a transient state are enhanced.