Abstract: A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion.

Abstract: A device of triggering and generating temperature coefficient current for generating a temperature coefficient current includes a positive temperature coefficient current generating unit, for generating a first positive temperature coefficient current, a negative temperature coefficient current generating unit, for generating a first negative temperature coefficient current, and a triggering unit, for triggering to generate the temperature coefficient current according to a triggering temperature and a current difference between the first positive temperature coefficient current and the first negative temperature coefficient current.

Abstract: A voltage converting device with a self-reference feature for an electronic system includes a differential current generating module, implemented in a Complementary metal-oxide-semiconductor (CMOS) processing for generating a differential current pair according to a converting voltage; and a voltage converting module, coupled to the differential current generating module, a first supply voltage and a second supply voltage of the electronic system for generating the converting voltage according to the differential current pair, the first supply voltage and the second supply voltage.

Abstract: A printed circuit board includes a first, second, and third dielectric layers, and a first, second, and third trace layers. The first trace layer and the second trace layer are formed on opposite surfaces of the first dielectric layer. The second dielectric layer is formed on the second trace layer, a first blind hole is defined in the first surface and terminated at a position in the first dielectric layer, a first conductive via is formed in the first blind hole. A second blind hole is formed in the second dielectric layer and the first dielectric layer. A second conductive via is formed in the second blind hole. The third trace layer is electrically connected with the second conductive via. The first trace layer is electrically connected with the second trace layer through the first conductive via and the second conductive via.

Abstract: A method for manufacturing a part-embedded circuit structure includes: forming an inner resist layer with an opening on a base member to expose a portion of the base member; forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer; laminating a dielectric layer on the inner wiring layer; forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; and removing the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed.

Abstract: A current source for quickly adjusting an output current includes a constant current generation module, coupled to a control node, for generating a predefined current flowing through the control node in order to determine a voltage of the control node; a capacitor, coupled to an output terminal of the current source; a current variation detection module, coupled between the control node and the capacitor, for generating a variation on the voltage of the control node via the capacitor when the output terminal of the current source receives an instant current variation; and a trans-conductance amplifier, coupled between the control node and the output terminal, for changing a magnitude of the output current of the output terminal when the variation on the voltage of the control node is generated.

Abstract: The present invention discloses a bandgap reference circuit. The bandgap reference circuit includes an operational transconductance amplifier, and a reference generation circuit. The operational transconductance amplifier includes a self-biased operational transconductance amplifier, for utilizing an area difference between bipolar junction transistors of an input pair to generate a first positive temperature coefficient current to bias the input pair, and generating a positive temperature coefficient control voltage and a negative temperature coefficient control voltage; and a feedback voltage amplifier, for amplifying the negative temperature coefficient control voltage, and outputting a reference voltage to the input pair for feedback, to generate a first negative temperature coefficient current. The reference generation circuit generates a summation voltage or a summation current according to the positive temperature coefficient control voltage and the negative temperature coefficient control voltage.

Abstract: Methods and apparatus for a carbon ion source head. An ionization chamber is configured to receive a process gas containing carbon and a noble carrier gas; a cathode is disposed in the ionization chamber and configured to emit electrons in thermionic emission; a graphite coating is provided on at least a portion of the cathode; and an outlet on the ionization chamber is configured to output carbon ions. A method for ion implantation of carbon is disclosed. Additional alternative embodiments are disclosed.

Abstract: A fast response current source capable of providing an output current is disclosed. The fast response current source includes a constant current generating block, a first feedback capacitor, a first current buffer and a first output current generating block. The constant current generating block provides a first constant current. The first current buffer generates a first buffering current to flow through the first feedback terminal, and changes a current value of the first buffering current in response to the current variation at the first feedback terminal when the voltage at the output terminal is varied. The first output current generating block generates a first output current to flow through the output terminal, and changes a current value of the first output current in response to the variation of the first buffering current when the voltage at the output terminal is varied.

Abstract: A printed circuit board includes a base, a circuit pattern, a solder mask, an activated metal layer, a plurality of metal seed layers, and a plurality of metal bumps. The conductive circuit pattern is formed on the base, to include a plurality of conductive pads. The solder mask is formed on a surface of the conductive circuit pattern and portions of the base are exposed from the circuit pattern. The solder mask includes blind vias corresponding to the pads, and laser-activated catalyst. The activated metal layer is obtained by laser irradiation at the wall of the blind via. The activated metal layer is in contact with the solder mask. The metal seed layer is formed on the activated metal layer and the pads. Each metal bump is formed on the metal seed layer, and each metal bump protrudes from the solder mask.

Abstract: A multi-power domain operational amplifier includes an input stage circuit, a power domain transforming circuit and an active load. The input stage circuit is configured to transform a set of input voltages into a set of input currents in a first power domain. The power domain transforming circuit is configured to transform the set of input currents into a set of output currents in a second power domain. The active load is configured to generate an output voltage according to the set of output currents. A common mode range of the output voltage is shifted as compared with a common mode range of the set of input voltages.

Abstract: A multi-power domain operational amplifier includes an input stage circuit, a power domain transforming circuit and an active load. The input stage circuit is configured to transform a set of input voltages into a set of input currents in a first power domain. The power domain transforming circuit is configured to transform the set of input currents into a set of output currents in a second power domain. The active load is configured to generate an output voltage according to the set of output currents. A common mode range of the output voltage is shifted as compared with a common mode range of the set of input voltages.

Abstract: A connecting mechanism of adjusting an angle of a first module relative to a second module of an electronic device is disclosed in the present invention. The connecting mechanism includes a hinge assembly disposed on the second module, a rod disposed on the hinge assembly and pivoting to the first module, a torsional spring disposed between the rod and the hinge assembly, and a damper assembly disposed on the rod and sheathed by the torsional spring. The hinge assembly includes a first hinge installed inside the second module, and a second hinge slidably disposed on the first hinge. The torsional spring drives the rod to rotate relative to the second hinge from a first position to a second position, so that the first module can stand on the second module. The damper assembly can be for absorbing a vibration generated from the rod.

Abstract: A coin hopper includes a coin-dispensing unit including a hopper defining a coin outlet, a rotating disk, a power drive, a sensor module and a circuit module for dispensing coins having different thicknesses, and a coin-delivering presser mounted in the hopper and including an elastic member and a float rotatably supported on the elastic member for pressing on one thick coin or thin coin in the rotating disk, enabling the coins to be individually and smoothly delivered to the coin outlet for dispensing and avoiding a coin stuck problem.

Abstract: A multi-power domain operational amplifier includes an input stage circuit, a power domain transforming circuit and an active load. The input stage circuit is configured to transform a set of input voltages into a set of input currents in a first power domain. The power domain transforming circuit is configured to transform the set of input currents into a set of output currents in a second power domain. The active load is configured to generate an output voltage according to the set of output currents. A common mode range of the output voltage is shifted as compared with a common mode range of the set of input voltages.

Abstract: A voltage converting device with a self-reference feature for an electronic system includes a differential current generating module, implemented in a Complementary metal-oxide-semiconductor (CMOS) processing for generating a differential current pair according to a converting voltage; and a voltage converting module, coupled to the differential current generating module, a first supply voltage and a second supply voltage of the electronic system for generating the converting voltage according to the differential current pair, the first supply voltage and the second supply voltage.

Abstract: A compensation module for a voltage regulation device having a gain stage, an output stage and a miller compensation module includes a low-output-impedance non-inverting amplifier unit coupled to a gain output of the gain stage and an output-stage input of the output stage.

Abstract: A high throughput system for warming a wafer to a desired temperature after undergoing a low-temperature implantation process includes an implantation chamber, a wafer warming chamber configured to uniformly warm a single wafer, and a plurality of robotic arms to transfer wafers throughout the system. At each stage in the fabrication process, the robotic arms simultaneously work with multiple wafers and, therefore, the system provides a high throughput process. Also, the warming chamber may be a vacuum environment, thus eliminating the mist-condensation problem that results in wafer spotting.

Abstract: A coin acceptor includes a coin acceptor main unit including a first holder shell and second holder shell pivotally coupled together, and a face panel including a panel body fastened to the front side of the first holder shell and a limiter mechanism mounted at the back side of the panel body and adjustable between a constraint position and a release position to control the biasing angle of the second holder shell relative to the first holder shell, preventing an evil person from inserting a screwdriver, pry or any other tool through a coin insertion slot or coin-return slot of the face panel into the inside of the coin acceptor main unit to damage the internal structure.

Abstract: Methods and apparatus for a carbon ion source head. An ionization chamber is configured to receive a process gas containing carbon and a noble carrier gas; a cathode is disposed in the ionization chamber and configured to emit electrons in thermionic emission; a graphite coating is provided on at least a portion of the cathode; and an outlet on the ionization chamber is configured to output carbon ions. A method for ion implantation of carbon is disclosed. Additional alternative embodiments are disclosed.