Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.

Abstract: Meta-optic systems are described that include multi-function metasurfaces formed from a plurality of meta-atoms. A multi-function metasurface can exhibit two or more different optical functions for two or more different states of light incident on the metasurface. Different states of light include different polarizations, different wavelengths, and different angles of incidence. Different optical functions include distance sensing, converging, diverging, image formation, and patterned light formation. The multi-function metasurface can selectively impart different phase profiles to an incident beam depending on the incident beam's state of light.

Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

Abstract: An optical pattern projection device includes a light emitter or light emitter array and one or more flat optics layers configured to project and split light beams from the light emitters to generate a projected light pattern including multiple sub-patterns each corresponding to one of the light emitters. The flat optics layers may include a single optical metasurface containing superposed beam shaping and/or projection phase profile and a beam splitting phase profile. Alternatively, the flat optics layers may include two optical metasurfaces each containing a light shaping and/or projection phase profile, which together produce a linear relationship between light emitter position and corresponding beam projection angle, and one or both of the metasurfaces further contains a superposed beam splitting phase profile. The light shaping and/or projection phase profile may have a function similar to a micro-lens array. A structured light camera combining optical pattern projection and detection is also provided.

Abstract: System for free-space light coupling between 2-dimensional light transmitter and receiver arrays using flat optics. The system includes: a transmitter array configured to emit one or more light beams; a first flat optic configured to receive the light beams from the transmitter array and generate one or more intermediate light beams; a first spacer disposed between the light transmitter array and the first flat optic; a receiver array; a second flat optic configured to receive the intermediate light beams and generate one or more output light beams toward the receiver array; and a second spacer disposed between the second flat optic and the light receiver array. The TX and RX portions of the light coupling system may be used in LiDAR systems as the light emitter (beam steerer) and detector, respectively. The flat optics are configured to provide a wide field of view for the LiDAR.

Abstract: A method for forming a memory includes: providing a substrate, a plurality of discrete bit line structures being located on the substrate, and an area surrounded by the adjacent bit line structures and the substrate and having a central axis; forming, on the substrate, a first conductive film filling an area between the adjacent bit line structures; etching the first conductive film by a first etching process to form a first conductive layer; forming a second conductive film on the top surface of the first conductive layer; and etching the second conductive film and the first conductive layer by a second etching process, the remaining second conductive film and the first conductive layer forming a capacitive contact window.

Abstract: A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.

Abstract: A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.

Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Abstract: The present technology is related to optics, optical systems, and optically induced micro-/nano-fabrication methods. It includes metasurface optics, direct laser writing, and microscopy. Flat optic devices, architectures, and methods can achieve superb optical performance and structural simplicity compared to traditional bulk optical systems.

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Abstract: A method for forming a memory includes: providing a substrate, a plurality of discrete bit line structures being located on the substrate, and an area surrounded by the adjacent bit line structures and the substrate and having a central axis; forming, on the substrate, a first conductive film filling an area between the adjacent bit line structures; etching the first conductive film by a first etching process to form a first conductive layer; forming a second conductive film on the top surface of the first conductive layer; and etching the second conductive film and the first conductive layer by a second etching process, the remaining second conductive film and the first conductive layer forming a capacitive contact window.

Abstract: A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

Abstract: A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Abstract: A multi-function handle for Information Handling System (IHS) chassis is described. In some embodiments, a chassis may include a sled configured to be installed in a rack; a drawer configured to slide in and out of the sled; and a front panel comprising a handle and a selector, the selector configured to allow a user to selectively pull from the rack using the handle: (i) the drawer without the sled, or (ii) the sled and the drawer. A method may include accessing a chassis installed in a rack, the chassis comprising: (i) a drawer configured to slide in and out of a sled; and (ii) a front panel having a handle and a selector; determining that the selector is in a first position; and pulling the handle to slide the drawer without the sled outward from the rack.

Abstract: A floating apparatus for fixing a membrane cable coupled to a fan gantry within an information handling system is disclosed. The floating apparatus includes a flange member with a horizontal planar portion and a vertical planar portion. The vertical planar portion is configured for insertion into an edge connector and includes and an overhang on the anterior side of the vertical planar portion most distal to the horizontal planar portion. The flange member is further configured to attach to a membrane cable and is connected to support members, which allow the floating apparatus to move in a plurality of alignment positions.

Abstract: A floating apparatus for fixing a membrane cable coupled to a fan gantry within an information handling system is disclosed. The floating apparatus includes a flange member with a horizontal planar portion and a vertical planar portion. The vertical planar portion is configured for insertion into an edge connector and includes and an overhang on the anterior side of the vertical planar portion most distal to the horizontal planar portion. The flange member is further configured to attach to a membrane cable and is connected to support members, which allow the floating apparatus to move in a plurality of alignment positions.