Abstract: A semiconductor device includes a first memory array, a first bit line, a second memory array, a second bit line, a first conductive line and a first control circuit. The first bit line crosses over and is coupled to the first memory array, and extends along a first direction. The second bit line crosses over the second memory array, and is coupled to the first bit line. The first conductive line crosses over the second memory array and a part of the first memory array, and is configured to operate as a part of a first capacitor. The first control circuit is configured to couple the first conductive line to the second bit line when the first memory array is written.

Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.

Abstract: A write assist circuit can include a control circuit and a voltage generator. The control circuit can be configured to receive memory address information associated with a memory write operation for memory cells. The voltage generator can be configured to provide a reference voltage to one or more bitlines coupled to the memory cells. The voltage generator can include two capacitive elements, where during the memory write operation, (i) one of the capacitive elements can be configured to couple the reference voltage to a first negative voltage, and (ii) based on the memory address information, both capacitive elements can be configured to cumulatively couple the reference voltage to a second negative voltage that is lower than the first negative voltage.

Abstract: A sample analyzing method and a sample preparing method are provided. The sample analyzing method includes a sample preparing step, a placing step, and an analyzing step. The sample preparing step includes an obtaining step implemented by obtaining an identification information; and a marking and placing step implemented by placing a sample carrying component having a sample disposed thereon into a marking equipment, allowing the marking equipment to utilize the identification information to form an identification structure on the sample carrying component, and placing the sample carrying component into one of the accommodating slots according to the identification information. The placing step is implemented by taking out the sample carrying component from one of the accommodating slots and placing the sample carrying component into an electron microscope equipment. The analyzing step is implemented by utilizing the electron microscope equipment to photograph the sample to generate an analyzation image.

Abstract: Disclosed herein are related to a memory system including unit storage circuits. In one aspect, each of the unit storage circuits abuts an adjacent one of the unit storage circuits. In one aspect, each of the unit storage circuits includes a first group of memory cells, a second group of memory cells, a first sub-word line driver to apply a first control signal to the first group of memory cells through a first sub-word line extending along a direction, and a second sub-word line driver to apply a second control signal to the second group of memory cells through a second sub-word line extending along the direction. In one aspect, the memory system includes a common word line driver abutting one of the unit storage circuits and configured to apply a common control signal to the unit storage circuits through a word line extending along the direction.

Abstract: The display system comprising a main control module and a display module is provided. The main control module comprises a display driving circuit and a timing control circuit. The display driving circuit is used to output a display driving signal. The timing control circuit is coupled to the display driving circuit to receive the display driving signal, and convert the display driving signal into a digital signal. The display module comprises a first display panel to an N-th display panel, coupled to the timing control circuit and receiving the digital signal, so as to display corresponding multimedia content according to the digital signal, wherein N is a positive integer greater than 1, and the main control module is independently coupled to the display module.

Abstract: A semiconductor device includes a first memory bank, a second memory bank and a first write driver. The first memory bank is coupled to a plurality of first data lines, and configured to operate according to a first data signal. The second memory bank is configured to operate according to the first data signal. The first write driver is disposed between the first memory bank and the second memory bank, and configured to adjust a voltage level of one of the plurality of first data lines when the first memory bank is written according to the first data signal.

Abstract: A manufacturing method of a sample collection component, by which a removable light shielding component is disposed on a main body of the sample collection component to shield at least a portion of the light that passes through a storing space of the sample collection component.

Abstract: An analysis system, an auxiliary analysis apparatus, and an analysis method are provided. The analysis method is used to perform a composition analysis operation on an analyte of a sample, and includes: a first heating step, a first mass spectrometry analysis step, a second heating step, a second mass spectrometry analysis step, and an analysis step. A heating device heats a non-analyzed area and a to-be-analyzed area of the sample in the first and the second heating step, respectively. In the first and the second mass spectrometry analysis step, gas generated after heating of the sample is guided into a gas chromatography-mass spectrometer, and two pieces of analysis data are correspondingly obtained. The analysis step is to compare the two pieces of analysis data and generate analysis result data. The analysis result data contains components of a composition that forms at least one portion of the analyte.

Abstract: A curve alignment method and apparatus are provided. In the method, data obtained by at least one equipment analyzing a test sample is retrieved to generate test curves. In response to an alignment operation of directing a first point around a first curve to a second point around a second curve among the test curves, a correspondence between features corresponding to the first and second points is recorded, and correspondences of alignment operations are collected as feature data. Data obtained by the equipment analyzing a current sample is retrieved to generate current curves, and a third point matching the first feature on a third curve and a fourth point matching the second feature on a fourth curve are searched according to the correspondences. At least one of the third curve and the fourth curve is adjusted to align the third point with the fourth point.

Abstract: A soldering quality inspection method and a soldering quality inspection apparatus are provided. The soldering quality inspection method includes: acquiring an inspection image; calculating, by a processing device, a dyed area percentage of an area of a part of a soldering region in the inspection image that is dyed by a dye ink relative to an area of the soldering region, and determining whether the dyed area percentage is greater than a predetermined dyed percentage. When the dyed area percentage is determined to be equal to or less than the predetermined dyed percentage, a position under inspection is determined to be of good soldering quality, and a corresponding inspection result information is generated. When the dyed area percentage is determined to be greater than the predetermined dyed percentage, the position under inspection is determined to be of poor soldering quality, and the corresponding inspection result information is generated.

Abstract: A sample analyzing method and a sample preparing method are provided. The sample analyzing method includes a sample preparing step, a placing step, and an analyzing step. The sample preparing step includes an obtaining step implemented by obtaining an identification information; and a marking and placing step implemented by placing a sample carrying component having a sample disposed thereon into a marking equipment, allowing the marking equipment to utilize the identification information to form an identification structure on the sample carrying component, and placing the sample carrying component into one of the accommodating slots according to the identification information. The placing step is implemented by taking out the sample carrying component from one of the accommodating slots and placing the sample carrying component into an electron microscope equipment. The analyzing step is implemented by utilizing the electron microscope equipment to photograph the sample to generate an analyzation image.

Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.

Abstract: A computing device rack for housing a computing device. The rack comprises a frame to which a computing device is mountable, a retaining member mounted to the frame, and the retaining member having a latch that is movable relative to the frame, and an actuator movably coupled to the frame and the retaining member. Movement of the actuator relative to the frame and the retaining member from a first position to a second position deforms the retaining member to move the latch from an initial position to a final position relative to the frame, and thereby engages or disengages with the computing device that is mounted on the frame for locking or unlocking, respectively.

Abstract: A sample carrier device including a single substrate, a penetration structure and a fixing structure is provided. The penetration structure is formed on a side of the substrate. The penetration structure has a fluid passage. The fixing structure is formed on a side of the penetration structure. The sample carrier device is divided into an end portion, an observation portion and an operation portion. The user can separate the observation portion from the end portion by operating the operation portion. After the observation portion is separated from the end portion, the user can inject the sample into the fluid passage through a port of the fluid passage exposed to the observation portion. Once the sample is carried by the fluid passage of the observation portion, the user can seal the port of the fluid passage and place the observation portion in an electron microscope device.

Abstract: A carrier device and a carrier kit are provided. The carrier kit includes the carrier device and a specimen carrier. The carrier device carries the specimen carrier and is configured to be fixedly disposed on a specimen holder. The specimen carrier has two observation grooves and a containing channel that is formed therein, and the two observation grooves are configured to expose a part of the containing channel. The carrier device has a containing groove that is recessed on a side of a main body and an observation port. When the specimen carrier is disposed in the containing groove, one of the observation grooves is exposed from the main body through the observation port. At least one limiting element is configured to limit a range of movement of the specimen carrier disposed in the containing groove relative to the main body.

Abstract: A carrier device and a carrier kit are provided. The carrier kit includes the carrier device and a specimen carrier. The carrier device carries the specimen carrier and is configured to be fixedly disposed on a specimen holder. The specimen carrier has two observation grooves and a containing channel that is formed therein, and the two observation grooves are configured to expose a part of the containing channel The carrier device has a containing groove that is recessed on a side of a main body and an observation port. When the specimen carrier is disposed in the containing groove, one of the observation grooves is exposed from the main body through the observation port. At least one limiting element is configured to limit a range of movement of the specimen carrier disposed in the containing groove relative to the main body.

Abstract: An electronic device is provided. The electronic device includes a controller, configured to receive an input image signal captured by a camera device, perform a codec process on the input image signal to generate a processed file. The controller is further configured to perform privacy detection on the input image signal or the processed file. In response to the input image signal or the processed file being detected to include privacy information, the controller is further configured to encrypt the processed file to generate an encrypted file.

Abstract: An object detection apparatus includes a boundary box decision circuit and a processing circuit. The boundary box decision circuit receives lens configuration information of a lens, and refers to the lens configuration information to determine a bounding box distribution of bounding boxes that are assigned to different detection distances with respect to the lens for detection of a target object. The processing circuit receives a captured image that is derived from an output of an image capture device using the lens, and performs object detection upon the captured image according to the bounding box distribution of the bounding boxes.

Abstract: An electronic device is provided. The electronic device includes a controller, configured to receive an input image signal captured by a camera device, perform a codec process on the input image signal to generate a processed file. The controller is further configured to perform privacy detection on the input image signal or the processed file. In response to the input image signal or the processed file being detected to include privacy information, the controller is further configured to encrypt the processed file to generate an encrypted file.