Patents by Inventor Hung-jen Chen

Hung-jen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150346347
    Abstract: A method for controlling a GNSS receiver includes: providing a state switching criterion; obtaining at least one positioning information; determining whether to switch from a first operation state to a second operation state according to the obtained positioning information and the state switching criterion, a power consumption of GNSS receiver operating under the first operation state and the second operation state is different; the obtained positioning information includes at least one of a speed value of GNSS receiver, a satellite distribution value of GNSS receiver, a satellite signal strength value of GNSS receiver, a location identification of GNSS receiver, instant motion information from a motion sensor, or location information from a WLAN device, a Bluetooth device or a UV light sensor.
    Type: Application
    Filed: March 18, 2015
    Publication date: December 3, 2015
    Inventors: Chung-Yen Tsai, Kung-Shuan Huang, Ching-Lung Fu, Hung-Jen Chen
  • Patent number: 9019158
    Abstract: A method for controlling a global navigation satellite system (GNSS) receiver operated in a first operation state includes: providing a state switching criterion; obtaining a positioning information; determining whether to switch from the first operation state to a second operation state according to the obtained positioning information and the state switching criterion, wherein the power consumption of the GNSS receiver operating under the first operation state and the second operation state is different.
    Type: Grant
    Filed: March 21, 2012
    Date of Patent: April 28, 2015
    Assignee: MediaTek Inc.
    Inventors: Chung-Yen Tsai, Kung-Shuan Huang, Ching-Lung Fu, Hung-Jen Chen
  • Publication number: 20140182097
    Abstract: A method for manufacturing a conductive fabric is undertaken via a fixing device which has a plurality of working sections. According to an arrangement of the conductive yarn disposed between a first flexible base and a second flexible base, the working sections of the fixing device are extended to form a plurality of fixing points and the other working sections are retracted without forming the fixing points, thereby fixing the conductive yarn between the first and second flexible bases with a dot-like spaced pattern to obtain conductive fabric products having different conductive yarn arrangements without replacing the fixing device.
    Type: Application
    Filed: March 4, 2014
    Publication date: July 3, 2014
    Applicant: Wai Tai Technology Co., Ltd.
    Inventor: Hung-Jen Chen
  • Patent number: 8687827
    Abstract: A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: April 1, 2014
    Assignee: Merry Electronics Co., Ltd.
    Inventors: Hung-Jen Chen, Kuan-Hsun Chiu, Chun-Chieh Wang, Ming-Li Hsu
  • Patent number: 8685191
    Abstract: A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.
    Type: Grant
    Filed: February 5, 2008
    Date of Patent: April 1, 2014
    Assignee: Compal Electronics, Inc.
    Inventors: Chen-Hua Liu, Ru-Jen Chiu, Bar-Long Denq, Hung-Jen Chen
  • Publication number: 20130322661
    Abstract: A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed. above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with. a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.
    Type: Application
    Filed: May 29, 2012
    Publication date: December 5, 2013
    Inventors: Hung-Jen CHEN, Kuan-Hsun Chiu, Chun-Chieh Wang, Min-Li Hsu
  • Publication number: 20130320465
    Abstract: A MEMS microphone module includes a first circuit board and a second circuit board attached to the first circuit board. A MEMS chip and an ASIC chip are respectively received in one of two concavities of the first circuit board. A first ground layer of the first circuit board and a second ground layer of the second circuit board are electrically coupled to each other to define a ground shielding structure. By this way, an EMI shielding can be applied by the ground shielding structure to the MEMS chip and the ASIC chip.
    Type: Application
    Filed: May 30, 2012
    Publication date: December 5, 2013
    Applicant: Merry Electronics Co., Ltd.
    Inventors: Chao-Ching HUANG, Ju-Mei Lu, Hung-Jen Chen, Kuan-Hsun Chiu
  • Publication number: 20130322662
    Abstract: A MEMS microphone module includes a substrate and a conducting lid covered on the substrate to define a chamber therebetween for accommodation of a MEMS chip and an ASIC chip. A ground layer of the substrate is electrically coupled to a protrusion of the conductive lid to form an EMI shielding structure. By this way, an EMI shielding effect can be applied by the EMI shielding structure to the MEMS chip and the ASIC chip.
    Type: Application
    Filed: June 1, 2012
    Publication date: December 5, 2013
    Applicant: MERRY ELECTRONICS CO., LTD.
    Inventors: Hung-Jen Chen, Chao-Ching Huang, Kuan-Hsun Chiu, Yung-Ta Chen, Xian-Gen Liao
  • Patent number: 8491825
    Abstract: The present invention provides to a method of producing fiber from tourmaline anion fiber; of which, polypropylene or polyethylene chip, TPE and submicrometer tourmaline particle are prepared and then rolled into submicrometer tourmaline agglomerate through granulation by double screw; then, take submicrometer tourmaline agglomerate and polypropylene or polyethylene chip, of which the content of tourmaline agglomerate accounts for 1˜10% of gross weight, and TPE for 1˜40% of gross weight; tourmaline agglomerate and polypropylene or polyethylene are melted into composite fiber or filter material via spinning, such that the fiber or filter material can yield anion and present outstanding gas permeability and mechanical property.
    Type: Grant
    Filed: January 26, 2010
    Date of Patent: July 23, 2013
    Assignee: Noveko Trading 2008 LLC
    Inventors: Ming-Fung Lin, Hung-Jen Chen, Chia-Jen Chen, Yung-Chien Chen, Chao-Mulan Chen
  • Publication number: 20130101143
    Abstract: A MEMS microphone chip with an expanded chamber comprises a base plate, and the base plate has a main chamber and a secondary chamber. The secondary chamber is formed beside the main chamber, and is connected to the main chamber. A vibration membrane is suspended above the main chamber for receiving external sound waves, and the vibration membrane vibrates in corresponding to the chambers. The MEMS microphone chip has a higher sensitivity because of the expanded chamber, and therefore has a more ideal audio frequency response curve.
    Type: Application
    Filed: October 21, 2011
    Publication date: April 25, 2013
    Inventors: Hung-Jen CHEN, Kuan-Hsun Chiu, Chun-Chieh Wang, Ming-Li Hsu
  • Publication number: 20130075835
    Abstract: A microelectromechanical microphone comprises a shell body, a microelectromechanical microphone chip and an integrated circuit. The shell body having a cavity and an opening, sound from outside enters into the cavity from the opening. The microelectromechanical microphone chip and the integrated circuit are disposed on a circuit layout inside the cavity. A filter is integrated with the microelectromechanical microphone chip at an appropriate location. Sound entered from the opening into the cavity is received by the microelectromechanical microphone chip, then the sound or audio signals are converted to electrical signals through the filter and the integrated circuit, to be transmitted to external electronic devices.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 28, 2013
    Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Hung-Jen CHEN, Kuan-Hsun CHIU, Ju-Mei LU, Ming-Li HSU, Chun-Chieh WANG
  • Publication number: 20120308037
    Abstract: A microelectromechanical microphone chip having a stereoscopic diaphragm structure includes a base, having a chamber; a diaphragm, disposed on the chamber and having steps with height differences; and a back plate, disposed on the diaphragm, forming a space with the diaphragm in between, and having a plurality of sound-holes communicating with the space.
    Type: Application
    Filed: June 3, 2011
    Publication date: December 6, 2012
    Inventors: Hung-Jen CHEN, Kuan-Hsun Chiu, Ming-Li Hsu, Xian-Gen Liao
  • Publication number: 20120308066
    Abstract: A combined MicroElectroMechanical Systems (MEMS) microphone includes a first substrate, a second substrate, a vibrating diaphragm, a backplate, and an accommodating slot. The first substrate has a first chamber, the vibrating diaphragm is disposed on the first chamber, the second substrate has a second chamber, one side of the backplate is disposed on the second chamber, and the other side of the backplate is disposed on the vibrating diaphragm, so that the second substrate is combined with the first substrate. In addition, the backplate has multiple sound holes, and the accommodating slot is disposed between the first substrate and the second substrate to form a space between the vibrating diaphragm and the backplate.
    Type: Application
    Filed: June 3, 2011
    Publication date: December 6, 2012
    Inventors: Hung-Jen CHEN, Kuan-Hsun Chiu, Kuo-Hsiang Li, Yung-Ta Chen
  • Publication number: 20120274509
    Abstract: A method for controlling a global navigation satellite system (GNSS) receiver operated in a first operation state includes: providing a state switching criterion; obtaining a positioning information; determining whether to switch from the first operation state to a second operation state according to the obtained positioning information and the state switching criterion, wherein the power consumption of the GNSS receiver operating under the first operation state and the second operation state is different.
    Type: Application
    Filed: March 21, 2012
    Publication date: November 1, 2012
    Inventors: Chung-Yen Tsai, Kung-Shuan Huang, Ching-Lung Fu, Hung-Jen Chen
  • Patent number: 8231968
    Abstract: The present invention provides to a method of producing fiber from tourmaline anion fiber; of which, polypropylene or polyethylene chip, TPE and submicrometer tourmaline particle are prepared and then rolled into submicrometer tourmaline agglomerate through granulation by double screw; then, take submicrometer tourmaline agglomerate and polypropylene or polyethylene chip, of which the content of tourmaline agglomerate accounts for 1˜10% of gross weight, and TPE for 1˜40% of gross weight; tourmaline agglomerate and polypropylene or polyethylene are melted into composite fiber or filter material via spinning, such that the fiber or filter material can yield anion and present outstanding gas permeability and mechanical property.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: July 31, 2012
    Assignee: Noveko Trading 2008 LLC
    Inventors: Ming-Fung Lin, Hung-Jen Chen, Chia-Jen Chen, Yung-Chien Chen, Chao-Mulan Chen
  • Publication number: 20120023718
    Abstract: A method for manufacturing a conductive fabric and products thereof mainly fastens a first soft base and a second soft base with a conductive yarn interposed between them with spaced dot-type fastening spots through a fastening means to facilitate fast production of the conductive fabric. The fastening means could be a needle punching apparatus to provide needle punching on an upper layer fabric and a lower layer fabric without hitting the conductive yarn interposed between them. Thus all three of them can be fastened with the spaced dot-type fastening spots. And the conductive fabric can be produced more efficiently.
    Type: Application
    Filed: October 14, 2011
    Publication date: February 2, 2012
    Applicant: Wai Tai Technology Co., Ltd.
    Inventor: Hung-Jen CHEN
  • Patent number: 8047780
    Abstract: An assembled fan frame suitable for a case body includes a framework, a plurality of first assemblies, a back slab, and a plurality of second assemblies. The framework includes a fixing slab, a first side wall and a second side wall facing each other, and an accommodation space is defined to accommodate at least one fan module. The fixing slab has at least one first vent and a plurality of first assembling holes which are disposed around the first vent. The first assembly is disposed through the first assembling hole and fastens the fan module on the fixing slab. The back slab is vertically mounted on a surface of the case body and faces the fixing slab. The back slab includes at least one second vent and a plurality of second assembling holes. The second assembly is disposed through the second assembling hole and detachably fixes the framework on the back slab.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: November 1, 2011
    Assignee: Inventec Corporation
    Inventors: Hung-Jen Chen, Hung-Jung Hsia
  • Publication number: 20110163918
    Abstract: An antenna device includes a main body. The main body has a first radiator which has a first radiating portion, a third radiating portion, a second radiating portion connected with the first radiating portion and the third radiating portion to show a door shape, a fourth radiating portion extended outwards from the third radiating portion, and a fifth radiating portion extended downwardly from the third radiating portion, and stretched towards the same side of the third radiating portion as the second radiating portion, and a second radiator extended toward the third radiating portion from the first radiating portion. A feeding portion and a grounding portion are extended downwards from the second radiator side by side. A resonance element has an elongated first resonating portion spaced from the main body, and a second resonating portion extended perpendicularly from an end of the first resonating portion away from the main body.
    Type: Application
    Filed: January 7, 2010
    Publication date: July 7, 2011
    Inventors: Yu-Yuan Wu, Hung-Jen Chen, Chung-Wen Yang
  • Patent number: 7965239
    Abstract: An antenna structure includes a low frequency radiator, a high frequency radiator, and a connecting element. The connecting element has a rear end and a front end opposite to the rear end. A feeding element and a grounding element are extended from the front end of the connecting element and arranged adjacent to each other. The low frequency radiator includes a substantially inverted-L shaped first radiating part extended from the rear end of the connecting element, a meander-like second radiating part extended frontward from a front end of the first radiating part, and a substantially lying U-shaped third radiating part with a rearward opening extended from a free end of the second radiating part. The high frequency radiator includes a first extension piece extended frontward from the front end of the connecting element and located under the second radiating part with space.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: June 21, 2011
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Chung-Wen Yang, Yu-Yuan Wu, Hung-Jen Chen
  • Patent number: 7939165
    Abstract: A protective film comprises a substrate and a semi-cured protective layer over the substrate. The semi-cured protective layer is formed by curing a liquid mixture consisting of a thermosetting resin and a radiation curing resin.
    Type: Grant
    Filed: March 3, 2008
    Date of Patent: May 10, 2011
    Assignee: Compal Electronics, Inc.
    Inventors: Ru-Jen Chiu, Chen-Hua Liu, Bar-Long Denq, Hung-Jen Chen