Patents by Inventor Hung-Lin Chang
Hung-Lin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180302992Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.Type: ApplicationFiled: June 21, 2018Publication date: October 18, 2018Applicant: Unimicron Technology Corp.Inventors: Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Cheng-Po Yu, Chi-Min Chang
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Patent number: 10051748Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.Type: GrantFiled: January 18, 2016Date of Patent: August 14, 2018Assignee: Unimicron Technology Corp.Inventors: Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Cheng-Po Yu, Chi-Min Chang
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Patent number: 10015835Abstract: Methods and apparatus are provided to reduce service interruption for intra-RAT and inter-RAT handover procedures. The UE performs a NAS signaling procedure via a NAS signaling connection in a mobile communication network. The UE monitors a radio resource status and determines whether a radio bearer has been or is being established for a RRC connection for data transmission. The UE determines whether to release the NAS signaling connection after completing the NAS signaling procedure based on whether the radio bearer has been established. In one embodiment, the UE monitors a radio resource status and determines whether a radio bearer has been established for a RRC connection for data transmission. The UE determines whether to start a timer upon completing the NAS signaling procedure based on whether the radio bearer has been or is being established.Type: GrantFiled: September 22, 2017Date of Patent: July 3, 2018Assignee: MEDIATEK INC.Inventors: Yu-Syuan Jheng, Chien-Chun Huang-Fu, Hung-Lin Chang, Yuan-Chieh Lin
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Publication number: 20180014349Abstract: Methods and apparatus are provided to reduce service interruption for intra-RAT and inter-RAT handover procedures. The UE performs a NAS signaling procedure via a NAS signaling connection in a mobile communication network. The UE monitors a radio resource status and determines whether a radio bearer has been or is being established for a RRC connection for data transmission. The UE determines whether to release the NAS signaling connection after completing the NAS signaling procedure based on whether the radio bearer has been established. In one embodiment, the UE monitors a radio resource status and determines whether a radio bearer has been established for a RRC connection for data transmission. The UE determines whether to start a timer upon completing the NAS signaling procedure based on whether the radio bearer has been or is being established.Type: ApplicationFiled: September 22, 2017Publication date: January 11, 2018Inventors: Yu-Syuan Jheng, Chien-Chun Huang-Fu, Hung-Lin Chang, Yuan-Chieh Lin
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Patent number: 9814090Abstract: Methods and apparatus are provided to reduce service interruption for intra-RAT and inter-RAT handover procedures. The UE performs a NAS signaling procedure via a NAS signaling connection in a mobile communication network. The UE monitors a radio resource status and determines whether a radio bearer has been or is being established for a RRC connection for data transmission. The UE determines whether to release the NAS signaling connection after completing the NAS signaling procedure based on whether the radio bearer has been established. In one embodiment, the UE monitors a radio resource status and determines whether a radio bearer has been established for a RRC connection for data transmission. The UE determines whether to start a timer upon completing the NAS signaling procedure based on whether the radio bearer has been or is being established.Type: GrantFiled: March 11, 2015Date of Patent: November 7, 2017Assignee: MEDIATEK INC.Inventors: Yu-Syuan Jheng, Chien-Chun Huang-Fu, Hung-Lin Chang, Yuan-Chieh Lin
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Publication number: 20170196095Abstract: A circuit board includes a core layer, at least one metal contraposition component and at least one build-up circuit structure. The metal contraposition component is disposed on the core layer. The build-up circuit structure is disposed on the core layer and covers the metal contraposition component by using a position of the metal contraposition component as a fiducial mark.Type: ApplicationFiled: March 1, 2016Publication date: July 6, 2017Inventors: Hung-Lin Chang, Chen-Wei Tseng
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Patent number: 9686866Abstract: A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.Type: GrantFiled: August 23, 2015Date of Patent: June 20, 2017Assignee: Unimicron Technology Corp.Inventors: Hung-Lin Chang, Ta-Han Lin
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Publication number: 20170164468Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.Type: ApplicationFiled: January 18, 2016Publication date: June 8, 2017Inventors: HUNG-LIN CHANG, MING-HAO WU, SYUN-SIAO CHANG, CHENG-PO YU, CHI-MIN CHANG
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Publication number: 20170142645Abstract: A communications apparatus includes a radio transceiver, a memory device and a processor. The radio transceiver transmits or receives wireless radio frequency signals to or from an air interface. The memory device stores a registration database including one or more sets of registration data. Each set of registration data corresponds to an International Mobile Subscriber Identity (IMSI). The processor determines whether performing a PLMN search procedure is required, and when performing a PLMN search procedure is required, the processor retrieves suitable registration data from the registration database according to a currently used IMSI and performs the PLMN search procedure via the radio transceiver based on the retrieved suitable registration data.Type: ApplicationFiled: October 27, 2016Publication date: May 18, 2017Inventors: Kun-Lin WU, Hung-Lin CHANG, Chih-Hung LEE, Yuh-Hwang YOU, Ming LEE, Yu-Cheng HUANG
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Publication number: 20170055349Abstract: A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. The electronic component is embedded in at least one of the dielectric layers and located in a disposition area. The electronic component is electrically connected to one of the patterned circuit layers through a portion of the conductive through holes. The connecting slot has a bottom portion, a plurality of sidewall portions connecting the bottom portion, and a plurality of connecting pads located on the sidewall portions. The circuit substrate is assembled to the bottom portion, and the circuit pads are electrically connected to the connecting pads through a bent area of the core layer that is bent relative to the disposition area.Type: ApplicationFiled: August 23, 2015Publication date: February 23, 2017Inventors: Hung-Lin Chang, Ta-Han Lin
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Publication number: 20150264741Abstract: Methods and apparatus are provided to reduce service interruption for intra-RAT and inter-RAT handover procedures. The UE performs a NAS signaling procedure via a NAS signaling connection in a mobile communication network. The UE monitors a radio resource status and determines whether a radio bearer has been or is being established for a RRC connection for data transmission. The UE determines whether to release the NAS signaling connection after completing the NAS signaling procedure based on whether the radio bearer has been established. In one embodiment, the UE monitors a radio resource status and determines whether a radio bearer has been established for a RRC connection for data transmission. The UE determines whether to start a timer upon completing the NAS signaling procedure based on whether the radio bearer has been or is being established.Type: ApplicationFiled: March 11, 2015Publication date: September 17, 2015Inventors: Yu-Syuan Jheng, Chien-Chun Huang-Fu, Hung-Lin Chang, Yuan-Chieh Lin
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Patent number: 8995989Abstract: A method of applying a network forbidden list for enhanced service recovery in mobile communication networks is provided. In a first embodiment, upon receiving an error cause for a RAT in a selected network, a UE stores a PLMN ID, the RAT information, and the error cause as an entry in the forbidden list. The UE will not select to the RAT of the network stored in the forbidden list until the PLMN/RAT entry is removed from the forbidden list. In a second embodiment, upon receiving an error cause in a selected network, a UE stores a PLMN ID, the error cause, and a timer value as an entry in the forbidden list. The UE will not select to the network stored in the forbidden list until the timer associated with the PLMN ID is expired.Type: GrantFiled: May 21, 2013Date of Patent: March 31, 2015Assignee: Mediatek Inc.Inventors: Yu-Syuan Jheng, Hung-Lin Chang
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Publication number: 20150053462Abstract: A wiring board structure adapted to carry a heat generating component is provided. The wiring board structure includes a core layer, an active cooler, a dielectric layer and a plurality of conductive vias. The core layer has a cavity penetrating through the core layer. The active cooler includes a cold surface and a hot surface. The active cooler is disposed in the cavity. The dielectric layer covers the core layer and fills a gap between the active cooler and the cavity. The heat-generating component is disposed on an outer surface of the dielectric layer. The conductive vias are disposed in the dielectric layer and connecting the cold surface and the outer surface to connect the heat-generating component and the active cooler. A wiring board structure having an active cooling via is also provided.Type: ApplicationFiled: October 25, 2013Publication date: February 26, 2015Applicant: Unimicron Technology Corp.Inventors: Ming-Hao Wu, Wei-Ming Cheng, Hung-Lin Chang
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Publication number: 20130316699Abstract: A method of applying a network forbidden list for enhanced service recovery in mobile communication networks is provided. In a first embodiment, upon receiving an error cause for a RAT in a selected network, a UE stores a PLMN ID, the RAT information, and the error cause as an entry in the forbidden list. The UE will not select to the RAT of the network stored in the forbidden list until the PLMN/RAT entry is removed from the forbidden list. In a second embodiment, upon receiving an error cause in a selected network, a UE stores a PLMN ID, the error cause, and a timer value as an entry in the forbidden list. The UE will not select to the network stored in the forbidden list until the timer associated with the PLMN ID is expired.Type: ApplicationFiled: May 21, 2013Publication date: November 28, 2013Applicant: MEDIATEK, INC.Inventors: Yu-Syuan Jheng, Hung-Lin Chang
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Patent number: 8296944Abstract: A method for manufacturing a printed circuit board includes the steps of: providing a base board having a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer.Type: GrantFiled: May 26, 2010Date of Patent: October 30, 2012Assignee: Unimicron Technology Corp.Inventors: Hung-Lin Chang, Chen-Chuan Chang
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Publication number: 20100299917Abstract: A method for manufacturing a printed circuit board is disclosed. The method comprises the steps of: providing a base board, wherein the base board comprises a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer.Type: ApplicationFiled: May 26, 2010Publication date: December 2, 2010Inventors: Hung-Lin Chang, Chen-Chuan Chang
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Publication number: 20090063733Abstract: The invention provides an input/output port (I/O port) switch structure of an electronic device. The electronic device comprises a motherboard, and an opening is installed on a predetermined position of the electronic device. The switch structure is installed on the motherboard of the electronic device and a corresponding opening is installed on a side of the electronic device. The I/O port switch structure comprises a base and an operation unit, wherein the base is electrically connected to the motherboard and is used for installing a plurality of I/O ports with different functions. The operation portion is connected to the base to let the base perform a rotating motion at a predetermined angle, and the user can therefore switch and use the required I/O port by operating switch elements.Type: ApplicationFiled: December 19, 2007Publication date: March 5, 2009Inventors: Cheng Ho Huang, Hung Lin Chang
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Publication number: 20090056097Abstract: An assembly and disassembly device for a display monitor and a method are disclosed. The assembly and disassembly device of the present invention is used to assemble the display monitor to a seat and to disassemble the display monitor from the seat body. The assembly and disassembly device of the present invention comprises a lockup portion connected to the seat body and a framework portion connected to the display monitor. The lockup portion has at least a locking body, and the framework portion has a connecting body. The fastening body has an opening and a guiding slot, and the opening is connected with the guiding slot. When the locking body moves from the opening to the guiding slot, the lockup portion can be securely fastened to the framework portion, thereby installing the display monitor to the seat body.Type: ApplicationFiled: January 23, 2008Publication date: March 5, 2009Inventors: Cheng Ho Huang, Hung Lin Chang
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Patent number: 7494349Abstract: The invention provides an input/output port (I/O port) switch structure of an electronic device. The electronic device comprises a motherboard, and an opening is installed on a predetermined position of the electronic device. The switch structure is installed on the motherboard of the electronic device and a corresponding opening is installed on a side of the electronic device. The I/O port switch structure comprises a base and an operation unit, wherein the base is electrically connected to the motherboard and is used for installing a plurality of I/O ports with different functions. The operation portion is connected to the base to let the base perform a rotating motion at a predetermined angle, and the user can therefore switch and use the required I/O port by operating switch elements.Type: GrantFiled: December 19, 2007Date of Patent: February 24, 2009Assignee: Elitegroup Computer Systems Co., Ltd.Inventors: Cheng Ho Huang, Hung Lin Chang
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Patent number: 7207843Abstract: A spark leakage shutoff protective device for a plug includes an upright snapping lever, a leakage detection electromagnetic valve, a restoring member, and an upright support wall. The snapping lever is located between the restoring member and the leakage detection electromagnetic valve. Thus, the snapping lever is hidden in the restoring member to reduce the volume of the spark leakage shutoff protective device so that the spark leakage shutoff protective device occupies a smaller space in the plug. In addition, the snapping lever is supported by the support wall, so that the snapping lever is not easily deformed or worn out during a long-term utilization, thereby enhancing the lifetime of the snapping lever.Type: GrantFiled: April 24, 2006Date of Patent: April 24, 2007Inventor: Hung-Lin Chang