Patents by Inventor Hung-Ling Shih

Hung-Ling Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090032900
    Abstract: A method of protecting a shallow trench isolation structure is described, which is applied to a semiconductor device process that includes a first process causing a recess in the STI structure and a second process after the first process. The method includes forming a silicon nitride layer in the recess along the profile of the same during the second process.
    Type: Application
    Filed: August 3, 2007
    Publication date: February 5, 2009
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Yao-Chang Wang, Shih-Chieh Hsu, Chih-Chiang Wu, Huang-Yi Lin, Chi-Hong Pai, Tsung-Wen Chen, Hung-Ling Shih