Abstract: A lens driving apparatus includes a holder, a cover, a carrier, a first magnet, a coil, a spring, two second magnets and a hall sensor. The holder includes an opening hole. The cover is made of metal material and coupled to the holder. The carrier is movably disposed in the cover, and for coupling to a lens. The first magnet is connected to an inner side of the cover. The coil is wound around an outer side of the carrier, and adjacent to the first magnet. The spring is coupled to the carrier. The second magnets are disposed on one end of the carrier which is toward the holder. The hall sensor is for detecting a magnetic field of any one of the second magnets, wherein the magnetic field is varied according to a relative displacement between the hall sensor and the second magnet which is detected.

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: An optical fiber winding machine with full-time tension control function is provided. The machine includes a first wire storage ring, a first tension sensing module, a first revolution plate, a first rotary servo motor, a first moving assembly, a plurality of first docking elements, a plurality of first electrical connection modules, a second wire storage ring, a second tension sensing module, a second revolution plate, a second rotary servo motor, a second moving assembly, a plurality of second docking elements, a plurality of second electrical connection modules, a rotating shaft, an optical fiber winding ring, and a control module.

Abstract: An inductor and a method of forming the same are provided. The inductor includes a patterned wire structure. The patterned wire structure includes a conductive core, a dielectric film and a magnetic shell. The conductive core includes a pair of end surfaces and an outer surface between the pair of end surfaces. The dielectric film covers the outer surface. The magnetic shell covers the dielectric film. The dielectric film is between the conductive core and the magnetic shell.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: A high electron mobility transistor device including a channel layer, a first barrier layer, and a P-type gallium nitride layer is provided. The first barrier layer is disposed on the channel layer. The P-type gallium nitride layer is disposed on the first barrier layer. The first thickness of the first barrier layer located directly under the P-type gallium nitride layer is greater than the second thickness of the first barrier layer located on two sides of the P-type gallium nitride layer.

Abstract: A method of manufacturing a carrying substrate is provided. At least one circuit component is disposed on a first circuit structure. An encapsulation layer is formed on the first circuit structure and encapsulates the circuit component. A second circuit structure is formed on the encapsulation layer and electrically connected to the circuit component. The circuit component is embedded in the encapsulation layer via an existing packaging process. Therefore, the routing area is increased, and a package substrate requiring a large size has a high yield and low manufacturing cost.

Abstract: A method for generating virtual reality images and used in a light field near-eye display includes steps of: shifting a display image according to at least one change vector of a plurality of eye movement parameters, and calculating a compensation mask according to a simulated image and superimposing the compensation mask on a target image to generate a superimposed target image, wherein brightness distributions of the simulated image and the compensation mask are opposite to each other. The light field near-eye display is also provided. In this way, the light field near-eye display for generating virtual reality images and the method thereof can achieve the purpose of improving the uniformity of the image and expanding the eye box size.

Abstract: A method for fabricating a substrate having an electrical interconnection structure is provided, which includes the steps of: providing a substrate body having a plurality of conductive pads and first and second passivation layers sequentially formed on the substrate body and exposing the conductive pads; forming a seed layer on the second passivation layer and the conductive pads; forming a first metal layer on each of the conductive pads, wherein the first metal layer is embedded in the first and second passivation layers without being protruded from the second passivation layer; and forming on the first metal layer a second metal layer protruded from the second passivation layer. As such, when the seed layer on the second passivation layer is removed by etching using an etchant, the etchant will not erode the first metal layer, thereby preventing an undercut structure from being formed underneath the second metal layer.

Abstract: This disclosure is related to an ultraviolet fluid sterilizing box structure. A box (10) includes a chamber (100), a water inlet (101) and a water outlet (102). The water inlet (101) and the water outlet (102) are located on different sides of the box (10). The partition (20) is disposed in the chamber (100) and includes an outer cylinder (21) and an inner cylinder (22). The outer cylinder (21) includes an outer cavity (210) and an inflow inlet (211). The inner cylinder (22) includes an inner cavity (220) and an opening (221). The ultraviolet module (30) is disposed on one side of the box (10) and includes a light-transmitting plate (31) and an ultraviolet lamp set (32). The light-transmitting plate (31) seals the outer cylinder (21). The ultraviolet rays irradiate the inner cavity (220) and the outer cavity (210).

Abstract: A light-emitting module (1) includes a light-emitting unit (10) and a rod lens (20). The light-emitting unit (10) outputs a light (11). The rod lens (20) is adjacent to the light-emitting unit (10), and converges the light (11) along an optical axis (100). A radial direction of the rod lens (20) is parallel to the optical axis (100). A distance between an axis (21) of the rod lens (20) and a light-emitting center (12) of the light-emitting unit (10) along the radial direction is greater than or equal to a focal length of the rod lens (20) along the radial direction.

Abstract: An integrated antenna structure includes a frame, a circuit board, at least one antenna radiator, a support plate, a battery, and at least one metal sheet. The frame surrounds and defines an accommodation space. The circuit board is disposed in the accommodation space. The antenna radiator includes a body and a plurality of platforms. The body is disposed on the frame by using nano molding technology (NMT) and at least partially surrounds the accommodation space. The platforms are connected to the body and protrude toward the accommodation space. The platforms are configured to electrically connect to the circuit board respectively. The support plate is disposed in the accommodation space. The metal sheet is at least partially disposed on a surface of the support plate and extends along an edge of the support plate. One end of the metal sheet is electrically connected to the circuit board.

Abstract: A semiconductor assembly includes a semiconductor device and a seal ring. The seal ring is disposed adjacent to the semiconductor device. The seal ring includes a first side surface inclined from a top surface of the seal ring toward a bottom surface of the seal ring, wherein a lateral width of the bottom surface of the seal ring is larger than a lateral width of the top surface of the seal ring; and a first metal line disposed in the seal ring and comprising a second side surface adjacent to the first side surface of the seal ring. A maximum distance between the second side surface of the first metal line and the first side surface of the seal ring is in a range of 5 ?m to 30 ?m.

Abstract: A capacitive hover sensing module includes: a capacitive touch panel for sensing a self-capacitive projective position of a conductor object on the capacitive touch panel; a touch driver chip drives the capacitive touch panel for measuring a sensing signal induced by the conductor object, and generates and outputs a sensing data accordingly; a processor receives the sensing data output and thereby generates the self-capacitive projective position of the conductor object on the capacitive touch panel when the conductor object hovers over the capacitive touch panel, the processor also generates a hover value related to a vertical distance between the conductor object and the capacitive touch panel, wherein the capacitive hover sensing module transmits the self-capacitive projective position and the hover value to a display device to display the self-capacitive projective position of the conductor object on the capacitive touch panel through a corresponding positioning feedback icon.

Abstract: The present disclosure provides a semiconductor structure and a method of manufacturing a semiconductor structure. The semiconductor structure includes a first set of photoresist structures, a second photoresist structure, and a third photoresist structure. The first set of photoresist structures is disposed along a first orientation. The second photoresist structure is disposed non-parallel to the first orientation. The third photoresist structure is disposed non-parallel to the first orientation. The second photoresist structure and the third photoresist structure contact at least one of the first set of photoresist structures.

Abstract: The present invention discloses a head-mounted display device and a communication device including a communication circuit, an antenna assembly, and a transfer module. The antenna assembly includes at least one first antenna and a second antenna. The first antenna is electrically connected to the communication circuit, and the second antenna is disposed at a top headband of the head-mounted display device. The transfer module includes a connecting wire assembly, a transfer element, and a transfer wire assembly. The transfer wire assembly is electrically connected to the transfer element and the second antenna. Two ends of the connecting wire assembly are connected to the communication circuit and the transfer element, respectively. The connecting wire assembly includes two radio frequency (RF) signal wires and a power signal wire. A power loss of the two RF signal wires is less than a power loss of the transfer wire assembly.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The structure includes an interconnect structure disposed over a substrate, a first conductive feature disposed in the interconnect structure, a dielectric layer disposed on the interconnect structure, and a second conductive feature having a top portion and a bottom portion. The top portion is disposed over the dielectric layer, and the bottom portion is disposed through the dielectric layer. The structure further includes an adhesion layer disposed over the dielectric layer and the second conductive feature. The adhesion layer includes a first portion disposed on a top of the second conductive feature and a second portion disposed over the dielectric layer, the first portion has a thickness, and the second portion has a width substantially greater than the thickness.

Abstract: A light field near-eye display device and a light field near-eye display method are provided. The light field near-eye display device includes a processor, a display panel, and a lens module. The processor calculates new ray tracing data based on a current eye relief, preset eye relief data, and preset ray tracing data, and adjusts preset image data according to the new ray tracing data to generate adjusted image data. The display panel is coupled to the processor and emits an image beam according to the adjusted image data. The lens module includes a microlens array and is disposed between the display panel and a pupil. The image beam is incident to the pupil through the lens module and displays a light field image.