Patents by Inventor Hung-Ming Wang

Hung-Ming Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240065388
    Abstract: An electronic device, a carrying buckle, and a carrying frame of a carrying buckle are provided. The carrying frame is integrally formed as a single one-piece structure and is insertable into a retaining case along an insertion direction for being fixed in the retaining case. The carrying frame includes a body segment, two buckling arms respectively extending from two opposite sides of the body segment, and an elastic structure that extends from the body segment. The elastic structure is elastically deformable when being pressed along the insertion direction, such that an abutting end of each of the two buckling arms has a displacement that allows the abutting end to be abutted against the retaining case.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 29, 2024
    Inventors: HUNG-MING CHANG, YI-CHIEH WANG, JEN-YUNG CHANG
  • Patent number: 11824130
    Abstract: Methods of fabricating solar cells having a plurality of sub-cells coupled by cell level interconnection, and the resulting solar cells, are described herein. In an example, a solar cell includes a plurality of sub-cells. Each of the plurality of sub-cells includes a singulated and physically separated semiconductor substrate portion. Each of the plurality of sub-cells includes an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell. An inter-sub-cell metallization structure couples adjacent ones of the plurality of sub-cells. The inter-sub-cell metallization structure is different in composition from the on-sub-cell metallization structure.
    Type: Grant
    Filed: October 14, 2022
    Date of Patent: November 21, 2023
    Assignee: Maxeon Solar Pte. Ltd.
    Inventors: Seung Bum Rim, Hung-Ming Wang, David Okawa, Lewis Abra
  • Publication number: 20230193502
    Abstract: A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.
    Type: Application
    Filed: February 8, 2023
    Publication date: June 22, 2023
    Inventors: Hung-Ming Wang, Paul W. Loscutoff, Raphael M. Manalo, Arnold V. Castillo, Mohamad Ridzwan Mustafa, Mark A. Kleshock, Neil G. Bergstrom
  • Patent number: 11670262
    Abstract: A method for generating a plurality of on-screen display (OSD) data is used in a back-end (BE) circuit. The BE circuit is configured to process a plurality of image data to be displayed on a display device. The method includes steps of: receiving the plurality of image data from an application processor (AP); and extracting information of a detecting layer embedded in the plurality of image data, wherein the information of the detecting layer indicates the plurality of OSD data corresponding to at least one user-interface (UI) layer in the plurality of image data.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: June 6, 2023
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Yuan-Po Cheng, Hung-Ming Wang
  • Patent number: 11598018
    Abstract: A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: March 7, 2023
    Assignee: SunPower Corporation
    Inventors: Hung-Ming Wang, Paul W. Loscutoff, Raphael M. Manalo, Arnold V. Castillo, Mohamad Ridzwan Mustafa, Mark A. Kleshock, Neil G. Bergstrom
  • Publication number: 20230033252
    Abstract: Methods of fabricating solar cells having a plurality of sub-cells coupled by cell level interconnection, and the resulting solar cells, are described herein. In an example, a solar cell includes a plurality of sub-cells. Each of the plurality of sub-cells includes a singulated and physically separated semiconductor substrate portion. Each of the plurality of sub-cells includes an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell. An inter-sub-cell metallization structure couples adjacent ones of the plurality of sub-cells. The inter-sub-cell metallization structure is different in composition from the on-sub-cell metallization structure.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 2, 2023
    Inventors: Seung Bum Rim, Hung-Ming Wang, David Okawa, Lewis Abra
  • Publication number: 20230021833
    Abstract: The present invention provides a method for generating a plurality of on-screen display (OSD) data used in a back-end (BE) circuit. The BE circuit is configured to process a plurality of image data to be displayed on a display device. The method includes steps of: receiving the plurality of image data from an application processor (AP); and extracting information of a detecting layer embedded in the plurality of image data, wherein the information of the detecting layer indicates the plurality of OSD data corresponding to at least one user-interface (UI) layer in the plurality of image data.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 26, 2023
    Applicant: NOVATEK Microelectronics Corp.
    Inventors: Yuan-Po Cheng, Hung-Ming Wang
  • Patent number: 11502213
    Abstract: Methods of fabricating solar cells having a plurality of sub-cells coupled by cell level interconnection, and the resulting solar cells, are described herein. In an example, a solar cell includes a plurality of sub-cells. Each of the plurality of sub-cells includes a singulated and physically separated semiconductor substrate portion. Each of the plurality of sub-cells includes an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell. An inter-sub-cell metallization structure couples adjacent ones of the plurality of sub-cells. The inter-sub-cell metallization structure is different in composition from the on-sub-cell metallization structure.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: November 15, 2022
    Assignee: SunPower Corporation
    Inventors: Seung Bum Rim, Hung-Ming Wang, David Okawa, Lewis Abra
  • Publication number: 20220159226
    Abstract: A device and method for blending image data and the alpha channel and reconstructing to obtain the image again after transmission. An encoder blends the alpha channel and the red-green-blue (RGB) image data through a layer blending method that is supported by the general application processor (AP). Transporter image data, such as a checkerboard pattern, is blended with 1-alpha channel data to obtain a transporter. The blended image data (RGB+alpha) is mixed with the transporter to obtain mixed image data. The mixed image data is then transmitted through the existing transmission interface. After receiving the mixed image data, reconstruction processing is performed by a decoder to obtain the original RGB image data and the alpha channel again.
    Type: Application
    Filed: February 19, 2021
    Publication date: May 19, 2022
    Inventors: HUNG-MING WANG, YUAN-PO CHENG
  • Patent number: 11195966
    Abstract: A solar cell and a solar laminate are described. The solar cell can have a front side which faces the sun during normal operation and a back side opposite front side. The solar cell can include conductive contacts having substantially reflective outer regions disposed on the back side of the solar cell. The solar laminate can include a first encapsulant, the first encapsulant disposed on the back side of the solar cell and a second encapsulant. The solar laminate can include the solar cell laminated between the first and second encapsulant. The substantially reflective outer regions of the conductive contacts and the first encapsulant can be configured to scatter and/or diffuse light at the back side of the solar laminate for substantial light collection at the back side of the solar cell. Methods of fabricating the solar cell are also described herein.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: December 7, 2021
    Assignee: SunPower Corporation
    Inventors: David D. Smith, Sung Dug Kim, Joseph Behnke, Hung-Ming Wang
  • Patent number: 11127871
    Abstract: Solar cells are attached together to form a plating assembly. The plating assembly is attached to a belt, which transports the plating assembly through a plating chamber where metal is electroplated on the solar cells. The electroplated metal is patterned to form metal contact fingers. After the metal is electroplated, the plating assembly is singulated to separate the two solar cells.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: September 21, 2021
    Assignee: SunPower Corporation
    Inventors: Paul W. Loscutoff, Hung-Ming Wang, Matthew J. Dawson, Mark A. Kleshock
  • Publication number: 20210193852
    Abstract: Subtractive metallization approaches for fabricating solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a semiconductor region in or above a substrate. A metal foil portion can include an adhesive layer thereon. The adhesive layer is above the semiconductor region and has an opening therein exposing a portion of the semiconductor region. A conductive material is on and electrically coupled to the portion of the semiconductor region exposed by the opening in the adhesive layer. The conductive material is further on and electrically coupled to the metal foil portion.
    Type: Application
    Filed: December 20, 2019
    Publication date: June 24, 2021
    Inventors: Hung-Ming Wang, Raphael Manalo
  • Publication number: 20200127150
    Abstract: Solar cells are attached together to form a plating assembly. The plating assembly is attached to a belt, which transports the plating assembly through a plating chamber where metal is electroplated on the solar cells. The electroplated metal is patterned to form metal contact fingers. After the metal is electroplated, the plating assembly is singulated to separate the two solar cells.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 23, 2020
    Applicant: SunPower Corporation
    Inventors: Paul W. LOSCUTOFF, Hung-Ming WANG, Matthew J. DAWSON, Mark A. KLESHOCK
  • Patent number: 10462449
    Abstract: The disclosure proposes a method and a system for 360-degree video playback. The method is applicable to a video playback system and includes at least the following steps. A current frame of a 360-degree video having a sequence of frames is received. Candidate objects in the current frame are detected, and a main object is selected from the candidate objects by using a selector recurrent neural network (RNN) model based on information of the candidate objects in the current frame. A viewing angle corresponding to the current frame is computed by using a regressor RNN model based on the main object in the current frame. The current frame is displayed on the screen according to the viewing angle.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: October 29, 2019
    Assignee: Novatek Microelectronics Corp.
    Inventors: Min Sun, Hou-Ning Hu, Yen-Chen Lin, Hsien-Tzu Cheng, Chieh-Cheng Chen, Hung-Ming Wang
  • Patent number: 10456791
    Abstract: A method for performing contactless ODEP for separation of CTCs is provided with the steps of obtaining patients' blood with rare cell suspected CTCs; adding at least one fluorescent antibody binding to CTCs into the blood; staining the blood; injecting the stained blood with fluorescent dye into an ODEP device and then performing fluorescent image identification; trapping the CTCs with at least one fluorescent antibody in the ODEP device by creating an image pattern and then generating an ODEP force; Separating the trapped CTCs from other non-CTCs cells; absorbing the trapped CTCs; and obtaining a high purity of CTCs. An apparatus for performing contactless ODEP for separation of CTCs is also provided.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: October 29, 2019
    Assignee: Ace Medical Technology Co., Ltd.
    Inventors: Min-Hsien Wu, Chia-Hsun Hsieh, Hung-Ming Wang, Wen-Pin Chou, Tzu-Keng Chiu
  • Publication number: 20190301047
    Abstract: A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.
    Type: Application
    Filed: March 7, 2019
    Publication date: October 3, 2019
    Inventors: Hung-Ming Wang, Paul W. Loscutoff, Raphael M. Manalo, Amold V. Castillo, Mohamad Ridzwan Mustafa, Mark A. Kleshock, Neil G. Bergstrom
  • Publication number: 20180241984
    Abstract: The disclosure proposes a method and a system for 360-degree video playback. The method is applicable to a video playback system and includes at least the following steps. A current frame of a 360-degree video having a sequence of frames is received. Candidate objects in the current frame are detected, and a main object is selected from the candidate objects by using a selector recurrent neural network (RNN) model based on information of the candidate objects in the current frame. A viewing angle corresponding to the current frame is computed by using a regressor RNN model based on the main object in the current frame. The current frame is displayed on the screen according to the viewing angle.
    Type: Application
    Filed: August 2, 2017
    Publication date: August 23, 2018
    Applicant: Novatek Microelectronics Corp.
    Inventors: Min Sun, Hou-Ning Hu, Yen-Chen Lin, Hsien-Tzu Cheng, Chieh-Cheng Chen, Hung-Ming Wang
  • Publication number: 20180190849
    Abstract: Methods of fabricating solar cells having a plurality of sub-cells coupled by cell level interconnection, and the resulting solar cells, are described herein. In an example, a solar cell includes a plurality of sub-cells. Each of the plurality of sub-cells includes a singulated and physically separated semiconductor substrate portion. Each of the plurality of sub-cells includes an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell. An inter-sub-cell metallization structure couples adjacent ones of the plurality of sub-cells. The inter-sub-cell metallization structure is different in composition from the on-sub-cell metallization structure.
    Type: Application
    Filed: December 30, 2016
    Publication date: July 5, 2018
    Inventors: Seung Bum Rim, Hung-Ming Wang, David Okawa, Lewis Abra
  • Patent number: 9832446
    Abstract: A method, device and system for packing a color frame and an original depth frame to obtain a packed frame are disclosed. The color frame is corresponding to the original depth frame, and the packed frame is to be displayed on a screen. The method for packing the color frame and the original depth frame includes the steps of: resizing the original depth frame to obtain a resized depth frame; and combining the color frame and the resized depth frame to obtain the packed frame. The center of the color frame is displayed in the central area of the screen.
    Type: Grant
    Filed: October 2, 2014
    Date of Patent: November 28, 2017
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Jar-Ferr Yang, Hung-Ming Wang, Hsi-Chun Tseng, Ke-Ying Liao
  • Publication number: 20170297036
    Abstract: A method for performing contactless ODEP for separation of CTCs is provided with the steps of obtaining patients' blood with rare cell suspected CTCs; adding at least one fluorescent antibody binding to CTCs into the blood; staining the blood; injecting the stained blood with fluorescent dye into an ODEP device and then performing fluorescent image identification; trapping the CTCs with at least one fluorescent antibody in the ODEP device by creating an image pattern and then generating an ODEP force; Separating the trapped CTCs from other non-CTCs cells; absorbing the trapped CTCs; and obtaining a high purity of CTCs. An apparatus for performing contactless ODEP for separation of CTCs is also provided.
    Type: Application
    Filed: December 1, 2016
    Publication date: October 19, 2017
    Inventors: MIN-HSIEN WU, CHIA-HSUN HSIEH, HUNG-MING WANG, WEN-PIN CHOU, TZU-KENG CHIU