Abstract: Methods of fabricating solar cells having a plurality of sub-cells coupled by cell level interconnection, and the resulting solar cells, are described herein. In an example, a solar cell includes a plurality of sub-cells. Each of the plurality of sub-cells includes a singulated and physically separated semiconductor substrate portion. Each of the plurality of sub-cells includes an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell. An inter-sub-cell metallization structure couples adjacent ones of the plurality of sub-cells. The inter-sub-cell metallization structure is different in composition from the on-sub-cell metallization structure.

Abstract: A method, device and system for packing a color frame and an original depth frame to obtain a packed frame are disclosed. The color frame is corresponding to the original depth frame, and the packed frame is to be displayed on a screen. The method for packing the color frame and the original depth frame includes the steps of: resizing the original depth frame to obtain a resized depth frame; and combining the color frame and the resized depth frame to obtain the packed frame. The center of the color frame is displayed in the central area of the screen.

Abstract: A method for performing contactless ODEP for separation of CTCs is provided with the steps of obtaining patients' blood with rare cell suspected CTCs; adding at least one fluorescent antibody binding to CTCs into the blood; staining the blood; injecting the stained blood with fluorescent dye into an ODEP device and then performing fluorescent image identification; trapping the CTCs with at least one fluorescent antibody in the ODEP device by creating an image pattern and then generating an ODEP force; Separating the trapped CTCs from other non-CTCs cells; absorbing the trapped CTCs; and obtaining a high purity of CTCs. An apparatus for performing contactless ODEP for separation of CTCs is also provided.

Abstract: An unpacking method, an unpacking device and an unpacking system of a packed frame are disclosed. The packed frame is to be displayed on a screen and includes a color frame and a resized depth frame, and the color frame is corresponding to the resized depth frame. The center of the color frame is displayed in the central area of the screen. The unpacking method includes the steps of: extracting the color frame and the resized depth frame from the packed frame; and restoring the resized depth frame to obtain an original depth frame.

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device.

Abstract: A solar cell and a solar laminate are described. The solar cell can have a front side which faces the sun during normal operation and a back side opposite front side. The solar cell can include conductive contacts having substantially reflective outer regions disposed on the back side of the solar cell. The solar laminate can include a first encapsulant, the first encapsulant disposed on the back side of the solar cell and a second encapsulant. The solar laminate can include the solar cell laminated between the first and second encapsulant. The substantially reflective outer regions of the conductive contacts and the first encapsulant can be configured to scatter and/or diffuse light at the back side of the solar laminate for substantial light collection at the back side of the solar cell. Methods of fabricating the solar cell are also described herein.

Abstract: A method, a device and a system for restoring a resized depth frame into an original depth frame are disclosed. The method for restoring a resized depth frame into an original depth frame includes the steps of: obtaining a first sub-pixel value from one pixel of the resized depth frame; storing the first sub-pixel value in all sub-pixels of a first pixel of the original depth frame; obtaining a second sub-pixel value of the pixel of the resized depth frame; and storing the second sub-pixel value to all sub-pixels of a second pixel of the original depth frame.

Abstract: A method, a device and a system for resizing an original depth frame into a resized depth frame. The method for resizing an original depth frame into a resized depth frame includes the steps of: obtaining two sub-pixel values from at least two pixels of the original depth frame, respectively; and storing the two sub-pixel values into corresponding two sub-pixels of one pixel of the resized depth frame, respectively.

Abstract: A method, a device and a system for restoring a resized depth frame into an original depth frame are disclosed. The method for restoring a resized depth frame into an original depth frame includes the steps of: obtaining a first sub-pixel value from one pixel of the resized depth frame; storing the first sub-pixel value in all sub-pixels of a first pixel of the original depth frame; obtaining a second sub-pixel value of the pixel of the resized depth frame; and storing the second sub-pixel value to all sub-pixels of a second pixel of the original depth frame.

Abstract: A method, a device and a system for resizing an original depth frame into a resized depth frame. The method for resizing an original depth frame into a resized depth frame includes the steps of: obtaining two sub-pixel values from at least two pixels of the original depth frame, respectively; and storing the two sub-pixel values into corresponding two sub-pixels of one pixel of the resized depth frame, respectively.

Abstract: A method, device and system for packing a color frame and an original depth frame to obtain a packed frame are disclosed. The color frame is corresponding to the original depth frame, and the packed frame is to be displayed on a screen. The method for packing the color frame and the original depth frame includes the steps of resizing the original depth frame to obtain a resized depth frame; and combining the color frame and the resized depth frame to obtain the packed frame. The center of the color frame is displayed in the central area of the screen.

Abstract: An unpacking method, an unpacking device and an unpacking system of a packed frame are disclosed. The packed frame is to be displayed on a screen and includes a color frame and a resized depth frame, and the color frame is corresponding to the resized depth frame. The center of the color frame is displayed in the central area of the screen. The unpacking method includes the steps of: extracting the color frame and the resized depth frame from the packed frame; and restoring the resized depth frame to obtain an original depth frame.

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device.

Abstract: An image conversion method for naked-eye 3D display includes: an image receiving step to receive a 2D image data having a depth information; a sub-pixel arrangement receiving step to receive a sub-pixel arrangement data which is corresponding to a 3D display apparatus and includes a plurality of views; a view ascertaining step to ascertain the view corresponding to at least a sub-pixel of a plurality of sub-pixels by the sub-pixel arrangement data; and a sub-pixel data searching step to search a sub-pixel data of the sub-pixel at the ascertained view from the 2D image data by the depth information. Thereby, the sub-pixel data of these sub-pixels constitute a 3D image data for displaying.

Abstract: A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.

Abstract: A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.

Abstract: Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal) can be consistent and efficient for wafers with different feature sizes (particularly different depths), and for wafers at different metallization levels.

Abstract: A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.

Abstract: Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal) can be consistent and efficient for wafers with different feature sizes (particularly different depths), and for wafers at different metallization levels.

Abstract: A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer.