Abstract: Disclosed herein is a process for producing a postbiotic extract, which includes providing a first material having a first isoelectric point ranging from pH 1 to pH 6 and a second material having a second isoelectric point ranging from pH 4 to pH 8, admixing the first material and a probiotic microorganism with water having a pH greater than the second isoelectric point, so as to form a mixture, adding the second material into the mixture and then adjusting a pH of the second material-added mixture to between the first and second isoelectric points so that a precipitate is formed, and subjecting the precipitate to a cell wall isolation treatment to obtain the postbiotic extract. Use of the postbiotic extract is also disclosed.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: Disclosed herein is a process for producing a postbiotic extract, which includes providing a first material having a first isoelectric point ranging from pH 1 to pH 6 and a second material having a second isoelectric point ranging from pH 4 to pH 8, admixing the first material and a probiotic microorganism with water having a pH greater than the second isoelectric point, so as to form a mixture, adding the second material into the mixture and then adjusting a pH of the second material-added mixture to between the first and second isoelectric points so that a precipitate is formed, and subjecting the precipitate to a cell wall isolation treatment to obtain the postbiotic extract. Use of the postbiotic extract is also disclosed.

Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.

Abstract: A method of manufacturing an inductive device includes: providing a magnetic base including a core column and defining a positioning trench that surrounds the core column; forming a coil structure including a coil body, a first extending section, and a second extending section, in which the coil body has a through hole, the first extending section includes a first bent portion and a first terminal portion connected thereto, and the second extending section includes a second bent portion and a second terminal portion connected thereto; arranging the coil structure in the positioning trench by sleeving the coil body around the core column; and forming a package structure to cover the magnetic base and the coil structure.

Abstract: A thin-film inductor device includes a substrate made of an electrically insulating material, a first coil unit, a second coil unit, and an inductance-enhancing structure. The first coil unit includes a first upper coil, a first lower coil, and two first electrodes electrically connected to the first upper and lower coils, respectively. The second coil includes a second upper coil, a second lower coil, and two second electrodes electrically connected to the second upper and lower coils, respectively. The first and second upper/lower coils are disposed spacedly and arranged by bifilar winding. The inductance-enhancing structure encapsulates the substrate, the first coil unit, and the second coil unit such that two terminal parts of each of the first electrodes and the second electrodes are exposed for external electrical connection.

Abstract: An inductive device and a method of manufacturing the same are provided. The inductive device includes a magnetic base, a coil structure, and a package structure. The magnetic base includes a bottom plate, a core column, and a lateral wall defining a positioning trench. The coil structure includes a coil body, a first extending section, and a second extending section. The coil body disposed in the positioning trench surrounds the core column. The first extending section includes a first bent portion and a first terminal portion connected at a first connecting point. The second extending section includes a second bent portion and a second terminal portion connected at a second connecting point. A shortest distance between a first imaginary connection line defined between the first and second connecting points and a central axis of the core column is less than a minimum outer radius of the coil body.

Abstract: An inductive device and a method of manufacturing the same are provided. The inductive device includes a magnetic base, a coil structure, and a package structure. The magnetic base includes a bottom plate, a core column, and a lateral wall defining a positioning trench. The coil structure includes a coil body, a first extending section, and a second extending section. The coil body disposed in the positioning trench surrounds the core column. The first extending section includes a first bent portion and a first terminal portion connected at a first connecting point. The second extending section includes a second bent portion and a second terminal portion connected at a second connecting point. A shortest distance between a first imaginary connection line defined between the first and second connecting points and a central axis of the core column is less than a minimum outer radius of the coil body.

Abstract: A thin-film inductor device includes a substrate made of an electrically insulating material, a first coil unit, a second coil unit, and an inductance-enhancing structure. The first coil unit includes a first upper coil, a first lower coil, and two first electrodes electrically connected to the first upper and lower coils, respectively. The second coil includes a second upper coil, a second lower coil, and two second electrodes electrically connected to the second upper and lower coils, respectively. The first and second upper/lower coils are disposed spacedly and arranged by bifilar winding. The inductance-enhancing structure encapsulates the substrate, the first coil unit, and the second coil unit such that two terminal parts of each of the first electrodes and the second electrodes are exposed for external electrical connection.

Abstract: A cantilever-type standoff includes a column body, a plurality of cantilevers, a plurality of blocking plates, and a plurality of bumps. The cantilevers are respectively disposed on opposite end surfaces of the column body. The blocking plates are respectively parallel to the cantilevers. A plurality of clamping grooves are respectively defined by the blocking plates and the cantilevers. The bumps are respectively disposed on surfaces of the cantilevers facing the blocking plates.

Abstract: A combination toy includes a bottom plate, an inner board unit removably mounted on the bottom plate, an outer board unit removably mounted on the bottom plate, and two side board units each removably mounted on the bottom plate. The outer board unit is combined with the inner board unit. Each of the side board units is combined with the outer board unit. The side board units are located at the two opposite ends of the outer board unit. Thus, the inner board unit, the outer board unit and the side board units are assembled and disassembled with each other so that the combination toy can be assembled and disassembled by the user.

Abstract: A boss for securing a pair of mainboards includes a circular top and a plurality of first flexible legs. The first flexible legs are disposed on one side of the circular top and are separated from each other. Each of the first flexible legs includes a tilted wall and a pressing component. The tilted wall is formed on a surface of the first flexible leg that faces another first flexible leg. The pressing component is formed on one end of the first flexible leg away from the circular top. The tilted walls of all the first flexible legs cooperatively define a tapered channel. The tapered channel can be expanded.

Abstract: A boss for securing a pair of mainboards includes a circular top and a plurality of first flexible legs. The first flexible legs are disposed on one side of the circular top and are separated from each other. Each of the first flexible legs includes a tilted wall and a pressing component. The tilted wall is formed on a surface of the first flexible leg that faces another first flexible leg. The pressing component is formed on one end of the first flexible leg away from the circular top. The tilted walls of all the first flexible legs cooperatively define a tapered channel. The tapered channel can be expanded.

Abstract: A cantilever-type standoff includes a column body, a plurality of cantilevers, a plurality of blocking plates, and a plurality of bumps. The cantilevers are respectively disposed on opposite end surfaces of the column body. The blocking plates are respectively parallel to the cantilevers. A plurality of clamping grooves are respectively defined by the blocking plates and the cantilevers. The bumps are respectively disposed on surfaces of the cantilevers facing the blocking plates.

Abstract: A board game includes a board assembly and an operation unit mating with the board assembly. The board assembly includes at least one outer frame, at least one inner board mounted in the outer frame and a plurality of separating edges located in the outer frame and the inner board to separate the outer frame and the inner board respectively. The outer frame of the board assembly includes a plurality of sections which are juxtaposed and combined to form an endless loop. Thus, the outer frame and the inner board of the board assembly co-operate to function as a monopoly and a puzzle so as to enhance the amusement of playing the board game.

Abstract: A board game includes a board assembly and an operation unit mating with the board assembly. The board assembly includes at least one outer frame, at least one inner board mounted in the outer frame and a plurality of separating edges located in the outer frame and the inner board to separate the outer frame and the inner board respectively. The outer frame of the board assembly includes a plurality of sections which are juxtaposed and combined to form an endless loop. Thus, the outer frame and the inner board of the board assembly co-operate to function as a monopoly and a puzzle so as to enhance the amusement of playing the board game.

Abstract: A card game includes a plurality of playing cards each having a front face provided with a marking module. The marking module of each of the playing cards includes a symbol, a character and a letter. Thus, the card game can be used to play standard card games by provision of the symbols and the characters of the marking modules on the playing cards and can also be used to play a spelling or word-building game by provision of the letters of the marking modules on the playing cards so that the card game can satisfy the requirements of different players, thereby enhancing the amusement effect of the card game.