Abstract: A display device includes a display panel and a switch panel. The switch panel includes a first substrate disposed on the display panel, a shielding pattern layer, a light transmitting layer, pixel electrodes disposed on the light transmitting layer, a second substrate disposed on the pixel electrodes, and the liquid crystal layer disposed between the first substrate and the second substrate. The shielding pattern layer is disposed on the first substrate and includes opening parts and light shielding parts arranged alternately with the opening parts. Each of the light shielding parts has a first thickness. The light transmitting layer is disposed on the shielding pattern layer and includes filling parts filling the opening parts and extending parts arranged alternately with the filling parts. Each of the filling parts has a second thickness greater than the first thickness.

Abstract: A memory testing method includes the operations of: generating test pattern data, a test address and reference data by a pattern generating circuit; performing a built-in self-test (BIST) according to the test pattern, the test address and the reference data by multiple memory modules to generate multiple test results; generating an indicator signal according to the multiple test results; when a first test result among the multiple test results indicates a fault, retaining the test address by the pattern generating circuit in response to the indicator signal, and testing, according to the test address and multiple sets of predetermined pattern data, a first memory module among the multiple memory modules that corresponds to the first test result to generate a localization test result; and determining a faulty memory cell in the first memory module according to the localization test result.

Abstract: An optical transceiver includes a printed circuit board, a transceiver module, a plurality of filtering capacitors and a noise absorber. The printed circuit board is provided with a plurality of signal lines and a plurality of gold fingers each connecting one of the plurality of signal lines. The transceiver module is disposed on the printed circuit board and connecting the plurality of signal lines. Each of the plurality of filtering capacitors is located on one of the plurality of signal lines. The noise absorber covers at least one surface of the plurality of filtering capacitors opposite to the printed circuit board.

Abstract: Disclosed are a headphone and an operating method thereof. The headphone includes a headband frame, a speaker module, a detector and a controller. The speaker module is disposed on the headband frame. The detector is disposed in the headband frame and detect stress changes on the headband frame to output a frequency response voltage value. The controller is electrically connected to the speaker module and the detector, and receives the frequency response voltage value. The controller determines whether the frequency response voltage value is the same as a target frequency response voltage value to read a target frequency response parameter corresponding to the target frequency response voltage value. The controller drives the speaker module according to the target frequency response parameter.

Abstract: A method for fabricating a surface acoustic wave (SAW) device includes the steps of forming a buffer layer on a substrate, forming a high velocity layer on the buffer layer, forming a medium velocity layer on the high velocity layer, forming a low velocity layer on the medium velocity layer, forming a piezoelectric layer on the low velocity layer, and forming an electrode on the piezoelectric layer. Preferably, the buffer layer includes silicon oxide, the high velocity layer includes graphene, the medium velocity layer includes silicon oxynitride, and the low velocity layer includes titanium oxide.

Abstract: A lens assembly and Augmented Reality (AR) glasses, including a waveguide substrate, a wiring layer, a protective layer, an eye tracking component, and a lens. The waveguide substrate includes a first surface. The wiring layer is disposed on the first surface. The protective layer is disposed on the first surface and covering the wiring layer. The eye tracking component is disposed in the protective layer and is electrically connected with the wiring layer for tracking position of an eyeball. The lens is connected to a side of the protective layer away from the waveguide substrate. The AR glasses includes a display device and two lens assemblies. The display device is positioned between the two lens assemblies for emitting image light to the waveguide substrates of the two lens assemblies.

Abstract: A method includes: depositing a mask layer over a substrate; directing first radiation reflected from a central collector section of a sectional collector of a lithography system toward the mask layer according to a pattern; directing second radiation reflected from a peripheral collector section of the sectional collector toward the mask layer according to the pattern, wherein the peripheral collector section is vertically separated from the central collector section by a gap; forming openings in the mask layer by removing first regions of the mask layer exposed to the first radiation and second regions of the mask layer exposed to the second radiation; and removing material of a layer underlying the mask layer exposed by the openings.

Abstract: A lens assembly and Augmented Reality (AR) glasses, including a waveguide substrate, a wiring layer, a protective layer, an eye tracking component, and a lens. The waveguide substrate includes a first surface. The wiring layer is disposed on the first surface. The protective layer is disposed on the first surface and covering the wiring layer. The eye tracking component is disposed in the protective layer and is electrically connected with the wiring layer for tracking position of an eyeball. The lens is connected to a side of the protective layer away from the waveguide substrate. The AR glasses includes a display device and two lens assemblies. The display device is positioned between the two lens assemblies for emitting image light to the waveguide substrates of the two lens assemblies.

Abstract: Control logic in a memory device executes a programming operation to program the set of memory blocks of the set of memory planes to a set of a programming levels. The control logic identify a subset of memory blocks of one or more memory planes that pass a program count operation associated with a last programming level of the set of programming levels. The control logic further terminates execution of the programming operation on the one or more memory planes associated with the subset of memory blocks.

Abstract: Disclosed is a liquid crystal display (LCD) device, including an LCD panel and a light-emitting diode (LED) light board. The LCD panel has a display area and a peripheral area located on at least one side of the display area. The LED light board overlaps the LCD panel in a normal direction of a light-emitting surface of the LCD panel. The LED light board includes a circuit substrate, multiple LEDs, and a resin layer. The circuit substrate overlaps the display area and the peripheral area in the normal direction of the light-emitting surface. The LEDs are arrayed on the circuit substrate. The LEDs overlap the display area in the normal direction of the light-emitting surface. The resin layer covers the circuit substrate and overlaps the display area and the peripheral area in the normal direction of the light-emitting surface.

Abstract: A method for manufacturing a keycap includes a plastic injection step that involves forming a keycap preform; a coating layer forming step that involves spraying a surface paint material onto a processing surface of the keycap preform to form a surface paint coating layer, which has an engraved marking portion; a protection layer forming step that involves spraying a protection material onto the surface paint coating layer to form a first protection layer; a laser engraving step that involves removing the engraved marking portion; and a screen printing step that involves forming a second protection layer on the processing surface.

Abstract: A system for monitoring and controlling an EUV light source includes a first temperature sensor, a signal processor, and a process controller. The first temperature sensor includes a portion inserted into a space surrounded by a plurality of vanes through a vane of the plurality of vanes, and obtains an ambient temperature that decreases with time as a function of tin contamination coating on the inserted portion. The signal processor determines an excess tin debris deposition on the vane based on the obtained chamber ambient temperature. The process controller activates a vane cleaning action upon being informed of the excess tin debris deposition by the signal processor, thereby improving availability of the EUV light source tool and reducing risks of tin pollution on other tools such as a reticle.

Abstract: A charging module configured to charge a plurality of electric vehicles through a plurality of charging piles is provided. The charging module includes a charging prediction mode and a charging scheduling unit. The charging prediction mode is obtained according to a plurality of historical charging data, wherein each historical charging data includes an actual charging amount and at least one of a stay time and a charging time. The charging scheduling unit is configured to obtain a predicted electricity demand and a predicted stay period of each electric vehicle through the charging prediction model; and generate a charging schedule including: providing each electric vehicle with a basic charging amount; and determining a charging priority of the electric vehicles according to the predicted electricity demand and the predicted stay period.

Abstract: Control logic in a memory device executes a programming operation to program the set of memory blocks of the set of memory planes to a set of a programming levels. In response to determining at least a portion of a first memory block passed a program verify operation associated with a last programming level of the set of programming levels, the control logic executes a first program sub-operation to terminate the programming operation with respect to a first subset of one or more memory planes of the set of memory planes that passed the program verify operation associated with the last programming level and identify a second subset of one or more memory planes that failed the program verify operation associated with the last programming level. The control logic executes a second program sub-operation to apply a trim set to the second subset of one or more memory planes that failed the program verify operation of the last programming level.

Abstract: A light source module includes a first light source, a second light source, a combining component, and a transparent medium. The first light source emits a first light. The second light source emits a second light. The second light propagates along an optical path different from that of the first light. The combining component is on optical paths of the first light and the second light. The combining component combines the first light and the second light. The transparent medium fills a gap between the first light source and the combining component, and a gap between the second light source and the combining component. An absolute value of a difference in refractive index between the transparent medium and the combining component is less than an absolute value of a difference in refractive index between the air and the combining component.

Abstract: A method for preparing eye-tracking glasses: providing a substrate assembly, the substrate assembly comprising a functional film, the functional film being located on an outermost surface of the substrate assembly as a first surface, the first surface is provided with electronic components. Spraying a matching material towards the first surface, the matching material accumulating at least at a gap difference between the first surface and the electronic component. Providing a sealing layer, the sealing layer covering the first surface and the electronic components and the matching material disposed on the first surface. Providing a lens, the lens being connected to the functional film and the electronic components by the sealing layer.

Abstract: A method for preparing eye-tracking glasses, comprising the following steps: providing a substrate assembly, the substrate assembly comprising a functional film, the functional film being arranged on a surface of the substrate assembly, and electronic components being arranged on the surface of the functional film. Pressing an injection mold against the substrate assembly to form an injection cavity, and making the surface of the functional film with the electronic components face an interior of the injection cavity. Injecting and molding an optical adhesive in the injection cavity to form a lens, with the electronic components embedded in the lens. Demolding the injection mold from the lens, separating the functional film from the substrate assembly to obtain the eye-tracking glasses.

Abstract: A method for fabricating a semiconductor device includes the steps of forming a first inter-metal dielectric (IMD) layer on a substrate, forming a first trench and a second trench in the first IMD layer, forming a bottom electrode in the first trench and the second trench, forming a ferroelectric (FE) layer on the bottom electrode, and then forming a top electrode on the FE layer to form a ferroelectric random access memory (FeRAM).

Abstract: A device includes a first dielectric layer. A second dielectric layer is disposed over the first dielectric layer. The second dielectric layer and the first dielectric layer have different material compositions. A metal-insulator-metal (MIM) structure is embedded in the second dielectric layer. A third dielectric layer is disposed over the second dielectric layer. The third dielectric layer and the second dielectric layer have different material compositions. The first dielectric layer or the third dielectric layer may contain silicon nitride (SiN), the second dielectric layer may contain silicon oxide (SiO2).