Patents by Inventor Hung-Wei Chen
Hung-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20210017976Abstract: A micro pump is disclosed and includes a fluid-converging plate, a valve membrane, a fluid-outlet plate and a pump core module. The fluid-converging plate includes an inner recess, a protruding portion and a fluid-converging aperture. The protruding portion is disposed at a center of the inner recess. The valve membrane includes a valve aperture. The protruding portion of the fluid-converging plate abuts against the valve aperture. A fluid-converging chamber is formed between the valve membrane and the fluid-converging plate. The fluid-outlet plate in a ring shape includes a fluid-outlet channel. The valve aperture is in fluid communication with the fluid-outlet channel. When the fluid is inhaled into the pump core module, the fluid flows to the fluid-converging chamber through the fluid-converging aperture and then pushes out the valve membrane to flow into the fluid-outlet channel of the fluid-outlet plate through the valve aperture. Thereby the fluid transportation is achieved.Type: ApplicationFiled: June 16, 2020Publication date: January 21, 2021Applicant: Microjet Technology Co., Ltd.Inventors: Hao-Jan Mou, Shih-Chang Chen, Jia-Yu Liao, Hung-Hsin Liao, Chung-Wei Kao, Yung-Lung Han, Chi-Feng Huang, Chang-Yen Tsai, Wei-Ming Lee
-
Publication number: 20210013234Abstract: An electronic device is provided. The electronic device includes a substrate, a first gate circuit, a second gate circuit, a signal line, and a shielding layer. The substrate includes a display area and a peripheral area. The first gate circuit is disposed in the peripheral area. The second gate circuit is disposed in the peripheral area. The signal line is coupled between the first gate circuit and the second gate circuit. The signal line includes a specific line segment, and the specific line segment overlaps the display area. The shielding layer is disposed in the display area. The shielding layer overlaps the specific line segment.Type: ApplicationFiled: June 22, 2020Publication date: January 14, 2021Inventors: Yu-Che CHANG, Li-Wei SUNG, Cheng-Tso CHEN, Hui-Min HUANG, Chia-Min YEH, Hung-Hsun CHEN
-
Publication number: 20210012110Abstract: An object detection apparatus includes a boundary box decision circuit and a processing circuit. The boundary box decision circuit receives lens configuration information of a lens, and refers to the lens configuration information to determine a bounding box distribution of bounding boxes that are assigned to different detection distances with respect to the lens for detection of a target object. The processing circuit receives a captured image that is derived from an output of an image capture device using the lens, and performs object detection upon the captured image according to the bounding box distribution of the bounding boxes.Type: ApplicationFiled: February 12, 2020Publication date: January 14, 2021Inventors: Chih-Wei Chen, Pei-Kuei Tsung, Shao-Yi Wang, Hung-Jen Chen, Kuan-Yu Chen, Cheng-Lung Jen
-
Publication number: 20200411439Abstract: A semiconductor device includes a first chip package, a heat dissipation structure and an adapter. The first chip package includes a semiconductor die laterally encapsulated by an insulating encapsulant, the semiconductor die has an active surface and a back surface opposite to the active surface. The heat dissipation structure is connected to the chip package. The adapter is disposed over the first chip package and electrically connected to the semiconductor die.Type: ApplicationFiled: June 27, 2019Publication date: December 31, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai, Shih-Wei Chen
-
Patent number: 10879130Abstract: Semiconductor device structures are provided. The semiconductor device structure includes first semiconductor wires over a semiconductor substrate. The first semiconductor wires are vertically spaced apart from each other. The semiconductor device structure also includes a gate stack surrounding first portions of the first semiconductor wires, and a spacer element surrounding second portions of the first semiconductor wires. The first portions have a first width and the second portions have a second width. In addition, the semiconductor device structure includes a second semiconductor wire between the second portions. The second semiconductor wire has a third width, and the third width is substantially equal to the second width and greater than the first width.Type: GrantFiled: May 10, 2019Date of Patent: December 29, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTDInventors: Hung-Li Chiang, I-Sheng Chen, Tzu-Chiang Chen, Tung-Ying Lee, Szu-Wei Huang, Huan-Sheng Wei
-
Patent number: 10879051Abstract: A plasma processing apparatus is provided. The apparatus includes a lower sheltering module. The apparatus further includes an upper sheltering module arranged adjacent to the lower sheltering module. The apparatus includes an upper plate and an upper PEZ ring positioned around the upper plate. The apparatus also includes a shadowing unit that includes a number of engaging parts in the form of arcs detachably positioned on the upper PEZ ring. In addition, the apparatus includes a plasma generation module for generating plasma in the peripheral region of the lower sheltering module and the upper sheltering module.Type: GrantFiled: May 11, 2017Date of Patent: December 29, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chun-Hsing Wu, Hung-Jui Chang, Chih-Ching Cheng, Yi-Wei Chiu, Kun-Cheng Chen
-
Patent number: 10859630Abstract: A circuit test method for a test device to test a device under test is provided. The circuit test method includes the steps of applying zero volts to a plurality of power pins of the device under test; applying a test voltage to a first signal pin among a plurality of signal pins of the device under test; and measuring a current on a second signal pin among the plurality of signal pins of the device under test and determining whether there is a leakage current in the device under test.Type: GrantFiled: November 15, 2017Date of Patent: December 8, 2020Assignee: SILICON MOTION, INC.Inventors: Hung-Sen Kuo, Te-Wei Chen, Hung-Sheng Chang, Ming-Wan Kuan
-
Patent number: 10841390Abstract: A system and method for synchronizing publication and subscription of message queues are provided. The method includes: providing a message broker cluster including a plurality of message brokers each having a buffer queue and a data queue; as any one of the message brokers requests a synchronization requirement, selecting, by an orchestration server, one of the message brokers in the message broker cluster to perform data synchronization; setting a data read-lock to the data queue of the selected message broker sequentially to write data contents in the buffer queues of all of the plurality of message brokers into the data queue of the selected message broker; and copying the complete data contents in the data queue of the selected message broker to the data queues of the other message brokers, allowing the data contents in the data queues of each of the message brokers to be consistent.Type: GrantFiled: April 16, 2019Date of Patent: November 17, 2020Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yu-Lun Chen, Hung-Wei Lin, Li-Ting Huang
-
Patent number: 10826449Abstract: Disclosed is a high accurate measurement circuit, and the feature is using bias switching circuit for compensating front end offset, and the back end offset of amplifier is also cancelled. In the real measurement environment, offset exists in the amplifier of the measurement circuit has, and non-ideal effects also exist in the interface between measurement terminal and the measurement circuit, such as leakage current of chip package pins or mismatch of the circuit. The above non-ideal effects belong to front end offset and cannot be compensated by the prior arts. The disclosed structure uses the bias switch circuit and uses different switching method in the two measurement timings. By subtracting the measurement results for the two measurement timings, the front end offset is compensated, and the back end offset of the amplifier is also cancelled.Type: GrantFiled: January 16, 2019Date of Patent: November 3, 2020Assignee: HYCON TECHNOLOGY CORP.Inventors: Po-Yin Chao, Hung-Wei Chen, Shui-Chu Lee
-
Publication number: 20200342801Abstract: The present invention discloses a driving method for a source driver, for driving a source line of a display panel. The driving method includes the steps of: driving the source line with a first voltage or a second voltage smaller than the first voltage in a first driving cycle; driving the source line with the first voltage in a second driving cycle next to the first driving cycle when the source line is driven with the first voltage in the first driving cycle; and driving the source line with an overdrive voltage in the second driving cycle when the source line is driven with the second voltage in the first driving cycle. The first voltage is a normal high voltage of the display panel, and the overdrive voltage is greater than the normal high voltage.Type: ApplicationFiled: April 26, 2019Publication date: October 29, 2020Inventors: Yen-Tao Liao, Hung-Hsiang Chen, Jen-Ta Yang, Yi-Wei Lin, Huang-Chin Tang
-
Publication number: 20200335400Abstract: In a method, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. The first semiconductor layers are etched at a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, thereby forming a first source/drain space in which the second semiconductor layers are exposed. A dielectric layer is formed at the first source/drain space, thereby covering the exposed second semiconductor layers. The dielectric layer and part of the second semiconductor layers are etched, thereby forming a second source/drain space. A source/drain epitaxial layer is formed in the second source/drain space. At least one of the second semiconductor layers is in contact with the source/drain epitaxial layer, and at least one of the second semiconductor layers is separated from the source/drain epitaxial layer.Type: ApplicationFiled: June 29, 2020Publication date: October 22, 2020Inventors: Hung-Li CHIANG, Chao-Ching CHENG, Chih-Liang CHEN, Tzu-Chiang CHEN, Ta-Pen GUO, Yu-Lin YANG, I-Sheng CHEN, Szu-Wei HUANG
-
Patent number: 10806044Abstract: A board structure for a cable passing therethrough includes a board body and a grommet. The board body includes a board hole and a first inner protrusion portion. A minimum diameter of the board hole is a diameter located corresponding to the first inner protrusion portion of the board hole. The grommet is made of an elastic material and disposed in the board hole. The grommet includes a grommet hole and an outer annular wall. The outer annular wall is connected to the first inner protrusion portion. The grommet hole is for the cable passing therethrough and coaxially disposed with the board hole. A diameter of the grommet hole is smaller than the minimum diameter of the board hole.Type: GrantFiled: December 10, 2019Date of Patent: October 13, 2020Assignee: WISTRON NEWEB CORPORATIONInventors: Hung-Wei Lee, Tung-Yi Chen, Cheng-Wei Yeh
-
Publication number: 20200322710Abstract: A headphone assembly, including: a switching element for controlling a switch of at least one functional element in a headphone; a pressure sensor accommodated in a groove of a speaker board; and an ear pad covering the groove, when the ear pad is pressed, a trigger element may be moved to press against the pressure sensor, when detecting that pressure applied by the trigger element reaches a predetermined range, the pressure sensor switches on the switching element, otherwise, the pressure sensor switches off the switching element.Type: ApplicationFiled: April 1, 2020Publication date: October 8, 2020Inventors: Thomas Pieter J. PEETERS, Hung-Fen CHEN, Hung-Wei LEE, Chia-Hsin HUNG
-
Publication number: 20200315050Abstract: A board structure for a cable passing therethrough includes a board body and a grommet. The board body includes a board hole and a first inner protrusion portion. A minimum diameter of the board hole is a diameter located corresponding to the first inner protrusion portion of the board hole. The grommet is made of an elastic material and disposed in the board hole. The grommet includes a grommet hole and an outer annular wall. The outer annular wall is connected to the first inner protrusion portion. The grommet hole is for the cable passing therethrough and coaxially disposed with the board hole. A diameter of the grommet hole is smaller than the minimum diameter of the board hole.Type: ApplicationFiled: December 10, 2019Publication date: October 1, 2020Inventors: Hung-Wei LEE, Tung-Yi CHEN, Cheng-Wei YEH
-
Publication number: 20200300897Abstract: Disclosed is a sensor with compensation circuit for compensating offset by use of a switching circuit. The sensor has two operation modes for generating two output voltages, respectively. Offset is compensated by adding the two output voltages, and magnitude of the offset is calculated by subtracting the two output voltages. A noise threshold is set for checking if the circuit is affected by interference. When the circuit is affected by interference, the adding result of the two output voltages will be larger than the noise threshold, the output data will be hold and not updated, then a reminding signal will be issued to show that the circuit is affected by interference, and the output data flickers on a display unit when the adding result of the two output voltages is larger than the noise threshold for showing the circuit is affected by interference.Type: ApplicationFiled: March 19, 2019Publication date: September 24, 2020Inventors: Po-Yin CHAO, Hung-Wei CHEN, Shui-Chu LEE
-
Patent number: 10784252Abstract: An ESD protection circuit, which protects a subject NMOS transistor coupled between an I/O pad and a ground, includes a first discharge device arranged between the I/O pad and the ground, having a trigger-on voltage that is lower than a breakdown voltage of the subject NMOS transistor; and a gate voltage control device, including a discharge NMOS transistor coupled to the ground and a gate of the subject NMOS transistor; a first PMOS transistor connected to the gate of the subject NMOS transistor and a connection node; and a first NMOS transistor connected to the connection node and the ground. The connection node is connected to the gate of the discharge NMOS transistor, and the gate of the first PMOS transistor and the gate of the first NMOS transistor are connected to each other.Type: GrantFiled: September 20, 2018Date of Patent: September 22, 2020Assignee: Vanguard International Semiconductor CorporationInventors: Shao-Chang Huang, Li-Fan Chen, Chih-Hsuan Lin, Yu-Kai Wang, Hung-Wei Chen, Ching-Wen Wang, Ting-You Lin, Chun-Chih Chen
-
Publication number: 20200295243Abstract: A method of packaging a semiconductor illumination module is provided. The method includes the following steps. In a step (a), a substrate is provided. The substrate is selected from one of a flexible printed circuit board, a metal core circuit board, a printed circuit board or a ceramic printed circuit board. The substrate includes a solder mask layer with an opening, and the opening has a width R. In a step (b), a light-emitting element is installed in the opening. In a step (c), an encapsulant injection device is used to inject a packaging encapsulant into the opening. In a step (d), a sealed lens structure is formed to cover the light-emitting element, wherein the sealed lens structure has a height h.Type: ApplicationFiled: May 24, 2019Publication date: September 17, 2020Inventors: Hung-Wei Kuo, Ya-Chin Tu, Chung-Yuan Chen
-
Patent number: 10770014Abstract: A display device includes a display panel having a display region and a peripheral region. The display panel includes a substrate and a scan driving circuit. The scan driving circuit disposed on the substrate includes a plurality of scan driving blocks and a plurality of first conductive lines. The first conductive lines are respectively coupled to and disposed between adjacent scan driving blocks. The scan driving blocks are disposed corresponding to the peripheral region, and the first conductive lines are disposed corresponding to the display region and the peripheral region.Type: GrantFiled: March 12, 2019Date of Patent: September 8, 2020Assignee: INNOLUX CORPORATIONInventors: Chia-Min Yeh, Hung-Hsun Chen, Hui-Min Huang, Cheng-Tso Chen, Li-Wei Sung
-
Patent number: 10761359Abstract: A touch display device including a first substrate, a second substrate, a display medium, and a pixel array structure is provided. The pixel array structure includes a scan line, a data line, an active device, pixel electrodes, a signal electrode layer and a signal transmission layer. The scan line intersects the data line. The active device is connected to the scan line and the data line. The pixel electrodes are arranged in an array. The signal electrode layer includes signal electrodes. The signal transmission layer includes a signal line disposed between two adjacent columns of the pixel electrodes and electrically connected to one of the signal electrodes. The data line includes at least a portion located outside of the signal line.Type: GrantFiled: June 26, 2018Date of Patent: September 1, 2020Assignee: Innolux CorporationInventors: Hung-Kun Chen, Hsieh-Li Chou, Li-Wei Sung, Tung-Kai Liu, Chia-Hao Tsai, Chih-Hao Chang, Bo-Feng Chen, Yu-Chien Kao
-
Patent number: 10725267Abstract: A four-piece optical lens for capturing image and a four-piece optical module for capturing image are provided. In order from an object side to an image side, the optical lens along the optical axis includes a first lens with refractive power; a second lens with refractive power; a third lens with refractive power; and a fourth lens with positive refractive power; and at least one of the image-side surface and object-side surface of each of the four lens elements are aspheric. The optical lens can increase aperture value and improve the imagining quality for use in compact cameras.Type: GrantFiled: January 4, 2016Date of Patent: July 28, 2020Assignee: ABILITY OPTO-ELECTRONICS TECHNOLOGY CO. LTD.Inventors: Po-Jui Liao, Hung-Wen Lee, Ying Jung Chen, Bo Guang Jhang, Kuo-Yu Liao, Yao Wei Liu, Yeong-Ming Chang