Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: A semiconductor device includes a substrate having a medium-voltage (MV) region and a logic region, a gate structure on the MV region, a first single diffusion break (SDB) structure and a second SDB structure in the substrate directly under the gate structure, and a source/drain region adjacent to two sides of the gate structure. Preferably, top surfaces of the first SDB structure and the second SDB structure are coplanar, bottom surfaces of the first SDB structure and the second SDB structure are coplanar, and the first SDB structure and the second SDB structure are made of same material.

Abstract: The present disclosure provides uses of with PD-L1 antibody-IL-10 fusion protein in the treatment of cancer and chronic virus infection diseases and the prevention of cancer recurrence via promoting T cell memory response.

Abstract: Generally, examples are provided relating to conductive features that include a barrier layer, and to methods thereof. In an embodiment, a metal layer is deposited in an opening through a dielectric layer(s) to a source/drain region. The metal layer is along the source/drain region and along a sidewall of the dielectric layer(s) that at least partially defines the opening. The metal layer is nitrided, which includes performing a multiple plasma process that includes at least one directional-dependent plasma process. A portion of the metal layer remains un-nitrided by the multiple plasma process. A silicide region is formed, which includes reacting the un-nitrided portion of the metal layer with a portion of the source/drain region. A conductive material is disposed in the opening on the nitrided portions of the metal layer.

Abstract: An implant device for a biosensor comprises a housing unit, an implant module, a bottom seat and a sensor component. The implant module is disposed in an accommodating space of the housing unit. The implant module includes a main body unit, a guiding set, an implant seat, a first elastic member, a needle withdrawal seat, a second elastic member, and a needle implant member. When the housing unit is pressed downwardly, the implant seat is displaced downwardly to perform automatic needle implantation by virtue of an resilient force of the first elastic member; when the needle implantation is completed, a limiting relationship of the implant seat and the needle withdrawal seat is released, so the needle withdrawal seat completes automatic needle withdrawal by releasing a resilient force of the second elastic member.

Abstract: Devices with aluminum structures and methods of fabrication are provided. An exemplary device includes an interconnect structure and an aluminum structure electrically connected to the interconnect structure. The aluminum structure includes a first aluminum layer, a migration barrier layer over the first aluminum layer, and a second aluminum layer over the migration barrier layer.

Abstract: Disclosed herein are methods for treating cancers in a subject. The method includes determining the plasma level of arginine in the subject, followed by administering to the subject an arginine deprivation therapy alone or in combination with an anti-cancer agent based on the determined plasma level of arginine. According to some embodiments of the present disclosure, the anti-cancer agent is selected from the group consisting of FOLFOX, docetaxel, cisplatin, pemetrexed, pembrolizumab, and a combination thereof.

Abstract: A semiconductor device includes a substrate, a buffer layer, a gradient layer, an active layer, a window layer, and an optical filtering layer. The substrate includes a first element and a second element. The buffer layer is disposed on the substrate. The gradient layer is formed on the buffer layer, and includes sublayers. Each sublayer includes the first, second, and third elements. For each sublayer, a lattice constant thereof is adjusted by changing a ratio of the second element to the third element. The active layer is formed on the gradient layer, and includes the first, second, and third elements. The window layer is formed on the active layer. The optical filtering layer includes the first, second, and third elements, and is formed on the window layer to block a portion of light having a wavelength in a predetermined wavelength range.

Abstract: An opening is formed through a dielectric material layer to physically expose a top surface of a conductive material portion in, or over, a substrate. A metallic nitride liner is formed on a sidewall of the opening and on the top surface of the conductive material portion. A metallic adhesion layer including an alloy of copper and at least one transition metal that is not copper is formed on an inner sidewall of the metallic nitride liner. A copper fill material portion may be formed on an inner sidewall of the metallic adhesion layer. The metallic adhesion layer is thermally stable, and remains free of holes during subsequent thermal processes, which may include reflow of the copper fill material portion. An additional copper fill material portion may be optionally deposited after a reflow process.

Abstract: A feedback module is formed with modules comprising a schedule hardware register module and a computation circuit module. The schedule hardware register module receives a modulation signal and a sensing signal, and schedules and temporarily stores signal values of the sensing signal in successive half modulation cycles in sequence by taking a half modulation cycle as a time interval to obtain a temporarily stored sensing signal which has been scheduled. In each half modulation cycle, the computation circuit module calculates a differential signal value of the temporarily stored sensing signal between the previous two half modulation cycles, and outputs the differential signal value as a signal value of the feedback signal. The schedule hardware register module temporarily stores the feedback signal, and the feedback module feedbacks the feedback signal to an integrated optics chip of the photoelectric sensing system integrated optics chip.

Abstract: Generally, examples are provided relating to conductive features that include a barrier layer, and to methods thereof. In an embodiment, a metal layer is deposited in an opening through a dielectric layer(s) to a source/drain region. The metal layer is along the source/drain region and along a sidewall of the dielectric layer(s) that at least partially defines the opening. The metal layer is nitrided, which includes performing a multiple plasma process that includes at least one directional-dependent plasma process. A portion of the metal layer remains un-nitrided by the multiple plasma process. A silicide region is formed, which includes reacting the un-nitrided portion of the metal layer with a portion of the source/drain region. A conductive material is disposed in the opening on the nitrided portions of the metal layer.

Abstract: A method of system information transmission for a network in a wireless communication system is disclosed. The method comprises broadcasting essential minimum system information (SI) of a cell of the wireless communication system with fixed scheduled on a downlink broadcast channel, wherein the essential minimum SI includes scheduling information for non-essential minimum SI of at least one of the cell and an auxiliary cell or a frequency location, the non-essential minimum SI is broadcasted with dynamically scheduled on a downlink shared channel, and the scheduling information includes a time and frequency resource configuration and an availability information for indicating whether the cell broadcasts the non-essential minimum SI.

Abstract: Disclosed are techniques for elevator control. In one aspect, a sensor senses time series data. A system module identifies a feature point of a target object in the time series data, determines whether feature point coordinates of the feature point are located in an offset space, wherein the offset space has a spatial offset to a button, and sends a control signal if the offset space does not overlap with a first sensing range and the system module determines that the feature point coordinates are located in the offset space for a duration exceeding a first threshold time, or if the offset space overlaps with the first sensing range and the system module determines that the feature point coordinates are located in the offset space for a duration exceeding a second threshold time. An elevator floor controller receives the control signal and cancels the triggering of the button.

Abstract: A method for inputting an image display information is provided, and the method comprises: taking a measurement result image of a measuring device to obtain an output image by a camera of a terminal device; transmitting the output image to a cloud server via a communication interface of the terminal device; and recognizing the output image to obtain a recognized matching result related to a recognized measurement value and a recognized measurement unit; and saving the recognized matching result via the cloud server.

Abstract: A system controller includes a light source, an optical guiding assembly, a sensor and a feedback controller, and is applied to perform a solder operation with a solder module. The light source emits waveband light guided to a to-be-soldered area for heating. The optical guiding assembly is disposed between the light source and the solder module, and the waveband light is guided to the solder module by the optical guiding assembly. The sensor is disposed on another side of the optical guiding assembly for receiving a sensing light beam and then generating a sensing signal. The sensing light beam is guided to the sensor by the optical guiding assembly. The feedback controller is connected with the sensor and the light source for receiving the sensing signal and then controlling the light source. The system controller is a static part, and the solder module is a dynamic part.

Abstract: A signal processing system includes a first transceiver unit, a second transceiver unit, a protocol analysis circuit, a system chip, and a network unit. The first transceiver unit can transceive a first optical signal and a first electrical signal. The second transceiver unit can transceive a second optical signal and a second electrical signal. The protocol analysis circuit can process the first electrical signal and an analysis signal related to the first optical signal. The system chip can process the analysis signal, the second electrical signal, a first operation signal and a second operation signal. The network unit can transceive the first operation signal and the second operation signal, and transceive a first network signal and a second network signal between the network unit and a user device. The system chip and the network unit can process signals related to the first optical signal and the second optical signal.

Abstract: Disclosed herein are methods and kits for identifying responsiveness or non-responsiveness of a cancer subject to arginine deprivation therapy. The method includes determining the presence of a G/G genotype of rs13338697 of the target nucleic acid in a biological sample derived from the subject by use of a polymerase chain reaction (PCR)-based method, in which the presence of the G/G genotype of rs13338697 of the target nucleic acid is an indication that the subject is responsive to the arginine deprivation therapy.

Abstract: A laser processing device for processing a workpiece is provided, including a laser emitter, a lens module, a driving module, a camera module, and a processing unit. The lens module has a first lens and a second lens, wherein the laser emitter emits a laser beam through the first and second lenses to the workpiece. The driving module drives the first lens to move relative to the second lens. The camera module captures an image of the workpiece. The processing unit is electrically connected to the camera module and the driving module, wherein the camera module transmits an image signal to the processing unit according to the image of the workpiece, and the processing unit transmits a driving signal to the driving module according to the image signal, driving the first lens to move relative to the second lens. A method for processing a workpiece is also provided.

Abstract: Disclosed are techniques for elevator control. In an aspect, a sensor senses time series data, wherein the time series data includes at least one image, and range of the image covers a plurality of buttons. A system module configured to determine whether the image contains a target object; determine a tip coordinate of a tip of the target object when the image contains the target object, wherein the tip refers to a point of the target object with the closest distance to the operation panel; and determine button information corresponding to the tip coordinate among a plurality of button information, and transmit a control signal at least according to the button information, wherein the plurality of button information is associated with the plurality of buttons. A controller receives the control signal and perform control operation according to the control signal.

Abstract: A laser processing system configured to provide a processing beam is provided. The laser processing system includes a laser, a beam splitting module, a first adjustment module, and a second adjustment module. The laser is configured to provide a laser beam. The beam splitting module is configured to split the laser beam into a first laser beam and a second laser beam. The first adjustment module is disposed on a transmission path of the first laser beam and configured to adjust the first laser beam to a central portion of the processing beam. The second adjustment module is disposed on a transmission path of the second laser beam and configured to adjust the second laser beam to an outer ring portion of the processing beam.