Abstract: A multi-beam soldering system includes a multi-beam scanner, a sensor, and a controller. The multi-beam scanner generates at least a first beam and a second beam, and guides the first beam to a first element of a soldering zone and guides the second beam to a second element of the soldering zone. The sensor detects a first temperature of the first element and a second temperature of the second element simultaneously during soldering process. The controller adjusts the parameters of the first beam and the second beam under the condition that the first temperature is substantially different from the second temperature.

Abstract: A method for transporting a cassette pod for containing semiconductor wafers is provided. The method includes transporting a cassette pod configured to receive a semiconductor wafer with a transporting apparatus. The method further includes supplying a gas from a cylinder into a housing of the cassette pod. The cylinder is externally positioned on the housing. The method also includes detecting a gas pressure in the cylinder with a detection element. In addition, the method includes issuing a signal to the transporting apparatus when the gas pressure in the cylinder is lower than a predetermined limit.

Abstract: A method for transporting a cassette pod for containing semiconductor waters is provided. The method includes transporting a cassette pod configured to receive a semiconductor wafer with a transporting apparatus. The method further includes supplying a gas from a cylinder into a housing of the cassette pod. The cylinder is externally positioned on the housing. The method also includes detecting a gas pressure in the cylinder with a detection element. In addition, the method includes issuing a signal to the transporting apparatus when the gas pressure in the cylinder is lower than a predetermined limit.

Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.

Abstract: In an embodiment, a system includes: an airlock; a first semiconductor processing chamber, a second semiconductor processing chamber; and a transfer module configured to move a sensor into and out of the first semiconductor processing chamber and the second semiconductor processing chamber, wherein the sensor is configured to: collect sensor data characterizing the first semiconductor processing chamber when within the first semiconductor processing chamber; and collect sensor data characterizing the second semiconductor processing chamber when within the second semiconductor processing chamber, wherein the transfer module, the first semiconductor processing chamber, and the second semiconductor processing chamber are within a controlled internal atmosphere on a first side of the airlock and separated by the airlock from an uncontrolled external atmosphere on a second side of the airlock.

Abstract: An electronic-component assembly system is provided in the invention. The electronic-component assembly system includes a gripping device, a light-source device, a photographing device, and an image-processing device. The gripping device grips an electronic component, wherein the electronic component includes at least one pin. The light-source device includes a light source and emits light of the light source. The photographing device senses the light and generates a plurality of first one-dimensional images corresponding to the pins at different rotation angles. The image-processing device is coupled to the photographing device to receive the plurality of first one-dimensional images.

Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.

Abstract: A power bank has a station and a plurality of battery modules. Each of the battery modules can be positioned in a corresponding slot of the station in a pluggable way and is electrically connected to a charging-discharging control circuit of the station. When a main charging port of the station is electrically connected to a power supply, the charging-discharging control circuit receives electric power from the power supply via the main charging port and uses the received electric power to charge rechargeable batteries of the battery modules. When a main discharging port of the station is electrically connected to an electronic apparatus, the charging-discharging control circuit receives electric power from the rechargeable batteries of the battery modules so as to provide electric power to the electronic apparatus.

Abstract: A power bank has a station and a plurality of battery modules. When the battery modules are stacked on the station, rechargeable batteries of the battery modules are electrically connected in parallel. When a charging port of the station is electrically connected to an external power supply, a charging-discharging control circuit of the station receives electric energy from the external power supply via the charging port and uses the received electric energy to charge the rechargeable batteries. When a discharging port of the station is electrically connected to an external electronic device, the charging-discharging control circuit transfers electric energy received from the rechargeable batteries to the external electronic device. Each of the battery modules is replaceable, and the total number of the battery modules of the power bank is adjustable.

Abstract: An audio playing system has a first channel output device, a first equalizer, and a controller. The first equalizer is configured to adjust a received first channel audio signal with a set of first parameters of frequency response and output the adjusted first channel audio signal to the first channel output device in a first mode, and to adjust the received first channel audio signal with the a of second parameters of frequency response and output the adjusted first channel audio signal to the first channel output device in a second mode. In a test mode, the controller is configured to send a set of test audio signals to the first channel output device and to adjust the set of first parameters of frequency response and the set of second parameters of frequency response based on a plurality of pieces of received first confirmation signal.

Abstract: An audio playing system has a first channel output device, a first equalizer, and a controller. The first equalizer is configured to adjust a received first channel audio signal with a set of first parameters of frequency response and output the adjusted first channel audio signal to the first channel output device in a first mode, and to adjust the received first channel audio signal with the a of second parameters of frequency response and output the adjusted first channel audio signal to the first channel output device in a second mode. In a test mode, the controller is configured to send a set of test audio signals to the first channel output device and to adjust the set of first parameters of frequency response and the set of second parameters of frequency response based on a plurality of pieces of received first confirmation signal.

Abstract: An audio playing system has a first channel output device, a first audio modulator and a controller. The first audio modulator is electrically coupled to the first channel output device and having a set of first modulation parameters, the first audio modulator configured to selectively modulate a first channel audio signal with the set of first modulation parameters and output the modulated first channel audio signal to the first channel output device. The controller is electrically coupled to the first channel output device and the first audio modulator, wherein in a test mode, the controller is configured to send a set of test audio signals to the first channel output device, to generate a set of first user parameters based on a plurality of pieces of first confirmation signal, and to adjust the set of first modulation parameters based on the set of first user parameters.

Abstract: A semiconductor structure includes a semiconductor substrate, a dielectric layer, a buffer layer, at least one recess, and at least one conductor. The dielectric layer is present on the semiconductor substrate. The buffer layer is present between the semiconductor substrate and the dielectric layer. The recess extends into the semiconductor substrate through the dielectric layer and the buffer layer, in which the buffer layer has a removing rate with respect to an etching process for forming the recess. The removing rate of the buffer layer is between those of the semiconductor substrate and the dielectric layer. The conductor is present in the recess.

Abstract: An audio playing system has a first channel output device, a first equalizer and a controller. The first equalizer is electrically coupled to the first channel output device and having a set of first parameters of frequency response, the first equalizer configured to adjust a first channel audio signal with the set of first parameters of frequency response and output the adjusted first channel audio signal to the first channel output device. The controller is electrically coupled to the first channel output device and the first equalizer, wherein in a test mode, the controller is configured to send a set of test audio signals to the first channel output device, to generate a set of first user parameters based on a plurality of pieces of first confirmation signal, and to adjust the set of first parameters of frequency response based on the set of first user parameters.

Abstract: A method for transporting a cassette pod for containing semiconductor waters is provided. The method includes transporting a cassette pod configured to receive a semiconductor wafer with a transporting apparatus. The method further includes supplying a gas from a cylinder into a housing of the cassette pod. The cylinder is externally positioned on the housing. The method also includes detecting a gas pressure in the cylinder with a detection element. In addition, the method includes issuing a signal to the transporting apparatus when the gas pressure in the cylinder is lower than a predetermined limit.

Abstract: An audio playing system has a first channel output device, a first equalizer, a second channel output device, a second equalizer, a loudness adjusting button, and a controller. The first equalizer adjusts a first channel audio signal with a set of first parameters of frequency response and output it to the first channel output device. The second equalizer adjusts a second channel audio signal with a set of second parameters of frequency response and output it to the second channel output device. The loudness adjusting button generates a loudness instruction. The controller determines an upper limit of loudness based on the set of first parameters of frequency response and the set of second parameters of frequency response, and adjusts a loudness related to the first channel audio signal and a loudness related to the second channel audio signal based on the upper limit of loudness and the loudness instruction.

Abstract: Embodiments of mechanisms for charging a gas into a cassette pod are provided. A method for charging a gas into a cassette pod includes loading at least one semiconductor wafer into a housing of the cassette pod after the at least one semiconductor wafer is processed by a processing apparatus. The method also includes removing the cassette pod from the processing apparatus by a transporting apparatus to a predetermined destination. The method further includes charging a gas into an enclosure in the housing of the cassette pod from a gas supply assembly disposed on the housing.

Abstract: A method for establishing a virtual community network connection is applied to a network communication system. The method includes obtaining first registration information, with the first registration information including an operational profile of a controlled device, with the operational profile including a plurality of operational items, providing the operational profile and a first usage permission to a first controlling device, setting a second usage permission according to the first usage permission by the first controlling device, with the second usage permission related to at least one operational item in the operational items, providing a second controlling device with the at least one operational item related to the second usage permission, and when one of the at least one operational item related to the second usage permission is activated by the second controlling device, sending an operational command corresponding to the activated operational item to the controlled device.

Abstract: A semiconductor structure includes a semiconductor substrate, a dielectric layer, a buffer layer, at least one recess, and at least one conductor. The dielectric layer is present on the semiconductor substrate. The buffer layer is present between the semiconductor substrate and the dielectric layer. The recess extends into the semiconductor substrate through the dielectric layer and the buffer layer, in which the buffer layer has a removing rate with respect to an etching process for forming the recess. The removing rate of the buffer layer is between those of the semiconductor substrate and the dielectric layer. The conductor is present in the recess.