Patents by Inventor Hung-Wen Tsai

Hung-Wen Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11916091
    Abstract: A backside illumination (BSI) image sensor and a method of forming the same are provided. A device includes a substrate and a plurality of photosensitive regions in the substrate. The substrate has a first side and a second side opposite to the first side. The device further includes an interconnect structure on the first side of the substrate, and a plurality of recesses on the second side of the substrate. The plurality of recesses extend into a semiconductor material of the substrate.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Wen Hsu, Jiech-Fun Lu, Yeur-Luen Tu, U-Ting Chen, Shu-Ting Tsai, Hsiu-Yu Cheng
  • Publication number: 20230289975
    Abstract: The present invention provides a method for segmenting lipid droplets that includes: inputting a pathological slice image into a machine learning model to output a region map and an boundary map, in which the region map includes multiple regional probability values, and the boundary map includes multiple boundary probability values; and segmenting multiple lipid droplets from the pathological slice image according to the regional probability values and the boundary probability values.
    Type: Application
    Filed: February 22, 2023
    Publication date: September 14, 2023
    Inventors: Pau-Choo CHUNG, Hung-Wen TSAI, Jyun-Sin WU, Yu-Hsuan LIN, Kuo-Sheng CHENG
  • Publication number: 20230237656
    Abstract: A method for analyzing an immunohistochemistry (IHC) image is provided and includes: segmenting nuclei from the IHC image according to a machine learning model; removing pixels belonging to the nuclei and pixels in a color range from the IHC image to obtain multiple cytoplasmic pixels; assign the cytoplasmic pixels to the nuclei to form multiple cells according to the locations of the cytoplasmic pixels; and calculate a pixel staining score of each pixel in the cells, thereby calculating a cell staining score for each cell.
    Type: Application
    Filed: January 17, 2023
    Publication date: July 27, 2023
    Inventors: Pau-Choo CHUNG, Hung-Wen TSAI, Shao-Kai LIAO, Kuo-Sheng CHENG
  • Patent number: 11508060
    Abstract: A computer aided method for analyzing fibrosis is provided. First, a segmentation algorithm is performed on a medical image to obtain a segmentation image. Circular fibrosis is detected according to the segmentation image to determine a score. In some cases, it is also necessary to determine a number of fibrosis bridges and the condition of fiber expansion.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: November 22, 2022
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Pau-Choo Chung Chan, Nan-Haw Chow, Hung-Wen Tsai, Kuo-Sheng Cheng, Chun-Cheng Huang
  • Publication number: 20200181765
    Abstract: The present invention relates to a method for manufacturing a device for heat transmission, dissipation and highly efficient capillary siphoning action. The method comprises preparing a metal substrate; processing a surface of the metal substrate to form a rugged surface layer thereon; neutralizing, cleaning and drying the metal substrate to remove oil and rust thereon; placing the metal substrate into a first vacuum chamber for heating, deoxygenizing by hydrogen gas and ion bombarding to the rugged surface layer. Further, the metal substrate can be selectively subject to deposition, decomposition, degradation and reaction treatments for obtainment of a device for heat transmission, dissipation and highly efficient capillary siphoning action.
    Type: Application
    Filed: December 7, 2018
    Publication date: June 11, 2020
    Inventors: HUNG-WEN TSAI, CHENG CHING TSAI
  • Patent number: 10676815
    Abstract: The present invention relates to a method for manufacturing a device for heat transmission, dissipation and highly efficient capillary siphoning action. The method comprises preparing a metal substrate; processing a surface of the metal substrate to form a rugged surface layer thereon; neutralizing, cleaning and drying the metal substrate to remove oil and rust thereon; placing the metal substrate into a first vacuum chamber for heating, deoxygenizing by hydrogen gas and ion bombarding to the rugged surface layer. Further, the metal substrate can be selectively subject to deposition, decomposition, degradation and reaction treatments for obtainment of a device for heat transmission, dissipation and highly efficient capillary siphoning action.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: June 9, 2020
    Assignee: Trusval Technology Co., Ltd.
    Inventors: Hung-Wen Tsai, Cheng Ching Tsai
  • Publication number: 20200065965
    Abstract: A computer aided method for analyzing fibrosis is provided. First, a segmentation algorithm is performed on a medical image to obtain a segmentation image. Circular fibrosis is detected according to the segmentation image to determine a score. In some cases, it is also necessary to determine a number of fibrosis bridges and the condition of fiber expansion.
    Type: Application
    Filed: August 26, 2019
    Publication date: February 27, 2020
    Inventors: Pau-Choo CHUNG CHAN, Nan-Haw CHOW, Hung-Wen TSAI, Kuo-Sheng CHENG, Chun-Cheng HUANG
  • Publication number: 20140273402
    Abstract: A method for cutting wafers includes following steps. A silicon wafer is provided. A metal layer is formed on a top side of the silicon wafer. A bump layer is formed on the metal layer. A backside grinding tape is attached on the bump layer. A bottom side of the silicon wafer is half cut to form a cutting race. The bottom side of the silicon wafer is ground, so that a thickness of the silicon wafer is a predetermined thickness and only partial cutting race remains. The backside grinding tape is removed. A dicing tape is attached on the bottom side of the silicon wafer. The metal layer is cut by a laser. The metal layer is communicated with the cutting race. The manufacturing cost is reduced without crumbling or cracking. The chippings on the top or bottom side of the silicon wafer can be removed.
    Type: Application
    Filed: January 16, 2014
    Publication date: September 18, 2014
    Applicant: SURETECH TECHNOLOGY CO., LTD.
    Inventors: Hung-Wen TSAI, Chun-Ting CHEN
  • Patent number: 8663752
    Abstract: A method of manufacturing carbon coated aluminum foil as a cathode of solid aluminum electrolytic capacitors Comprising the steps of: preparing an aluminum foil by setting the aluminum foil into a chamber; roughening at least one surface of the aluminum foil by introducing gas into the chamber and activating an electric field so that the gas is ionized and turned into a plasma; and depositing carbon atoms by introducing gas mixed with carbon atoms and turning on the electric field again so as to make the carbon atoms have positive charge thereby impacting into and attaching firmly to the rough surface of the aluminum foil to form a carbon film.
    Type: Grant
    Filed: March 14, 2011
    Date of Patent: March 4, 2014
    Inventor: Hung-Wen Tsai
  • Publication number: 20120237782
    Abstract: A carbon coated aluminum foil as a cathode of solid aluminum electrolytic capacitors and a manufacturing method thereof are revealed. A surface of an aluminum foil is hit by ions turned into a rough surface. Then carbon atoms are mounted into the surface of the aluminum foil and accumulated sequentially to form a carbon film on the surface of the aluminum foil. Thus the carbon atoms are attached to the surface of the aluminum foil firmly due to the roughness of the surface. Moreover, the carbon film has good adhesion and electrical conductivity. Therefore, not only mechanical strength of the aluminum foil is increased dramatically, the electrical conductivity, capacitance ratio, power density and use life of capacitors are also improved significantly.
    Type: Application
    Filed: March 14, 2011
    Publication date: September 20, 2012
    Inventor: HUNG-WEN TSAI
  • Patent number: 6776398
    Abstract: A belt post includes a post with a box on a top of the post and a reel of belt is received in the box. A spring box is engaged with the top of the box and the mandrel of the reel is engaged with the spring. A head assembly is connected to a distal end of the belt and includes a movable piece which is retractably received in a body with a spring biased therebetween. The head assembly is easily to be engaged between a top cap and a bottom cap of another box by pushing the movable piece to change the length the combination of the body and the movable piece.
    Type: Grant
    Filed: January 28, 2003
    Date of Patent: August 17, 2004
    Assignee: Strong-Way United Co., Ltd.
    Inventor: Hung Wen Tsai
  • Publication number: 20040144966
    Abstract: A belt post includes a post with a box on a top of the post and a reel of belt is received in the box. A spring box is engaged with the top of the box and the mandrel of the reel is engaged with the spring. A head assembly is connected to a distal end of the belt and includes a movable piece which is retractably received in a body with a spring biased therebetween. The head assembly is easily to be engaged between a top cap and a bottom cap of another box by pushing the movable piece to change the length the combination of the body and the movable piece.
    Type: Application
    Filed: January 28, 2003
    Publication date: July 29, 2004
    Inventor: Hung Wen Tsai
  • Patent number: 5765338
    Abstract: A package bag expanding device includes a box and a pivotable cover which has a hole defined therethrough. A frame includes two first rods and a second rod respectively extending laterally therefrom. At least one package bag has two holes defined therethrough, a recess defined in an upper edge thereof and an opening defined therein below the holes. The two first rods extend through the two holes and the second rod is received in the recess. A pressing mechanism is fixedly disposed to one of two side walls of the box and includes an arm pivotally connected thereto which has a distal end rested on a periphery defining the opening of the package bag.
    Type: Grant
    Filed: August 5, 1997
    Date of Patent: June 16, 1998
    Inventor: Hung-Wen Tsai
  • Patent number: D447251
    Type: Grant
    Filed: December 15, 2000
    Date of Patent: August 28, 2001
    Inventor: Hung-Wen Tsai
  • Patent number: D483131
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: December 2, 2003
    Inventor: Hung-Wen Tsai