Patents by Inventor Hung-Yi Lin

Hung-Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250246587
    Abstract: An electronic device is provided. The electronic device includes a plurality of processing units constituting a processing array having a first area, a surface supporting the processing array, and an optical channel. The surface has a second area, and the first area is greater than 80 percent of the second area. The optical channel is configured to transmit a first signal between at least two of the plurality of processing units in a first direction that is nonparallel with a normal direction of the surface.
    Type: Application
    Filed: July 31, 2024
    Publication date: July 31, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Ting CHEN, Hai-Ming CHEN, Hung-Yi LIN
  • Publication number: 20250243227
    Abstract: Disclosed herein are compounds that stabilize recombinant human ?-iduronidase (rh-?-IDUA) activity, and their uses in the treatment and/or prophylaxis of lysosomal storage diseases (LSDs), such as mucopolysaccharidosis type I (MPS1). The compound disclosed herein has the structure of formula (I), wherein, n is an integral between 0 and 2; X1 is O or —NH; X2 is O, —NH or —NRa, in which Ra is C1-10alkyl; Y is H or wherein m and p are independently 0 or 1; X3 is S, O, or —NH; X4 is O, —NH, methylene, or —CH2(C1-10)alkyl; and A is aryl, heteroaryl, or heterocyclyl optionally substituted with one or more substituent selected from the group consisting of halo, hydroxyl, amino and phosphate.
    Type: Application
    Filed: April 10, 2023
    Publication date: July 31, 2025
    Inventors: Wei-Chieh CHENG, Shih-Ying CHANG, Hsuan-Hsuan TENG, Hsi-Ju WU, Hung-Yi LIN
  • Publication number: 20250246555
    Abstract: An electronic device is provided. The electronic device includes a plurality of electronic components and a circuit structure connected to the plurality of electronic components. The circuit structure is configured to connect the electronic components adjacent to each other along a first path, and the circuit structure is further configured to connect the electronic components that are not adjacent to each other along a second path having a greater length and a higher speed than the first path.
    Type: Application
    Filed: January 31, 2024
    Publication date: July 31, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Ting CHEN, Hai-Ming CHEN, Hung-Yi LIN
  • Patent number: 12374631
    Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.
    Type: Grant
    Filed: May 24, 2022
    Date of Patent: July 29, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsu-Chiang Shih, Hung-Yi Lin, Meng-Wei Hsieh, Yu Sheng Chang, Hsiu-Chi Liu, Mark Gerber
  • Publication number: 20250228994
    Abstract: A fragrance lanyard includes a string, a pair of length adjusters, a clasp, a fragrance container, and an aromatic element. The string has an overlapping part, and a hanging ring is formed in a non-overlapping area, each end of the string is wrapped with a string cap, each length adjuster is provided with two lanyard holes such that the cross-section of the length adjuster is designed in an 8-shape for the string to sequentially pass through the pair of length adjusters to adjust the length of the string, the clasp is arranged at the position of the hanging ring, the fragrance container is fixed to any one of the string cap, the length adjuster, or the clasp, and the fragrance container has a containing space provided for installing the aromatic element.
    Type: Application
    Filed: August 30, 2024
    Publication date: July 17, 2025
    Inventors: CHUNG-YING CHANG, HUNG-YI LIN, YING-MIN WANG
  • Publication number: 20250226137
    Abstract: A magnetic positioning structure for an expanded device includes a magnetic positioning plate and at least one magnetic conductive element. The magnetic positioning plate with a fixing surface and a mounting surface fixed on a plane includes at least one first magnetic element and an anti-slip sleeve, the first magnetic element is enclosed in the anti-slip sleeve, and the magnetic conductive element is arranged in a housing of the expanded device. In this way, the magnetic conductive element can quickly and temporarily fix the expanded device to the mounting surface of the magnetic positioning plate, and the anti-slip sleeve can prevent displacement of the expanded device. The magnetic positioning structure is applicable to expanded devices such as hubs, notebook docking stations, power banks, etc. to prevent random shaking, keep the operating environment neat without causing wire entanglement or affecting connection angles, thus greatly improving the convenience of use.
    Type: Application
    Filed: August 30, 2024
    Publication date: July 10, 2025
    Inventors: CHUNG-YING CHANG, HUNG-YI LIN, ZHENG-YI WU
  • Publication number: 20250183197
    Abstract: A package structure includes an encapsulant, a patterned circuit structure, at least one electronic component and a shrinkage modifier. The patterned circuit structure is disposed on the encapsulant and includes a pad. The electronic component is disposed on the patterned circuit structure, and includes a bump electrically connected to the pad. The shrinkage modifier is encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation.
    Type: Application
    Filed: February 4, 2025
    Publication date: June 5, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hsu-Chiang SHIH, Hung-Yi LIN, Chien-Mei HUANG
  • Publication number: 20250133322
    Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.
    Type: Application
    Filed: December 30, 2024
    Publication date: April 24, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Yi WU, Hung Yi LIN, Jenchun CHEN
  • Patent number: 12229630
    Abstract: A reading method and a reading device for a two-dimensional code. The method includes: capturing a two-dimensional code image through an image capturing device; detecting an outer frame and a position mark of a two-dimensional code in a skewed state in the two-dimensional code image; restoring the two-dimensional code in the skewed state to a default state; and performing a default operation according to the two-dimensional code in the default state.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: February 18, 2025
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Chin-Hao Yeh, Chin-Wen Lin, Hung-Yi Lin
  • Publication number: 20250043136
    Abstract: A novel rheology modifier which comprises a quaternary ammonium containing polyamide for use in aqueous paint, and that can provide excellent pigment suspension and rheological properties to the aqueous based coating without being affected by pH fluctuation.
    Type: Application
    Filed: July 24, 2023
    Publication date: February 6, 2025
    Applicant: ELEMENTIS SPECIALTIES, INC.
    Inventors: Chun-Hung Yen, Wei-Jen Huang, Ming-Jhe Li, Yu-Lun Hung, Hou-Jen Yen, Yu-Yen Lu, Yu-Zhe Su, Hung-Yi Lin
  • Patent number: 12218075
    Abstract: A package structure includes an encapsulant, a patterned circuit structure, at least one electronic component and a shrinkage modifier. The patterned circuit structure is disposed on the encapsulant and includes a pad. The electronic component is disposed on the patterned circuit structure, and includes a bump electrically connected to the pad. The shrinkage modifier is encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: February 4, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Yuan Kung, Hsu-Chiang Shih, Hung-Yi Lin, Chien-Mei Huang
  • Patent number: 12185047
    Abstract: The present disclosure provides a wearable component. The wearable component includes a first carrier and a first electronic component at least partially embedded within the first carrier. The first carrier and the first electronic component define a space configured for audio transmission. An ear tip and a method of manufacturing a wearable component are also provided.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: December 31, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang Yi Wu, Hung Yi Lin, Jenchun Chen
  • Publication number: 20240371711
    Abstract: A package structure is provided. The package structure includes an amplifier and a filter structure. The amplifier has an active surface. The filter structure is disposed over the amplifier, and communicates with the amplifier through a first signal path substantially vertical to the active surface of the amplifier.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 7, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Ting CHEN, Hung-Yi LIN, Cheng-Yuan KUNG
  • Publication number: 20240373752
    Abstract: A semiconductor substrate and a package structure including the same are provided. The semiconductor substrate includes a first surface and a second surface. The first surface includes a filtering region. The second surface is opposite to the first surface and includes an amplifying region.
    Type: Application
    Filed: May 5, 2023
    Publication date: November 7, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Ting CHEN, Hung-Yi LIN, Cheng-Yuan KUNG
  • Publication number: 20240345337
    Abstract: An optical device is provided. The optical device includes a first photonic component and a second photonic component. The first photonic component is configured to communicate with the second photonic component through a first optical path or an electrical path depending on a distance between the first photonic component and the second photonic component.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tai-Hsiang LIU, Hung-Yi LIN, Wen Chieh YANG
  • Patent number: 12105892
    Abstract: An electronic device includes: at least one connection interface, to receive an external signal. A first signal switching multiplexer is connected to the connection interface. A laptop system is connected to the first signal switching multiplexer, to operate in a laptop mode. A drawing board system is connected to the first signal switching multiplexer, to operate in a drawing board mode and an independent screen mode. A switching switch generates a switching signal and transmits it to the first signal switching multiplexer, the laptop system, and the drawing board system, to select the laptop mode, the drawing board mode, or the independent screen mode.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: October 1, 2024
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Yi-Lun Lai, Cheng-Hui Wu, Huan-Hsun Huang, Hung-Yi Lin, Yi-Ou Wang
  • Publication number: 20240304555
    Abstract: A package structure and a method for manufacturing the package structure are provided. The package structure includes an interposer, a first electronic component over the interposer, and a second electronic component over the interposer. The interposer includes a first interconnector and a second interconnector. The first electronic component and the second electronic component are disposed at a first horizontal level and electrically connected to each other through the first interconnector. The second interconnector is electrically connected to a third electronic component disposed at a second horizontal level different from the first horizontal level.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hung-Yi LIN, Cheng-Yuan KUNG
  • Publication number: 20240304584
    Abstract: A package structure is provided. The package structure includes a semiconductor substrate. The semiconductor substrate includes a lower portion and an upper portion. The upper portion of the semiconductor substrate defines a high speed signal transmission region. The high speed signal transmission region includes a first region configured to communicate with a first electronic component and a second region configured to communicate with an external device.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hai-Ming CHEN, Hung-Yi LIN, Cheng-Yuan KUNG
  • Patent number: 12051658
    Abstract: A semiconductor package structure includes a redistribution structure and an impedance matching device. The redistribution structure includes a first surface, a second surface opposite to the first surface and a circuitless region extending from the first surface to the second surface. The impedance matching device is disposed on the redistribution structure and includes at least one impedance matching circuit aligned with the circuitless region.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: July 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Yuan Kung, Hung-Yi Lin
  • Publication number: 20240220049
    Abstract: A seamless touchpad device includes at least two adjacent touchpad units, a first touchpad unit and a second touchpad unit. The first touchpad unit includes a plurality of first horizontal signal lines, a plurality of first vertical signal lines and a first control unit connected thereto. The second touchpad unit includes second horizontal signal lines, second vertical signal lines and a second control unit connected, and the second control unit is electrically connected to the first control unit. Each first horizontal signal line is correspondingly connected to one of the second horizontal signal lines, and part of the first vertical signal lines close to the second touchpad unit among the first vertical signal lines is individually connected to part of the second vertical signal lines close to the first touchpad unit among the second vertical signal lines, so as to form an overlapping scanning area.
    Type: Application
    Filed: December 27, 2023
    Publication date: July 4, 2024
    Inventors: Chin-Wen LIN, Hung-Yi LIN, Wei-Ting WONG, Ching-Fu HSU