Abstract: A package includes silicon waveguides on a first side of an oxide layer; photonic devices on the first side of the oxide layer, wherein the photonic devices are coupled to the silicon waveguides; redistribution structures over the first side of the oxide layer, wherein the redistribution structures are electrically connected to the photonic devices; a hybrid interconnect structure on a second side of the oxide layer, wherein the hybrid interconnect structure includes a stack of silicon nitride waveguides that are separated by dielectric layers; and through vias extending through the hybrid interconnect structure and the oxide layer, wherein the through vias make physical and electrical connection to the redistribution structures.

Abstract: A package structure including a first semiconductor die, a second semiconductor die, first conductive pillars and a first insulating encapsulation is provided. The first semiconductor die includes a semiconductor substrate, an interconnect structure and a first redistribution circuit structure. The semiconductor substrate includes a first portion and a second portion disposed on the first portion. The interconnect structure is disposed on the second portion, the first redistribution circuit structure is disposed on the interconnect structure, and the lateral dimension of the first portion is greater than the lateral dimension of the second portion. The second semiconductor die is disposed on the first semiconductor die. The first conductive pillars are disposed on the first redistribution circuit structure of the first semiconductor die. The first insulating encapsulation is disposed on the first portion.

Abstract: A resin composition is provided, which includes diamine, a BMI resin, and a modified polyphenylene ether resin having a following structural formula: wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.

Abstract: A resin composition includes SBS resin, BMI resin, a crosslinking agent, and a modified polyphenylene ether resin has a following general formula: wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.

Abstract: A resin composition includes an epoxy resin, a benzoxazine resin, a BMI resin, and a modified polyphenylene ether resin has a structure represented by the following formula: wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups, and n is an integer ranging from 3 to 25.

Abstract: A resin composition includes CE resin, BMI resin, and a modified polyphenylene ether resin has a following general formula: wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.

Abstract: A seamless touchpad device includes at least two adjacent touchpad units, a first touchpad unit and a second touchpad unit. The first touchpad unit includes a plurality of first horizontal signal lines, a plurality of first vertical signal lines and a first control unit connected thereto. The second touchpad unit includes second horizontal signal lines, second vertical signal lines and a second control unit connected, and the second control unit is electrically connected to the first control unit. Each first horizontal signal line is correspondingly connected to one of the second horizontal signal lines, and part of the first vertical signal lines close to the second touchpad unit among the first vertical signal lines is individually connected to part of the second vertical signal lines close to the first touchpad unit among the second vertical signal lines, so as to form an overlapping scanning area.

Abstract: The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes a first redistribution structure and a first encapsulant. The first encapsulant supports the first redistribution structure and is configured to function as a first reinforcement to provide a second redistribution structure. The redistribution structure has a plurality of conductive layers disposed over the first redistribution structure.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: An interposer device comprises two bump regions, a channel region, a plurality of signal lines and a plurality of ground lines. The two bump regions are respectively coupled to two semiconductor devices. The channel region is connected between the two bump regions. The plurality of signal lines are embedded in the two bump regions and the channel region, and electrically connected to the two semiconductor devices for transmitting circuit signals. The plurality of ground lines are embedded in the two bump regions and the channel region for shielding the plurality of signal lines. In each bump region, each signal line comprises a trunk portion, a turning portion, and a signal turning point connected between the trunk portion and the turning portion. The trunk portion extends parallel to a first direction, and the turning portion extends parallel to a second direction.

Abstract: A carrier tray and a carrier tray assembly using the same are described. The carrier tray includes a carrying portion, a surrounding wall and at least one recessed structure. The carrying portion has a top surface and a bottom surface opposite to the top surface. The surrounding wall is disposed around the carrying portion. The recessed structure is recessed into the carrying portion. The recessed structure has an opening and a recessed space, and the recessed space is communicated with the outside through the opening. There is a first distance defined by the recessed space along a first direction, and there is a second distance defined by the opening along the first direction. The first distance is greater than the second distance.

Abstract: In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A distributed key generation system and a key generation method are provided. The distributed key generation system includes a plurality of electronic devices and a server device. Each electronic device sends a data fragment. The server device synthesizes the key according to the data fragments. In this way, the key is not generated in advance, which can reduce the risk of key leakage.

Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a gate structure over the substrate, a layer of dielectric material over the gate structure, a source/drain (S/D) contact layer formed through and adjacent to the gate structure, and a trench conductor layer over and in contact with the S/D contact layer. The S/D contact layer can include a layer of platinum-group metallic material and a silicide layer formed between the substrate and the layer of platinum-group metallic material. A top width of a top portion of the layer of platinum-group metallic material can be greater than or substantially equal to a bottom width of a bottom portion of the layer of platinum-group metallic material.

Abstract: A method includes bonding a first device die to a second device die, encapsulating the first device die in a first encapsulant, performing a backside grinding process on the second device die to reveal through-vias in the second device die, and forming first electrical connectors on the second device die to form a package. The package includes the first device die and the second device die. The method further includes encapsulating the first package in a second encapsulant, and forming an interconnect structure overlapping the first package and the second encapsulant. The interconnect structure comprises second electrical connectors.

Abstract: A portable controller with replaceable module includes: a main body having a touchable display screen; a control system installed in the main body; a power supply system installed in the main body and connected to the control system to detect and adjust the power supply; a functional module, detachably connected to the main body to provide data, wherein, the control system is used to display data on the touchable display screen relative to the function module and to control the function module through the touchable display screen. Therefore, the portable controller with replaceable module could be applied to different functional modules to achieve wide area use purpose.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A resin composition is provided. The resin composition includes a resin mixture, a flame retardant, a spherical silica and a siloxane coupling agent. The resin mixture includes a first resin polymerized by a monomer mixture including styrene, divinylbenzene and ethylene, a second resin including a polyphenylene ether resin modified by bismaleimide, and a SBS resin. The resin composition of the present disclosure can have a high glass transition temperature, a low dielectric constant and a low dissipation factor.

Abstract: A resin composition is provided, which includes a novel low-dielectric resin, a cross-linking agent, a polyphenylene ether resin, a halogen-free flame retardant, a spherical silica, and a siloxane coupling agent. The novel low-dielectric resin has a styrene proportion of 10% to 40%, a divinylbenzene proportion of 10% to 40%, and an ethylene proportion of 10% to 20%, which may effectively reduce the dissipation factor of the resin composition, and achieve the electrical specification of low dielectric.