Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

Abstract: In some examples, a semiconductor package comprises a lead frame. The lead frame includes a first row of leads; a first pad coupled to the first row of leads; a second row of leads; and a second pad coupled to the second row of leads, the first and second pads separated by a gap. The semiconductor package includes a heat-generating device coupled to the first and second pads and exposed to an exterior of the semiconductor package.

Abstract: Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.

Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

Abstract: In an example, an apparatus comprises a lead frame that includes a first row of leads, a first pad coupled to the first row of leads, and a second row of leads parallel to the first row of leads. The lead frame also includes a second pad coupled to the second row of leads. The first and second pads are separated by a gap, and each of the first and second pads has a substantially uniform thickness. The apparatus also includes a device coupled to the first and second pads. The first and second pads are exposed to an exterior of the apparatus.

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

Abstract: Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.

Abstract: An integrated circuit package having a shunt resistor with at least one self-aligning member that protrudes from a first surface, and a lead frame with at least one self-aligning feature that is a cavity within which the at least one self-aligning member is located, and an integrated circuit located on the lead frame.

Abstract: A method for evaluating a leadframe surface includes positioning a leadframe on a measurement apparatus at a first predetermined distance relative to an end portion of a light source of an optical sensor; irradiating a predetermined area on a surface of the leadframe with light having a single predetermined wavelength from the light source; receiving, with a light receiver of the optical sensor, reflected light from the predetermined area on the surface of the leadframe, and converting the reflected light into an electric signal; determining a reflection intensity value of the predetermined area on the surface of the leadframe based on the electric signal; and calculating a reflection ratio of the predetermined area on the surface of the leadframe based on the reflection intensity value and a predetermined reference reflection intensity value associated with the light source.

Abstract: The present invention provides a control method for maintaining the luminous intensity of an LED (Light-Emitting Diode) light source. The control method includes the steps of: providing a driving current source to drive the LED light source, monitoring and obtaining a first parameter of the LED light source, and comparing the first parameter with a second parameter. By monitoring the first parameter of the LED light source and combining the feedback mechanism, a driving current of the driving current source can be adjusted in real time to make the first parameter tend toward the second parameter. Thus, the luminous intensity of the LED light source can be maintained and will not be changed with the variation of the operating environment.

Abstract: A method for controlling light-emission of a light-emitting diode (LED) light source whose heat is dissipated by a thermal module is provided. The method includes following steps: providing a constant current source to drive the LED light source and obtaining a reference voltage correspondingly; monitoring and obtaining a dynamic voltage of the LED light source; and comparing the dynamic voltage with the reference voltage and adjusting a heat-dissipating power of the thermal module in real time to make the dynamic voltage of the LED light source approach the reference voltage. By monitoring the dynamic voltage of the LED light source and adjusting the heat-dissipating power of the thermal module in real time, light power of the LED light source can be maintained.

Abstract: A method for controlling light-emission of a light-emitting diode (LED) light source whose heat is dissipated by a thermal module is provided. The method includes following steps: providing a constant current source to drive the LED light source and obtaining a reference voltage correspondingly; monitoring and obtaining a dynamic voltage of the LED light source; and comparing the dynamic voltage with the reference voltage and adjusting a heat-dissipating power of the thermal module in real time to make the dynamic voltage of the LED light source approach the reference voltage. By monitoring the dynamic voltage of the LED light source and adjusting the heat-dissipating power of the thermal module in real time, light power of the LED light source can be maintained.

Abstract: Described herein are a system and method for reconstructing a color image from sparse image data collected at an imaging sensor which provides intensity data for exactly one color for each pixel location. A pattern for color selection preferably defines an assignment of color information to each pixel location from neighboring pixels. Thus, the color selection pattern provides an assignment of multicolor image data for each pixel location including color information collected at the pixel location in the imaging sensor and color information selected from neighboring pixels according to the color selection pattern. The color selection pattern may be formulated to minimize the effect of color artifacts in the resulting reconstructed image.