Patents by Inventor Hung-Yuan Li

Hung-Yuan Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190386493
    Abstract: An electronic device is provided. The electronic device includes an input/output port, a rechargeable battery, a charging device, and an audio receiving and playing device. The rechargeable battery is charged to provide a battery voltage in response to switching between a first charging power source and a second charging power source. The charging device converts the DC input power source into the first charging power source or the second charging power source to charge the rechargeable battery according to the detection signal associated with the battery voltage. A charging speed of the first charging power source for charging the rechargeable battery is greater than a charging speed of the second charging power source for charging the rechargeable battery. The audio receiving and playing device performs at least one of a playing operation and a receiving operation of an audio signal by operating under the battery voltage.
    Type: Application
    Filed: August 29, 2018
    Publication date: December 19, 2019
    Applicant: Merry Electronics (Shenzhen) Co., Ltd.
    Inventor: Hung-Yuan Li
  • Publication number: 20190325753
    Abstract: A system for providing road condition information includes a first outdoor lamp and a first camera. The first camera is disposed on the first outdoor lamp and configured to: capture an image of a surrounding of a location where the first camera is located; perform an image recognition process on the image to identify an event occurring in the surrounding; generate, based on the event, a first road condition message including location information of the event and event information of the event; and broadcast the first road condition message to a first vehicle.
    Type: Application
    Filed: June 15, 2018
    Publication date: October 24, 2019
    Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventors: Hung-Chun Li, Pei-Yuan Lien, Yao-Chung Yeh, Kuo-Hao Huang
  • Patent number: 10403570
    Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of conductive posts disposed on the second surface of the circuit structure; and an insulating layer encapsulating the conductive posts. The conductive posts of various sizes can be fabricated according to different aspect ratio requirements so as to make end products lighter, thinner, shorter and smaller. The disclosure further provides a method for fabricating the electronic package.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: September 3, 2019
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Lu-Yi Chen, Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng, Chang-Lun Lu
  • Publication number: 20190043798
    Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of conductive posts disposed on the second surface of the circuit structure; and an insulating layer encapsulating the conductive posts. The conductive posts of various sizes can be fabricated according to different aspect ratio requirements so as to make end products lighter, thinner, shorter and smaller. The disclosure further provides a method for fabricating the electronic package.
    Type: Application
    Filed: October 11, 2018
    Publication date: February 7, 2019
    Inventors: Lu-Yi Chen, Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng, Chang-Lun Lu
  • Patent number: 10136202
    Abstract: The present disclosure proposes an electronic apparatus including an attenuation element, a passive infrared (PIR) sensor, and a control circuit. The attenuation element attenuates a first infrared signal as a second infrared signal. The PIR includes a filtering element and a receiving sensor. The filtering element filters the second infrared signal as a third infrared signal, wherein a wavelength thereof ranges between 9 and 10 micrometer. When a distance between the attenuation element and a source emitting the first infrared signal is not larger than a predetermined distance, the receiving sensor outputs a first electrical signal in response to the third infrared signal, otherwise the receiving sensor outputs a second electrical signal in response to the third infrared signal. The control circuit activates the electronic apparatus according to the first electrical signal or deactivates the electronic apparatus according to the second electrical signal.
    Type: Grant
    Filed: December 25, 2017
    Date of Patent: November 20, 2018
    Assignee: MERRY ELECTRONICS(SHENZHEN) CO., LTD.
    Inventor: Hung-Yuan Li
  • Patent number: 10128178
    Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of conductive posts disposed on the second surface of the circuit structure; and an insulating layer encapsulating the conductive posts. The conductive posts of various sizes can be fabricated according to different aspect ratio requirements so as to make end products lighter, thinner, shorter and smaller. The disclosure further provides a method for fabricating the electronic package.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: November 13, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Lu-Yi Chen, Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng, Chang-Lun Lu
  • Patent number: 10104461
    Abstract: A method, an electronic apparatus and a wireless earphone of choosing a master wireless earphone in a wireless earphone set are provided. The method is adapted to the electronic apparatus pairing with the wireless earphone set. The method includes: transmitting first testing signals to a first wireless earphone in the wireless earphone set, and receiving first acknowledgment signals; transmitting second testing signals to a second wireless earphone in the wireless earphone set, and receiving second acknowledgment signals; determining whether a first ratio of the first acknowledgment signals to the first testing signals is higher than a second ratio of the second acknowledgment signals to the second testing signals; if yes, choosing the first wireless earphone as a master earphone, and setting the second wireless earphone as a slave wireless earphone; if no, choosing the second wireless earphone as the master earphone, and setting the first wireless earphone as the slave wireless earphone.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: October 16, 2018
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Chun-Yuan Lee, Hung-Yuan Li
  • Patent number: 9838774
    Abstract: A headset apparatus including an audio transmitter, a control circuit, a magnetic field generator and a magnetic field sensor is provided. The control circuit is configured to generate a test signal. The magnetic field generator is coupled to the control circuit to receive the test signal and generate a magnetic field accordingly. The magnetic field sensor is coupled to the control circuit and configured to sense the magnetic field and generate a sensing signal accordingly. When the control circuit detects that the magnetic field is changed based on the sensing signal, the control circuit generates a control signal to enable the audio transmitter.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: December 5, 2017
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Chun-Yuan Lee, Tsu-Jung Wang, Hung-Yuan Li, Chien-Min Yao
  • Patent number: 9831191
    Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: November 28, 2017
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chieh-Lung Lai, Mao-Hua Yeh, Hung-Yuan Li, Shih-Liang Peng, Chang-Lun Lu
  • Publication number: 20170338173
    Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of conductive posts disposed on the second surface of the circuit structure; and an insulating layer encapsulating the conductive posts. The conductive posts of various sizes can be fabricated according to different aspect ratio requirements so as to make end products lighter, thinner, shorter and smaller. The disclosure further provides a method for fabricating the electronic package.
    Type: Application
    Filed: September 7, 2016
    Publication date: November 23, 2017
    Inventors: Lu-Yi Chen, Hung-Yuan Li, Chieh-Lung Lai, Shih-Liang Peng, Chang-Lun Lu
  • Publication number: 20170325016
    Abstract: A method, an electronic apparatus and a wireless earphone of choosing a master wireless earphone in a wireless earphone set are provided. The method is adapted to the electronic apparatus pairing with the wireless earphone set. The method includes: transmitting first testing signals to a first wireless earphone in the wireless earphone set, and receiving first acknowledgment signals; transmitting second testing signals to a second wireless earphone in the wireless earphone set, and receiving second acknowledgment signals; determining whether a first ratio of the first acknowledgment signals to the first testing signals is higher than a second ratio of the second acknowledgment signals to the second testing signals; if yes, choosing the first wireless earphone as a master earphone, and setting the second wireless earphone as a slave wireless earphone; if no, choosing the second wireless earphone as the master earphone, and setting the first wireless earphone as the slave wireless earphone.
    Type: Application
    Filed: March 22, 2017
    Publication date: November 9, 2017
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Chun-Yuan Lee, Hung-Yuan Li
  • Publication number: 20170243834
    Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.
    Type: Application
    Filed: May 9, 2016
    Publication date: August 24, 2017
    Inventors: Chieh-Lung Lai, Mao-Hua Yeh, Hung-Yuan Li, Shih-Liang Peng, Chang-Lun Lu
  • Publication number: 20170230743
    Abstract: A headset apparatus including an audio transmitter, a control circuit, a magnetic field generator and a magnetic field sensor is provided. The control circuit is configured to generate a test signal. The magnetic field generator is coupled to the control circuit to receive the test signal and generate a magnetic field accordingly. The magnetic field sensor is coupled to the control circuit and configured to sense the magnetic field and generate a sensing signal accordingly. When the control circuit detects that the magnetic field is changed based on the sensing signal, the control circuit generates a control signal to enable the audio transmitter.
    Type: Application
    Filed: January 26, 2017
    Publication date: August 10, 2017
    Applicant: Merry Electronics(Shenzhen) Co., Ltd.
    Inventors: Chun-Yuan Lee, Tsu-Jung Wang, Hung-Yuan Li, Chien-Min Yao
  • Patent number: 9338548
    Abstract: A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.
    Type: Grant
    Filed: April 8, 2014
    Date of Patent: May 10, 2016
    Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Hung-Yuan Li, Chun-Yuan Lee, Chien-Min Chen
  • Patent number: 9299335
    Abstract: A handheld electronic device including a connection interface, a voltage supply unit and a baseband circuit is provided. When headphones are connected to the handheld electronic device, the baseband circuit can determine the type of the headphones by controlling the operation of the voltage supply unit. Furthermore, when the headphones are noise-canceling headphones, the baseband circuit can control the operation of the voltage supply unit to provide operation power to the noise-canceling headphones. In addition, corresponding noise-canceling headphones including a connection interface, at least one switch circuit, a switch control unit, a communication microphone, two speakers, a noise-canceling circuit and two noise-canceling microphones is also provided.
    Type: Grant
    Filed: April 18, 2014
    Date of Patent: March 29, 2016
    Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Ya-Ke Lan, Hung-Yuan Li, Huai-Yuan Chang
  • Publication number: 20150289055
    Abstract: A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.
    Type: Application
    Filed: April 8, 2014
    Publication date: October 8, 2015
    Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: Hung-Yuan LI, Chun-Yuan LEE, Chien-Min CHEN
  • Publication number: 20150161979
    Abstract: A handheld electronic apparatus including a connecting interface, a switching circuit and a control circuit is provided. A corresponding noise-canceling headphone including a connecting interface, a microphone, two speakers and a noise-canceling circuit is also provided. When a headphone is electrically connected to the handheld electronic apparatus and the control circuit determines that the headphone is the noise-canceling headphone, then the control circuit provides an working voltage to the noise-canceling headphone through different circuit paths by controlling the switching circuit.
    Type: Application
    Filed: December 10, 2013
    Publication date: June 11, 2015
    Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: HUNG-YUAN LI, YA-KE LAN, CHIA-HSIN HUNG
  • Publication number: 20150136303
    Abstract: The present invention provides a method for manufacturing a compound heat sink. Firstly, providing an artificial graphite sheet, and then performing a surface treatment process on the artificial graphite sheet to form a rugged structure on the artificial graphite sheet as a first embedding structure. Finally, forming a metal layer covering the rugged structure, and performing a pressing bonding process to form a second embedding structure corresponding to the first embedding structure to bond the metal layer and the artificial graphite sheet. Namely, the artificial graphite sheet and the metal layer are bonded by the first and second embedding structures for increasing the bonding strength between two heterogeneous materials as well as reducing the interfacial heat resistance. Thereby, the stability of heat dissipation performance can be improved, and a volumetric heat capacity of the compound heat sink from 1.1 to 3.5 J/(cm3·K) is provided.
    Type: Application
    Filed: January 27, 2015
    Publication date: May 21, 2015
    Inventors: HUNG-YUAN LI, TSUNG-CHEN CHIANG
  • Publication number: 20140376734
    Abstract: A handheld electronic device including a connection interface, a voltage supply unit and a baseband circuit is provided. When headphones are connected to the handheld electronic device, the baseband circuit can determine the type of the headphones by controlling the operation of the voltage supply unit. Furthermore, when the headphones are noise-canceling headphones, the baseband circuit can control the operation of the voltage supply unit to provide operation power to the noise-canceling headphones. In addition, corresponding noise-canceling headphones including a connection interface, at least one switch circuit, a switch control unit, a communication microphone, two speakers, a noise-canceling circuit and two noise-canceling microphones is also provided.
    Type: Application
    Filed: April 18, 2014
    Publication date: December 25, 2014
    Applicant: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
    Inventors: YA-KE LAN, HUNG-YUAN LI, HUAI-YUAN CHANG
  • Patent number: 8916239
    Abstract: The present disclosure provides a flexible graphite sheet and a method for fabricating the same and a composite structure for the same. The method for fabricating a flexible graphite sheet comprises steps of coating an augmenting solution on a first film to form a composite structure, and heating the composite structure such that the first film and the augmenting solution form a flexible graphite sheet, wherein the thermal conducting cross-section of the flexible graphite sheet is larger than the thermal conducting cross-section of the first film, and the thermal conductivity of the flexible graphite sheet ranges from 1200 to 6000 W/m° C.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: December 23, 2014
    Assignee: Huge Temp Energy Ltd
    Inventors: Ming Sheng Weng, Lung Ta Hsiao, Che Lu Tseng, Hung Yuan Li