Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of conductive posts disposed on the second surface of the circuit structure; and an insulating layer encapsulating the conductive posts. The conductive posts of various sizes can be fabricated according to different aspect ratio requirements so as to make end products lighter, thinner, shorter and smaller. The disclosure further provides a method for fabricating the electronic package.

Abstract: A method, an electronic apparatus and a wireless earphone of choosing a master wireless earphone in a wireless earphone set are provided. The method is adapted to the electronic apparatus pairing with the wireless earphone set. The method includes: transmitting first testing signals to a first wireless earphone in the wireless earphone set, and receiving first acknowledgment signals; transmitting second testing signals to a second wireless earphone in the wireless earphone set, and receiving second acknowledgment signals; determining whether a first ratio of the first acknowledgment signals to the first testing signals is higher than a second ratio of the second acknowledgment signals to the second testing signals; if yes, choosing the first wireless earphone as a master earphone, and setting the second wireless earphone as a slave wireless earphone; if no, choosing the second wireless earphone as the master earphone, and setting the first wireless earphone as the slave wireless earphone.

Abstract: A headset apparatus including an audio transmitter, a control circuit, a magnetic field generator and a magnetic field sensor is provided. The control circuit is configured to generate a test signal. The magnetic field generator is coupled to the control circuit to receive the test signal and generate a magnetic field accordingly. The magnetic field sensor is coupled to the control circuit and configured to sense the magnetic field and generate a sensing signal accordingly. When the control circuit detects that the magnetic field is changed based on the sensing signal, the control circuit generates a control signal to enable the audio transmitter.

Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.

Abstract: An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of conductive posts disposed on the second surface of the circuit structure; and an insulating layer encapsulating the conductive posts. The conductive posts of various sizes can be fabricated according to different aspect ratio requirements so as to make end products lighter, thinner, shorter and smaller. The disclosure further provides a method for fabricating the electronic package.

Abstract: A method, an electronic apparatus and a wireless earphone of choosing a master wireless earphone in a wireless earphone set are provided. The method is adapted to the electronic apparatus pairing with the wireless earphone set. The method includes: transmitting first testing signals to a first wireless earphone in the wireless earphone set, and receiving first acknowledgment signals; transmitting second testing signals to a second wireless earphone in the wireless earphone set, and receiving second acknowledgment signals; determining whether a first ratio of the first acknowledgment signals to the first testing signals is higher than a second ratio of the second acknowledgment signals to the second testing signals; if yes, choosing the first wireless earphone as a master earphone, and setting the second wireless earphone as a slave wireless earphone; if no, choosing the second wireless earphone as the master earphone, and setting the first wireless earphone as the slave wireless earphone.

Abstract: A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at least one pillar adjusts the expansion of upper and lower sides of the substrate body. Therefore, the upper and lower sides of the substrate body have substantially the same thermal deformation, and the substrate body is prevented from warpage.

Abstract: A headset apparatus including an audio transmitter, a control circuit, a magnetic field generator and a magnetic field sensor is provided. The control circuit is configured to generate a test signal. The magnetic field generator is coupled to the control circuit to receive the test signal and generate a magnetic field accordingly. The magnetic field sensor is coupled to the control circuit and configured to sense the magnetic field and generate a sensing signal accordingly. When the control circuit detects that the magnetic field is changed based on the sensing signal, the control circuit generates a control signal to enable the audio transmitter.

Abstract: A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.

Abstract: A handheld electronic device including a connection interface, a voltage supply unit and a baseband circuit is provided. When headphones are connected to the handheld electronic device, the baseband circuit can determine the type of the headphones by controlling the operation of the voltage supply unit. Furthermore, when the headphones are noise-canceling headphones, the baseband circuit can control the operation of the voltage supply unit to provide operation power to the noise-canceling headphones. In addition, corresponding noise-canceling headphones including a connection interface, at least one switch circuit, a switch control unit, a communication microphone, two speakers, a noise-canceling circuit and two noise-canceling microphones is also provided.

Abstract: A mobile device includes a processing module, an external connection interface and a current monitoring unit. The external connection interface is electrically connected to the processing module and includes a first pin, a second pin and a third pin. The first pin is configured to transmit a first speaker signal and the second pin is configured to transmit a second speaker signal. The current monitoring unit is electrically connected to the processing module and the third pin of the external connection interface and configured to monitor a current state of the third pin and feedback the monitored current state to the processing module. The processing module is configured to provide one of a plurality of different voltage levels to the third pin according to the monitored current state. A noise-canceling earphone is also disclosed.

Abstract: A handheld electronic apparatus including a connecting interface, a switching circuit and a control circuit is provided. A corresponding noise-canceling headphone including a connecting interface, a microphone, two speakers and a noise-canceling circuit is also provided. When a headphone is electrically connected to the handheld electronic apparatus and the control circuit determines that the headphone is the noise-canceling headphone, then the control circuit provides an working voltage to the noise-canceling headphone through different circuit paths by controlling the switching circuit.

Abstract: The present invention provides a method for manufacturing a compound heat sink. Firstly, providing an artificial graphite sheet, and then performing a surface treatment process on the artificial graphite sheet to form a rugged structure on the artificial graphite sheet as a first embedding structure. Finally, forming a metal layer covering the rugged structure, and performing a pressing bonding process to form a second embedding structure corresponding to the first embedding structure to bond the metal layer and the artificial graphite sheet. Namely, the artificial graphite sheet and the metal layer are bonded by the first and second embedding structures for increasing the bonding strength between two heterogeneous materials as well as reducing the interfacial heat resistance. Thereby, the stability of heat dissipation performance can be improved, and a volumetric heat capacity of the compound heat sink from 1.1 to 3.5 J/(cm3·K) is provided.

Abstract: A handheld electronic device including a connection interface, a voltage supply unit and a baseband circuit is provided. When headphones are connected to the handheld electronic device, the baseband circuit can determine the type of the headphones by controlling the operation of the voltage supply unit. Furthermore, when the headphones are noise-canceling headphones, the baseband circuit can control the operation of the voltage supply unit to provide operation power to the noise-canceling headphones. In addition, corresponding noise-canceling headphones including a connection interface, at least one switch circuit, a switch control unit, a communication microphone, two speakers, a noise-canceling circuit and two noise-canceling microphones is also provided.

Abstract: The present disclosure provides a flexible graphite sheet and a method for fabricating the same and a composite structure for the same. The method for fabricating a flexible graphite sheet comprises steps of coating an augmenting solution on a first film to form a composite structure, and heating the composite structure such that the first film and the augmenting solution form a flexible graphite sheet, wherein the thermal conducting cross-section of the flexible graphite sheet is larger than the thermal conducting cross-section of the first film, and the thermal conductivity of the flexible graphite sheet ranges from 1200 to 6000 W/m° C.

Abstract: The present invention provides a compound heat sink, mainly comprising a graphite layer and a metal layer. The graphite layer has a first embedding structure on a surface; the metal layer has a second embedding structure on a surface and corresponding to the first embedding structure. The graphite layer and the metal layer are bonded by the first and second embedding structures for increasing the bonding strength between two heterogeneous materials as well as reducing the interfacial heat resistance. Thereby, the stability of heat dissipation performance can be improved.

Abstract: The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.

Abstract: The present disclosure provides a flexible graphite sheet and a method for fabricating the same and a composite structure for the same. The method for fabricating a flexible graphite sheet comprises steps of coating an augmenting solution on a first film to form a composite structure, and heating the composite structure such that the first film and the augmenting solution form a flexible graphite sheet, wherein the thermal conducting cross-section of the flexible graphite sheet is larger than the thermal conducting cross-section of the first film, and the thermal conductivity of the flexible graphite sheet ranges from 1200 to 6000 W/m° C.

Abstract: An illuminating device includes a substrate, a circuit layer, a conductive structure, and at least one LED die. The circuit layer is disposed on a top surface of the substrate. The conductive structure is disposed on the top surface of the substrate and includes a graphite layer. The LED die is attached to the conductive structure and is electrically connected to the circuit layer through the conductive structure.

Abstract: An anti-pop circuit is coupled with a sound outputting device to prevent a “pop” sound form being mixed into a sound signal. The anti-pop circuit includes a control signal generator and a fist diode. The control signal generator generates a control signal with a high level state and a low level state. The first diode couples with the sound outputting device. The sound signal is transferred to the first diode when said first diode is in a forward bias state, and the sound signal is outputted from an output end of the sound outputting device when the first diode is in a reverse bias state.