Patents by Inventor Hung-Jen Yang
Hung-Jen Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8358001Abstract: Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof.Type: GrantFiled: December 29, 2009Date of Patent: January 22, 2013Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Hung-Jen Yang, Chuehan Hsieh, Min-Lung Huang
-
Patent number: 8193647Abstract: A semiconductor device package includes a semiconductor device, a sealant, a first dielectric layer, an electrically conductive layer, and a second dielectric layer. The semiconductor device includes a contact pad, an active surface, and side surfaces, where the contact pad is disposed adjacent to the active surface. The semiconductor device is formed with a first alignment mark that is disposed adjacent to the active surface. The sealant envelopes the side surfaces of the semiconductor device and exposes the contact pad. The first dielectric layer is disposed adjacent to the sealant and the active surface, and defines a first aperture that exposes the contact pad. The electrically conductive layer is disposed adjacent to the first dielectric layer and is electrically connected to the contact pad through the first aperture. The second dielectric layer is disposed adjacent to the electrically conductive layer.Type: GrantFiled: January 6, 2010Date of Patent: June 5, 2012Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Chuehan Hsieh, Hung-Jen Yang, Min-Lung Huang
-
Publication number: 20110305846Abstract: The present disclosure provides a surface processing apparatus, comprising a reaction chamber provided to form a deposition layer on a substrate, a carrying chamber connected to the reaction chamber and comprising a slot, and a plasma generator installed in the slot and providing plasma to process the substrate surface. Whereby the disclosure further provides a surface processing method, which flatten surface of a deposition layer on the substrate when the substrate is carried form the reaction chamber to the carrying chamber after the deposition process in the reaction chamber.Type: ApplicationFiled: September 17, 2010Publication date: December 15, 2011Applicant: Industrial Technology Research InstituteInventors: JUNG-CHEN CHIEN, HUNG-JEN YANG, CHIH-CHEN CHANG, SHIH-CHIN LIN, MUH-WANG LIANG
-
Publication number: 20110073038Abstract: The present invention provides a gas distribution plate for providing at least two gas flowing channel. In one embodiment, the gas distribution plate has a first flowing channel, at least a second flowing channel disposed around the first flowing channel, and a tapered opening communicating with the first and the second flowing channel. In another embodiment, the gas distribution plate has a first flowing channel passing through a first and a second surface of the gas distribution plate, a second flowing channel paralleling to the first surface and a third flowing channel disposed at the second surface and communicating with the second flowing channel. The ends of the first and the third flowing channel have a tapered opening respectively. Besides, the present further provides a gas distribution apparatus for allowing at least two separate gases to be delivered independently into a process chamber while enabling the gases to be mixed completely after entering the processing chamber.Type: ApplicationFiled: November 11, 2009Publication date: March 31, 2011Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jung-Chen CHIEN, Jun-Chin Liu, Hung-Jen Yang, Tean-Mu Shen, Muh-Wang Liang
-
Publication number: 20110018124Abstract: Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof.Type: ApplicationFiled: December 29, 2009Publication date: January 27, 2011Inventors: Hung-Jen Yang, Chuehan Hsieh, Min-Lung Huang
-
Publication number: 20110018118Abstract: Described herein are semiconductor device packages and redistribution structures including alignment marks and manufacturing methods thereof.Type: ApplicationFiled: January 6, 2010Publication date: January 27, 2011Inventors: Chuehan Hsieh, Hung-Jen Yang, Min-Lung Huang
-
Patent number: 7867453Abstract: The present invention relates to a gravity-driven fraction separator and method thereof. The gravity-driven fraction separator is substantially a substrate having a microchannel structure arranged thereon, in which the microchannel structure is extending longitudinally on the substrate while sloping with respect to the level of the substrate by a specific angle. As a micro fluidics is being filled in a loading well situated upstream of the microchannel structure, the micro fluidics is driven by gravity to flow downstream in the microchannel structure while filling a plurality of manifolds formed in a area situated downstream of the microchannel structure, so that accurate quantification and separation of the micro fluidics using the plural manifolds, each having a specific length, can be achieved and provided for posterior inspection and analysis.Type: GrantFiled: September 21, 2006Date of Patent: January 11, 2011Assignee: Industrial Technology Research InstituteInventors: Jhy-Wen Wu, Hung-Jen Yang, Nan-Kuang Yao
-
Publication number: 20100308449Abstract: A manufacturing method of semiconductor package is provided. A carrier is provided. The chips are disposed on the carrier. The chips are encapsulated by a molding compound, so that the molding compound and the chips form a chip-redistribution encapsulant. The carrier is removed, so that the chip-redistribution encapsulant exposes the pads of the chips. The plasma is applied on the pads and the molding compound. A first dielectric layer is formed on the pads and the surface of the molding compound. The plasma is applied on a surface of the first dielectric layer. A patterned conductive layer is formed on the surface of the first dielectric layer. A second dielectric layer is formed on the patterned conductive layer and the first dielectric layer. A plurality of solder balls are formed on the second dielectric layer. The chip-redistribution encapsulant is divided so as to form a plurality of packages.Type: ApplicationFiled: November 4, 2009Publication date: December 9, 2010Inventors: Hung-Jen YANG, Min-Lung Huang
-
Patent number: 7713485Abstract: A microfluidics switch with moving planes has a first substrate with some holes and a second substrate with some micro-channels. Herein, the relative planes of both substrates are covered by a hydrophobic material. Therefore, while the substrates are neighboring and relatively moving, the overlap relation between the holes and the micro-channels are varied and a switch function is provided. Further, by using the hydrophobic material, while the distance between substrates is smaller than the height of drop of each liquid inputted into the holes, the fluids can not fluid between the planes and then different micro-channels are isolated from each other.Type: GrantFiled: March 19, 2003Date of Patent: May 11, 2010Assignee: Industrial Technology Research InstituteInventors: Shaw-Hwa Parng, Mei-Ya Wang, Hung-Jen Yang
-
Publication number: 20090053106Abstract: The present invention relates to an autonomous microfluidic apparatus. The autonomous microfluidic apparatus is substantially a substrate having a microchannel structure arranged thereon. As a microfluid is being filled in a loading well situated upstream of the microchannel structure, the microfluid is affected by interactions between gravity, adhesive force and surface tension and thus driven to flow downstream in the microchannel structure while filling a plurality of manifolds formed in a area situated downstream of the microchannel structure, so that accurate and autonomous quantification and separation of the microfluid using the plural manifolds, each having a specific length, can be achieved and provided for biomedical inspection and analysis.Type: ApplicationFiled: January 17, 2008Publication date: February 26, 2009Inventors: Jhy-Wen Wu, Hung-Jen Yang, Nan-Kuang Yao
-
Publication number: 20070297949Abstract: The present invention relates to a gravity-driven fraction separator and method thereof. The gravity-driven fraction separator is substantially a substrate having a microchannel structure arranged thereon, in which the microchannel structure is extending longitudinally on the substrate while sloping with respect to the level of the substrate by a specific angle. As a micro fluidics is being filled in a loading well situated upstream of the microchannel structure, the micro fluidics is driven by gravity to flow downstream in the microchannel structure while filling a plurality of manifolds formed in a area situated downstream of the microchannel structure, so that accurate quantification and separation of the micro fluidics using the plural manifolds, each having a specific length, can be achieved and provided for posterior inspection and analysis.Type: ApplicationFiled: September 21, 2006Publication date: December 27, 2007Inventors: Jhy-Wen Wu, Hung-Jen Yang, Nan-Kuang Yao
-
Publication number: 20070128082Abstract: The present invention provides a microflow coverage ratio control device, which comprises two reservoirs, at least one communication channel, a flow driver and two external tubes. The present invention utilizes liquid-level gravities of fluids in the two reservoirs to drive the fluids simultaneously flowing into a reaction chamber to form different fluid coverage ratios in the reaction chamber. The present invention employs the flow driver associated with the communication channel to change the liquid levels of the fluids in the two reservoirs, thereby changing the fluid coverage ratios in the reaction chamber. According to the potential energy conservation, the fluid pressure of the reaction chamber is kept constant during the change of the fluid coverage ratios. The interference of the reaction chamber is eliminated.Type: ApplicationFiled: June 28, 2006Publication date: June 7, 2007Applicant: Industrial Technology Research InstituteInventors: Hung-Jen Yang, Nan-Kuang Yao
-
Publication number: 20040184967Abstract: A microfluidics switch with moving planes has a first substrate with some holes and a second substrate with some micro-channels. Herein, the relative planes of both substrates are covered by a hydrophobic material. Therefore, while the substrates are neighboring and relatively moving, the overlap relation between the holes and the micro-channels are varied and a switch function is provided. Further, by using the hydrophobic material, while the distance between substrates is smaller than the height of drop of each liquid inputted into the holes, the fluids can not fluid between the planes and then different micro-channels are isolated from each other.Type: ApplicationFiled: March 19, 2003Publication date: September 23, 2004Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Shaw-Hwa Parng, Mei-Ya Wang, Hung-Jen Yang