Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

Abstract: A communication application server for supporting converged communications in a communication system. The communication application server is responsive to communication service requests from external endpoints, applications or other c requesting entities, and in one embodiment comprises at least first and second components. The first component is operative: (i) to process a given one of the communication service requests to identify at least one corresponding communication service supported by the communication application server, (ii) to determine one or more executable communication tasks associated with the identified communication service; and (iii) to establish communication with one or more external servers to carry out execution of at least a subset of the one or more executable communication taks associated with the communication service.

Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

Abstract: A coreless film roll product which may be used for both hand wrapping and machines wrapping with or without retrofitting stabilizing components.

Abstract: Numero Cubes and the Whole Number System are disclosed. In one embodiment, the system may comprise cubes, pegs, magnets, dividers, shafts, and a number placement panel. The shafts may comprise individual marks representing the base ten number system. The system may provide a method of learning mathematics through a cognitively authentic learning experience in constructing and building numbers.

Abstract: Numero Cubes and the Whole Number System are disclosed. In one embodiment, the system may comprise cubes, pegs, magnets, dividers, shafts, and a number placement panel. The shafts may comprise individual marks representing the base ten number system. The system may provide a method of learning mathematics through a cognitively authentic learning experience in constructing and building numbers.

Abstract: A business process software program is executed in a processing element comprising a memory and a processor coupled to the memory. The processor is operative to identify within the software program one or more communications services inserted as generic design elements therein, and for each of the identified communications services, to initiate the execution of one or more corresponding communications tasks. At least one of the communications services may comprise a composite communications service which itself comprises a plurality of communications services.

Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

Abstract: The invention provides methods for concentrating a macromolecule from a solution comprising the macromolecule and an organic polymer by first subjecting the solution to ultrafiltration to produce a first retentate solution, then adjusting the conductivity of the first retentate solution such that any protein precipitation induced by the organic polymer is essentially prevented to produce a second retentate solution, and then subjecting the second retentate solution to ultrafiltration. In a preferred embodiment, the conductivity is adjusted by diafiltration against water, suitable diluent or buffer. Preferably, the invention pertains to the concentration of solutions of native or recombinant proteins. The invention further pertains preferably to methods for the concentration of cell culture supernatant comprising a product protein and organic polymers of the PLURONIC family of nonionic block co-polymers, and more preferably comprising PLURONIC F-68 nonionic block co-polymer.

Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

Abstract: Numero Cubes and the Whole Number System are disclosed. In one embodiment, the system may comprise cubes, pegs, magnets, dividers, shafts, and a number placement panel. The shafts may comprise individual marks representing the base ten number system. The system may provide a method of learning mathematics through a cognitively authentic learning experience in constructing and building numbers.

Abstract: A communication application server for supporting converged communications in a communication system. The communication application server is responsive to communication service requests from external endpoints, applications or other c requesting entities, and in one embodiment comprises at least first and second components. The first component is operative: (i) to process a given one of the communication service requests to identify at least one corresponding communication service supported by the communication application server, (ii) to determine one or more executable communication tasks associated with the identified communication service; and (iii) to establish communication with one or more external servers to carry out execution of at least a subset of the one or more executable communication taks associated with the communication service.

Abstract: Embodiments of the invention generally provide etch or CVD plasma processing methods and apparatus used to generate a uniform plasma across the surface of a substrate by modulation pulsing the power delivered to a plurality of plasma controlling devices found in a plasma processing chamber. The plasma generated and/or sustained in the plasma processing chamber is created by the one or more plasma controlling devices that are used to control, generate, enhance, and/or shape the plasma during the plasma processing steps by use of energy delivered from a RF power source. Plasma controlling devices may include, for example, one or more coils (inductively coupled plasma), one or more electrodes (capacitively coupled plasma), and/or any other energy inputting device such as a microwave source.

Abstract: Numero Cubes and the Whole Number System are disclosed. In one embodiment, the system may comprise cubes, pegs, magnets, dividers, shafts, and a number placement panel. The shafts may comprise individual marks representing the base ten number system. The system may provide a method of learning mathematics through a cognitively authentic learning experience in constructing and building numbers.

Abstract: A process for the hydrogenation of a hydrocarbon feed includes contacting a major amount of the hydrocarbon feed with hydrogen in a counter-current manner in a first reaction zone under hydrogenation reaction conditions in the presence of a hydrogenation catalyst in at least a first catalyst bed wherein a liquid effluent exits at a bottom end of the first reaction zone and a hydrogen-containing gaseous effluent exits at a top end of the first reaction zone, and contacting a minor portion of the hydrocarbon feed with said hydrogen-containing gaseous effluent in a co-current manner in a second reaction zone having a catalyst bed positioned to receive the hydrogen-containing effluent of the first reaction zone.

Abstract: An electrolyte membrane is disclosed, for use in a fuel cell, and is composed of ionic transporting elements embedded in a polymer matrix. The elements can be carbon products, dye stuffs molecules, organic molecules, inorganic molecules, semiconductors, oxides, or superconductors. The elements carry ionic groups by chemical attachment of physical absorption. The electrolyte membrane can be a homogeneous or inhomogeneous blend of the ionic transporting elements in the polymer matrix. An anode and an opposing cathode are on opposite sides of the membrane. Respective catalysts are on the anode and cathode. A gas diffusion layer contacts the anode and has openings to allow fuel from a fuel source to pass through to the anode, as fuel is consumed at the anode. Another gas diffusion layer contacts the cathode and has openings to allow oxygen to pass through to the cathode. Fuel consumption generates electricity and produces water.

Abstract: Numero Cubes and the Whole Number System are disclosed. In one embodiment, the system may comprise cubes, pegs, magnets, dividers, shafts, and a number placement panel. The shafts may comprise individual marks representing the base ten number system. The system may provide a method of learning mathematics through a cognitively authentic learning experience in constructing and building numbers.

Abstract: A process is described that forms a low resistivity connection between a tungsten layer and a silicon surface with high adherence of the tungsten to the silicon. The silicon surface is plasma-cleaned to remove native oxide. A very thin layer (one or more monolayers) of Si—NH2 is formed on the silicon surface, serving as an adhesion layer. A WNx layer is formed over the Si—NH2 layer, using an atomic layer deposition (ALD) process, to serve as a barrier layer. A thick tungsten layer is formed over the WNx layer by CVD. An additional metal layer (e.g., aluminum) may be formed over the tungsten layer.

Abstract: A process is described that forms a low resistivity connection between a tungsten layer and a silicon surface with high adherence of the tungsten to the silicon. The silicon surface is plasma-cleaned to remove native oxide. A very thin layer (one or more monolayers) of Si-NH2 is formed on the silicon surface, serving as an adhesion layer. A WNx layer is formed over the Si-NH2 layer, using an atomic layer deposition (ALD) process, to serve as a barrier layer. A thick tungsten layer is formed over the WNx layer by CVD. An additional metal layer (e.g., aluminum) may be formed over the tungsten layer.

Abstract: The invention provides methods for concentrating a macromolecule from a solution comprising the macromolecule and an organic polymer by first subjecting the solution to ultrafiltration to produce a first retentate solution, then adjusting the conductivity of the first retentate solution such that any protein precipitation induced by the organic polymer is essentially prevented to produce a second retentate solution, and then subjecting the second retentate solution to ultrafiltration. In a preferred embodiment, the conductivity is adjusted by diafiltration against water, suitable diluent or buffer. Preferably, the invention pertains to the concentration of solutions of native or recombinant proteins. The invention further pertains preferably to methods for the concentration of cell culture supernatant comprising a product protein and organic polymers of the Pluronic family of block co-polymers, and more preferably comprising Pluronic F-68 block co-polymer.