Patents by Inventor Hwa In YOON

Hwa In YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210028567
    Abstract: A board mating connector includes a signal contact unit, a first ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit, a second ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit and at least a portion of the first ground portion, and an elastic member disposed between the first ground portion and the second ground portion to provide an elastic restoring force in a first direction. The first ground portion includes a first protrusion protruding outward or inward from a lower end portion thereof, and the second ground portion includes a second protrusion protruding from an upper end portion thereof in a direction different from that of the first protrusion. The first protrusion is engaged with the second protrusion in the hollow portion of the second ground portion.
    Type: Application
    Filed: June 19, 2020
    Publication date: January 28, 2021
    Inventors: Sun Hwa Cha, Hwa Yoon Song, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10804635
    Abstract: In one example, a board mating connector, in which a signal contact unit and a ground contact unit are interlocked, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a ground portion and another ground portion which is relatively moved in contact with the ground portion so as to be coupled to and interlocked with a connection portion through the dielectric unit.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: October 13, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10790604
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: September 29, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20200259282
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10700456
    Abstract: A board-mating connector with a reduced coupling height includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 30, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10622765
    Abstract: In one example, the present invention relates to a signal contact unit with ameliorated passive inter-modulation distortion (PIMD) characteristics, and a board mating connector including the same. The signal contact unit includes a housing which has a housing insertion hole of which one side is open; a contact portion which has a contact portion insertion hole of which the other side is open; and a signal spring which is inserted between the one side of the housing insertion hole and the other side of the contact portion insertion hole, wherein one side of the housing is partially inserted into the contact portion insertion hole, and in a state in which the signal spring is compressed, an inner side of the contact portion comes into contact with an outer side of the housing so that the housing and the contact portion are electrically connected.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: April 14, 2020
    Assignee: GigaLane Co., Ltd.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20200021049
    Abstract: The present invention relates to a board-mating connector with a reduced coupling height, and the board-mating connector includes a signal portion having one side in contact with a signal electrode of a board and to be electrically connected to the signal electrode; a ground portion having one side in contact with a ground electrode of the board to be electrically connected to the ground electrode and having a hollow inside; a housing portion in which a housing insertion hole is formed such that the signal portion and the ground portion are inserted thereinto and in which at least a part of a portion coming into contact with the ground portion is formed of metal; and a dielectric portion which is inserted into the housing insertion hole and is located between the signal portion and the housing portion such that the signal portion is spaced apart from the ground portion and the housing portion.
    Type: Application
    Filed: June 14, 2019
    Publication date: January 16, 2020
    Inventors: Hwa Yoon Song, Sang Min Seo, Eun Jung Kim, Jin Uk Lee, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10530099
    Abstract: In one example, a board mating connection, which includes a ground unit in which a tapered portion is formed, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a first ground portion which has a first ground hollow portion and includes a second ground portion of which the other side is partially inserted into the first ground hollow portion and which has a second ground hollow portion, the first ground portion includes a first ground tapered portion formed on a wall thereof so as to have an inclined shape such that an inner diameter thereof is gradually decreased toward the other side thereof, and the second ground portion has t
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: January 7, 2020
    Assignee: GIGALANE CO., LTD.
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20190305485
    Abstract: In one example, a board mating connection, which includes a ground unit in which a tapered portion is formed, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a first ground portion which has a first ground hollow portion and includes a second ground portion of which the other side is partially inserted into the first ground hollow portion and which has a second ground hollow portion, the first ground portion includes a first ground tapered portion formed on a wall thereof so as to have an inclined shape such that an inner diameter thereof is gradually decreased toward the other side thereof, and the second ground portion has t
    Type: Application
    Filed: March 22, 2019
    Publication date: October 3, 2019
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20190305484
    Abstract: In one example, the present invention relates to a signal contact unit with ameliorated passive inter-modulation distortion (PIMD) characteristics, and a board mating connector including the same. The signal contact unit includes a housing which has a housing insertion hole of which one side is open; a contact portion which has a contact portion insertion hole of which the other side is open; and a signal spring which is inserted between the one side of the housing insertion hole and the other side of the contact portion insertion hole, wherein one side of the housing is partially inserted into the contact portion insertion hole, and in a state in which the signal spring is compressed, an inner side of the contact portion comes into contact with an outer side of the housing so that the housing and the contact portion are electrically connected.
    Type: Application
    Filed: March 22, 2019
    Publication date: October 3, 2019
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Publication number: 20190305457
    Abstract: In one example, a board mating connector, in which a signal contact unit and a ground contact unit are interlocked, includes: a signal contact unit which has one side in contact with a signal electrode of a board and is electrically connected to the signal electrode; a ground contact unit which has one side in contact with a ground electrode of the board and is electrically connected to the ground electrode; and a dielectric unit which is disposed between the signal contact unit and the ground contact unit, wherein the ground contact unit includes a ground portion and another ground portion which is relatively moved in contact with the ground portion so as to be coupled to and interlocked with a connection portion through the dielectric unit.
    Type: Application
    Filed: March 22, 2019
    Publication date: October 3, 2019
    Inventors: Hwa Yoon Song, Jin Uk Lee, Sun Hwa Cha, Chang Hyun Yang, Eun Jung Kim, Kyung Hun Jung, Hee seok Jung
  • Patent number: 10276949
    Abstract: Provided are a connector and a blind mating connector including the same. The connector in accordance with the present invention includes a hollow body formed by bending a metal plate that is manufactured by press-processing a raw plate, a dielectric part built in the body, a signal pin passing through the dielectric part, a plurality of contact parts extending from both ends of the body, respectively, with a slit therebetween, a connection part defined in the body and at which both side ends of the metal plate are met and coupled, and an extension contact part bent and extending from one end of the contact part in a direction opposite to an extension direction of the contact part to face the contact part.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: April 30, 2019
    Assignee: GIGALANE CO., LTD.
    Inventors: Jin Uk Lee, Sang Min Seo, Hwa Yoon Song, Chang Hyun Yang, Kyung Hun Jung, Hwang Sub Koo, Hyun Je Kim, Hee seok Jung
  • Patent number: D848370
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: May 14, 2019
    Assignee: GigaLane Co., Ltd.
    Inventors: Jin Uk Lee, Sang Min Seo, Hwa Yoon Song, Chang Hyun Yang, Kyung Hun Jung, Hwang Sub Koo, Hyun Je Kim, Hee Seok Jung
  • Patent number: D908097
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: January 19, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908637
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908638
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908639
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D909311
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: February 2, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D913945
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: March 23, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Jin Uk Lee, Hee seok Jung, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D914606
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 30, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim