Patents by Inventor Hye Min BANG
Hye Min BANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955287Abstract: A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 ?m and a maximum thickness of the electrode layer is 5 to 20 ?m.Type: GrantFiled: December 8, 2021Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Hye Min Bang, Bum Soo Kim
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Patent number: 11749459Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes disposed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer disposed on a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first insulating coating layer disposed between the first and second electrode layers and having a discontinuous region, and a second insulating coating layer having a discontinuous region to cover at least a portion of a surface of the body. The second insulating coating layer is exposed from the external electrodes.Type: GrantFiled: May 4, 2021Date of Patent: September 5, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Hye Min Bang, Ho Phil Jung, Sung Min Cho
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Patent number: 11682526Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.Type: GrantFiled: July 8, 2021Date of Patent: June 20, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Min Bang, Bum Su Kim, Hyun Hee Gu, Hee Sang Kang
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Patent number: 11682527Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes formed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer covering a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first metal oxide layer disposed between the first and second electrode layers and having a discontinuous region, and a second metal oxide layer covering at least a portion of a surface of the body on which the external electrodes are not disposed and having a multilayer structure.Type: GrantFiled: May 4, 2021Date of Patent: June 20, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Hye Min Bang, Tae Joon Park, Hai Joon Lee
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Patent number: 11676762Abstract: A multilayer capacitor includes a body including a stack structure in which dielectric layers are stacked and internal electrodes are stacked with one of the dielectric layers interposed therebetween and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively. The first external electrode includes a first electrode layer covering a first surface of the body to which the first internal electrode is exposed, a glass layer covering the first electrode layer and a second surface of the body connected to the first surface, and a second electrode layer covering the glass layer, and the glass layer includes an inner region having a discontinuous region and an outer region covering the second surface of the body and having an end exposed from the second electrode layer.Type: GrantFiled: April 20, 2021Date of Patent: June 13, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol Lee, Hye Min Bang, Bum Soo Kim
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Patent number: 11605484Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: GrantFiled: February 27, 2020Date of Patent: March 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
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Publication number: 20220189700Abstract: A multilayer electronic component includes: a body including an active portion including internal electrodes disposed alternately with dielectric layers and cover portions disposed on upper and lower surfaces of the active portion; and external electrodes including an electrode layer disposed on the body, and an average thickness of the cover portion is 14 to 17 ?m and a maximum thickness of the electrode layer is 5 to 20 ?m.Type: ApplicationFiled: December 8, 2021Publication date: June 16, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jang Yeol LEE, Hye Min BANG, Bum Soo KIM
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Publication number: 20220172899Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes disposed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer disposed on a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first insulating coating layer disposed between the first and second electrode layers and having a discontinuous region, and a second insulating coating layer having a discontinuous region to cover at least a portion of a surface of the body. The second insulating coating layer is exposed from the external electrodes.Type: ApplicationFiled: May 4, 2021Publication date: June 2, 2022Inventors: Jang Yeol LEE, Hye Min BANG, Ho Phil JUNG, Sung Min CHO
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Publication number: 20220172895Abstract: A multilayer capacitor includes a body including a stack structure in which dielectric layers are stacked and internal electrodes are stacked with one of the dielectric layers interposed therebetween and first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively. The first external electrode includes a first electrode layer covering a first surface of the body to which the first internal electrode is exposed, a glass layer covering the first electrode layer and a second surface of the body connected to the first surface, and a second electrode layer covering the glass layer, and the glass layer includes an inner region having a discontinuous region and an outer region covering the second surface of the body and having an end exposed from the second electrode layer.Type: ApplicationFiled: April 20, 2021Publication date: June 2, 2022Inventors: Jang Yeol LEE, Hye Min BANG, Bum Soo KIM
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Publication number: 20220172898Abstract: A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes are stacked with the dielectric layers interposed therebetween, external electrodes formed on an external surface of the body to be connected to the internal electrodes, and including a first electrode layer covering a first surface of the body to which the internal electrodes are exposed, and a second electrode layer covering the first electrode layer, a first metal oxide layer disposed between the first and second electrode layers and having a discontinuous region, and a second metal oxide layer covering at least a portion of a surface of the body on which the external electrodes are not disposed and having a multilayer structure.Type: ApplicationFiled: May 4, 2021Publication date: June 2, 2022Inventors: Jang Yeol LEE, Hye Min BANG, Tae Joon PARK, Hai Joon LEE
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Patent number: 11276520Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.Type: GrantFiled: November 26, 2018Date of Patent: March 15, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chui Choi, Ji Hye Oh, Hye Min Bang, Myung Jun Park, Jung Hyuk Jung
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Publication number: 20210335546Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.Type: ApplicationFiled: July 8, 2021Publication date: October 28, 2021Inventors: Hye Min BANG, Bum Su KIM, Hyun Hee GU, Hee Sang KANG
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Patent number: 11069481Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.Type: GrantFiled: October 31, 2019Date of Patent: July 20, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Min Bang, Bum Su Kim, Hyun Hee Gu, Hee Sang Kang
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Patent number: 10861651Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer, and an external electrode disposed on the body. The external electrode includes a first electrode layer contacting the internal electrode, an oxide layer disposed on the first electrode layer and including a metal oxide and glass, and a second electrode layer disposed on the oxide layer.Type: GrantFiled: October 9, 2018Date of Patent: December 8, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ho Lee, Duk Hyun Chun, Myung Jun Park, Eun Jin Kim, Hye Min Bang
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Patent number: 10801121Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.Type: GrantFiled: January 26, 2018Date of Patent: October 13, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Yeon Cha, Dong Hwan Lee, Jung Hyuk Jung, Chan Yoon, Hye Min Bang, Tae Young Kim
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Publication number: 20200194158Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: ApplicationFiled: February 27, 2020Publication date: June 18, 2020Inventors: Woon Chul CHOI, Myung Jun PARK, Hye Min BANG, Jun AH, Myung Sam KANG, Jung Hyuk JUNG
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Patent number: 10614943Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.Type: GrantFiled: February 23, 2016Date of Patent: April 7, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Myung Jun Park, Hye Min Bang, Jun Ah, Myung Sam Kang, Jung Hyuk Jung
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Publication number: 20200066451Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.Type: ApplicationFiled: October 31, 2019Publication date: February 27, 2020Inventors: Hye Min BANG, Bum Su KIM, Hyun Hee GU, Hee Sang KANG
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Patent number: 10573460Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.Type: GrantFiled: November 5, 2018Date of Patent: February 25, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Min Bang, Bum Su Kim, Hyun Hee Gu, Hee Sang Kang
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Publication number: 20190385797Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer, first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween in the ceramic body, and first and second external electrodes disposed on external surfaces of the ceramic body and electrically connected to the first and second electrodes. At least one of the first and second external electrodes includes a first electrode layer including a first glass and a second electrode layer disposed on the first electrode layer and including a second glass. The first glass contains a larger amount of barium-zinc (Ba—Zn) than the second glass, and the second glass contains a larger amount of silicon (Si) than the first glass.Type: ApplicationFiled: November 5, 2018Publication date: December 19, 2019Inventors: Hye Min BANG, Bum Su KIM, Hyun Hee GU, Hee Sang KANG