Patents by Inventor Hye Min BANG

Hye Min BANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190341190
    Abstract: A multilayer capacitor includes a body including an internal electrode alternately disposed with a dielectric layer, and an external electrode disposed on the body. The external electrode includes a first electrode layer contacting the internal electrode, an oxide layer disposed on the first electrode layer and including a metal oxide and glass, and a second electrode layer disposed on the oxide layer.
    Type: Application
    Filed: October 9, 2018
    Publication date: November 7, 2019
    Inventors: Jong Ho LEE, Duk Hyun CHUN, Myung Jun PARK, Eun Jin KIM, Hye Min BANG
  • Patent number: 10388447
    Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Ji Hye Oh, Hye Min Bang, Myung Jun Park, Jung Hyuk Jung
  • Patent number: 10319515
    Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.
    Type: Grant
    Filed: February 18, 2016
    Date of Patent: June 11, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung hyuk Jung, Woon Chul Choi, Jun Ah, Myung Jun Park, Hye Min Bang
  • Publication number: 20190096563
    Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.
    Type: Application
    Filed: November 26, 2018
    Publication date: March 28, 2019
    Inventors: Woon Chul CHOI, Ji Hye OH, Hye Min BANG, Myung Jun PARK, Jung Hyuk JUNG
  • Patent number: 10163556
    Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.
    Type: Grant
    Filed: September 9, 2015
    Date of Patent: December 25, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Woon Chul Choi, Ji Hye Oh, Hye Min Bang, Myung Jun Park, Jung Hyuk Jung
  • Publication number: 20180148854
    Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
    Type: Application
    Filed: January 26, 2018
    Publication date: May 31, 2018
    Inventors: Hye Yeon CHA, Dong Hwan LEE, Jung Hyuk JUNG, Chan Yoon, Hye Min Bang, Tae Young KIM
  • Patent number: 9945042
    Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: April 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Yeon Cha, Dong Hwan Lee, Jung Hyuk Jung, Chan Yoon, Hye Min Bang, Tae Young Kim
  • Publication number: 20160343500
    Abstract: A chip electronic component includes a magnetic main body including an insulating substrate and a coil conductor pattern disposed on at least one surface of the insulating substrate, and external electrodes formed on opposite ends of the magnetic main body so as to be connected to an end of the coil conductor pattern. The coil conductor pattern includes a pattern plating layer and a first plating layer disposed on the pattern plating layer, and a thickness of the first plating layer of innermost and outermost coil conductor patterns of the coil conductor pattern is greater than a thickness of the first plating layer of an inner coil conductor pattern disposed between the innermost and outermost coil conductor patterns.
    Type: Application
    Filed: February 18, 2016
    Publication date: November 24, 2016
    Inventors: Jung Hyuk JUNG, Woon Chul CHOI, Jun AH, Myung Jun PARK, Hye Min BANG
  • Publication number: 20160336105
    Abstract: A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.
    Type: Application
    Filed: February 23, 2016
    Publication date: November 17, 2016
    Inventors: Woon Chul CHOI, Myung Jun PARK, Hye Min BANG, Jun AH, Myung Sam KANG, Jung Hyuk JUNG
  • Publication number: 20160163444
    Abstract: A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.
    Type: Application
    Filed: September 9, 2015
    Publication date: June 9, 2016
    Inventors: Woon Chul CHOI, Ji Hye OH, Hye Min BANG, Myung Jun PARK, Jung Hyuk JUNG
  • Publication number: 20150270053
    Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.
    Type: Application
    Filed: September 12, 2014
    Publication date: September 24, 2015
    Inventors: Hye Yeon CHA, Dong Hwan LEE, Jung Hyuk JUNG, Chan YOON, Hye Min BANG, Tae Young KIM