Abstract: The laminate for manufacturing a flexible substrate according to the present invention is formed by using a polyimide having a high absorbance to a UV laser in an organic sacrificial layer for delaminating a flexible substrate from a carrier substrate. Therefore, it is possible that the laser energy density required in the delaminating process using laser irradiation is reduced and the amount of as generated by the delaminating process is remarkably reduced so that the efficiency of the process, the permeability of the flexible substrate is improved and the reliability of the device is improved.

Abstract: Described is a polyimide prepared from a diamine containing a spiro or cardo group in a molecule structure, wherein the dimensional stability of the polyimide can be improved at a high temperature, and thus the polyimide can provide a polyimide film useful for a flexible substrate.

Abstract: The present invention relates to a laminated film roll body, around which a laminated film is wound, the laminated film including: a first polyimide film; and a second polyimide film laminated on the first polyimide film and made of a fluorine-based, siloxane-based, or amine-based polyamic acid, wherein the second polyimide film has a glass transition temperature of 350° C. or higher when measured by a temperature elevation rate of 20° C./min. The laminated film roll body can be used in a continuous manufacturing process of a flexible device to improve process yield and efficiency.

Abstract: Disclosed is a polyimide precursor composition for the production of a flexible board of a photoelectronic device. The polyimide precursor composition includes a polyimide precursor derived from a diamine or acid dianhydride including a structure of Formula 1: wherein R1 to R8, m1, m2, and m3 are as defined in the specification. Also disclosed is a polyimide film produced from the polyimide precursor composition. The polyimide film is obtained by applying the precursor composition to a substrate and curing the composition. The polyimide film has high transparency and good heat resistance. In addition, the polyimide film exhibits good dimensional stability because the substrate does not undergo an increase in stress even during high-temperature heat treatment.

Abstract: The present invention relates to a method for producing a flexible substrate. According to the method of the present invention, a flexible substrate layer can be easily separated from a carrier substrate even without the need for laser or light irradiation so that a device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. In addition, according to the method of the present invention, a flexible substrate can be continuously produced in an easier manner based on a roll-to-roll process.

Abstract: The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation.

Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a debonding layer including a polyimide resin between a carrier substrate and a flexible substrate. The adhesive strength of the debonding layer to the flexible substrate is changed by a physical stimulus. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device. In addition, the device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. This ensures improved characteristics and high reliability of the device.

Abstract: The present invention provides a polyimide film forming composition which comprises a polyamic acid or a polyimide in an oligomer form or in a low-molecular weight form, the polyamic acid or the polyimide being prepared from a diamine containing an intramolecular imide group, and thus can provide a polyimide film having improved heat resistance while retaining optical properties thereof. In addition, the polyimide film according to the present invention can reduce not only a laser energy density (E/D) required in the laser exfoliation process but also remarkably decrease an amount of ash generated by an exfoliation process, thereby further improving the reliability of a device in a display manufacturing process.

Abstract: Disclosed is a method and device for displaying a widget for an extended service. The method may include identifying, in a messaging application, link information or summary information of a content page corresponding to the link information, transferring the link information to a message server providing an instant messaging service of the messaging application, receiving, from the message server, widget information to provide an access to an event registered by an entity related to the link information or an extended service applicable to the entity related to the link information among extended services registered in the message server, and displaying a widget based on the widget information.

Abstract: This invention relates to a method of evaluating monomers having an effect on copolymer characteristics and a system using the same, and particularly to a novel method of evaluating the magnitude of the effect of monomers on copolymer characteristics, which cannot be evaluated using existing methods. The method of evaluating monomers having an effect on copolymer characteristics and the system using the same are innovative because the extent of changes in copolymer characteristics can be predicted at the monomer level by quantitatively evaluating the effect of the monomers on the copolymer characteristics, taking into consideration the kind or linkage type of monomers.

Abstract: The present disclosure relates to a cathode including a cathode active material and poly(amic acid). When the lithium secondary battery including the cathode is in an abnormal operation range of 160° C. or higher, condensation reaction of poly(amic acid) occurs to form polyimide. The polyimide surrounds cathode active material particles in the form of a coating film and prevents transport of lithium ions and electrons to interrupt current flow, and inhibits abnormal heat emission and thermal runaway or combustion caused by additional reactions.

Abstract: The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes.

Abstract: The present invention relates to a polyimide-based solution that can be used to produce an isotropic transparent polyimide-based film with high heat resistance and excellent mechanical properties as well as high transmittance. A coating of the polyimide-based solution on a substrate has a haze of 1% or less after storage at a temperature of 30° C. and a humidity of 70% for 30 minutes.

Abstract: A method for producing a device substrate by obtaining a laminate comprising a carrier substrate, a first polyimide film comprising a first polyimide resin disposed on at least one surface of the carrier substrate, a second polyimide film disposed on the first polyimide film opposite to the surface of the first polyimide film formed on a surface of the carrier substrate; applying a physical stimulus to the second polyimide film without causing chemical changes in the first polyimide film such that the cross-sections of the second polyimide film are exposed and cross-sectional surfaces of the first polyimide film are not exposed and no physical stimulus is applied to the surface of the carrier substrate, wherein the adhesive strength of the first polyimide to the second polyimide film decreases when the second polyimide film in the laminate is cut to expose cross-sectional surfaces of the second polyimide film; and separating the second polyimide film from the first polyimide film formed on the carrier substra

Abstract: The present application relates to a plastic substrate, a method for producing same, an organic electronic device, and display light source and lighting apparatus. The plastic substrate according to the present application has superb light extraction efficiency and exhibits an excellent surface roughness characteristic. Furthermore, the method for producing the plastic substrate according to the present application can produce the plastic substrate by means of a process in which scattering components are added secondarily. Moreover, the plastic substrate according to the present application can be utilized as a substrate for an organic electronic device, and the organic electronic device can be utilized as display light source and lighting apparatus.

Abstract: The present invention relates to a laminate and a device fabricated using the laminate. The laminate includes a first polyimide resin layer between a carrier substrate and a second polyimide resin layer, wherein the first polyimide resin layer has a coefficient of thermal expansion (CTE) equal to or lower than the CTE of the second polyimide-based resin layer at a temperature of 100 to 200° C., and the adhesive strength of the first resin layer to the second resin layer decreases when a physical stimulus causing no chemical changes in the first resin layer is applied to the laminate. According to the present invention, the flexible substrate can be easily separated from the carrier substrate without the need for further processing such as laser or light irradiation. Therefore, the use of the laminate facilitates the fabrication of the device having the flexible substrate. The device may be, for example, a flexible display device.

Abstract: The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation.

Abstract: The present invention relates to a method for producing a flexible substrate. According to the method of the present invention, a flexible substrate layer can be easily separated from a carrier substrate even without the need for laser or light irradiation so that a device can be prevented from deterioration of reliability and occurrence of defects caused by laser or light irradiation. In addition, according to the method of the present invention, a flexible substrate can be continuously produced in an easier manner based on a roll-to-roll process.

Abstract: This invention relates to a method of evaluating monomers having an effect on copolymer characteristics and a system using the same, and particularly to a novel method of evaluating the magnitude of the effect of monomers on copolymer characteristics, which cannot be evaluated using existing methods. The method of evaluating monomers having an effect on copolymer characteristics and the system using the same are innovative because the extent of changes in copolymer characteristics can be predicted at the monomer level by quantitatively evaluating the effect of the monomers on the copolymer characteristics, taking into consideration the kind or linkage type of monomers.

Abstract: This invention relates to a method of evaluating the identity of polymers and a system using the same, and more particularly to a novel method of evaluating the identity of polymers, wherein the identity of multiple polymers, rather than just one polymer, can be determined using only information about structures of the polymers, without the need to determine the characteristics of synthesized polymers through real-world experimentation. In order to evaluate the identity of polymers, the identity index PohoFactor(Xi) for each of target polymers is developed and used, and the identity of polymers can be accurately determined on a quantitative basis by evaluating correlations between the identity indices for all polymers, the identity of which is to be determined.