Patents by Inventor Hye Yeon Cha
Hye Yeon Cha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11574767Abstract: A coil component includes a body having one surface and another surface opposing each other in one direction, a plurality of walls each connecting the one surface to the other surface, and a coil portion disposed therein. A recess extends along at least portions of edges common to the one surface and to walls of the plurality of walls. A lower insulating layer is disposed in the recess and on the one surface. First and second external electrodes penetrate through the lower insulating layer, are spaced apart from each other on the one surface of the body, and are connected to the coil portion. A shielding layer is disposed on the other surface of the body and the plurality of walls of the body, and extends to the one surface of the body to be spaced apart from the first and second external electrodes.Type: GrantFiled: March 6, 2019Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Il Park, Hye Yeon Cha, Young Sun Kim
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Publication number: 20220102047Abstract: A coil component includes a body having an upper surface and a lower surface opposing each other in a thickness direction, a support substrate disposed in the body and having one surface perpendicular to the lower surface of the body, a coil portion disposed on the support substrate, and first and second external electrodes disposed on the lower surface of the body. The body includes an active portion, covering the coil portion, and first and second cover portions, respectively disposed on opposing surfaces of the active portion. The active portion includes a first magnetic metal particle, a second magnetic metal particle having a smaller diameter than the first magnetic metal particle, and a first insulating resin. Each of the first and second cover portions includes a third magnetic metal particle, having a smaller diameter than the first magnetic metal particle, and a second insulating resin.Type: ApplicationFiled: June 28, 2021Publication date: March 31, 2022Inventors: Dong Hwan LEE, Hye Yeon CHA, Chan YOON, Dong Jin LEE, Hwi Dae KIM
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Patent number: 11270829Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.Type: GrantFiled: October 25, 2019Date of Patent: March 8, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Sam Lee, Eo Jin Choi, Jae Hun Kim, Ji Hyun Eom, Hye Yeon Cha
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Patent number: 11107621Abstract: A coil component includes a body including a magnetic material; a support member disposed in the body; and a coil pattern on the support member in the body. The coil pattern may include a first conductor layer formed on the support member and having a planar spiral shape; a second conductor layer formed on the first conductor layer and having a volume of a lower portion greater than a volume of an upper portion; and a third conductor layer formed to cover the second conductor layer from the outside of the second conductor layer.Type: GrantFiled: July 11, 2018Date of Patent: August 31, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Hyuk Jung, Ki Young Yoo, Dong Min Kim, Hye Yeon Cha
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Patent number: 11056274Abstract: A thin film type inductor includes a body and external electrodes disposed on an external surface of the body. The body includes a support member and an internal coil supported by the support member, the internal coil includes an upper coil disposed on one surface of the support member and a lower coil disposed on the other surface thereof, and the upper and lower coils are connected to each other by a via electrode. Heights of a plurality of coil patterns arranged along a first virtual line are substantially equal to each other, and heights of a plurality of coil patterns arranged along a second virtual line increase toward the external surface of the body, where the first virtual line radiates from a center of a core of the body toward the via electrode and the second virtual line radiates in the opposite direction.Type: GrantFiled: July 31, 2018Date of Patent: July 6, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Hyuk Jung, Ki Young Yoo, Hye Yeon Cha, Ji Hye Oh
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Patent number: 10801121Abstract: There are provided a chip electronic component and a manufacturing method thereof, and more particularly, a chip electronic component having an internal coil structure capable of preventing the occurrence of short-circuits between coil portions and having a high aspect ratio (AR) by increasing a thickness of a coil as compared to a width of the coil, and a manufacturing method thereof.Type: GrantFiled: January 26, 2018Date of Patent: October 13, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Yeon Cha, Dong Hwan Lee, Jung Hyuk Jung, Chan Yoon, Hye Min Bang, Tae Young Kim
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Patent number: 10629362Abstract: A coil component includes a body including a magnetic material, a support member disposed inside the body, and a coil pattern disposed on the support member inside the body. The coil pattern includes a first conductive layer, having a planar spiral shape, and a second conductive layer, having a line width greater than a thickness thereof, while covering the first conductive layer. When viewed from a surface of the body cut in thickness and width directions, a line width of each of outermost and innermost patterns of the first conductive layer is different from a line width of at least one internal pattern disposed between the outermost and innermost patterns.Type: GrantFiled: October 17, 2017Date of Patent: April 21, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Hyuk Jung, Sung Hee Kim, Hye Yeon Cha
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Publication number: 20200098508Abstract: A coil component includes a body having one surface and another surface opposing each other in one direction, a plurality of walls each connecting the one surface to the other surface, and a coil portion disposed therein. A recess extends along at least portions of edges common to the one surface and to walls of the plurality of walls. A lower insulating layer is disposed in the recess and on the one surface. First and second external electrodes penetrate through the lower insulating layer, are spaced apart from each other on the one surface of the body, and are connected to the coil portion. A shielding layer is disposed on the other surface of the body and the plurality of walls of the body, and extends to the one surface of the body to be spaced apart from the first and second external electrodes.Type: ApplicationFiled: March 6, 2019Publication date: March 26, 2020Inventors: Kwang Il PARK, Hye Yeon CHA, Young Sun KIM
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Patent number: 10586648Abstract: A coil component includes a body portion including a magnetic material, and a coil portion disposed in the body part. The coil portion includes a first coil pattern layer having a planar spiral pattern, an insulating layer formed of an insulating resin embedding at least a portion of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having a planar spiral pattern. The insulating layer includes a core material disposed between the first and second coil pattern layers, and a thickness of a lower region of the insulating layer disposed below the core material is greater than a thickness of an upper region of the insulating layer disposed above the core material.Type: GrantFiled: October 16, 2017Date of Patent: March 10, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Jae Lee, Youn Soo Seo, Jae Ha Kim, Hye Yeon Cha
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Publication number: 20200058431Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Inventors: Yong Sam LEE, Eo Jin CHOI, Jae Hun KIM, Ji Hyun EOM, Hye Yeon CHA
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Patent number: 10529476Abstract: A coil component includes a body having a coil part disposed in the body. The coil part may include: a first coil pattern formed on one surface of the insulating layer; and a second coil pattern including an external pattern formed on the other surface of the insulating layer. The second coil pattern may further include an embedded pattern embedded in the insulating layer and the external pattern may be disposed on the embedded pattern. The coil component can have improved low direct current resistance characteristics and inductance.Type: GrantFiled: July 31, 2017Date of Patent: January 7, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho Sik Park, Sang Jae Lee, Youn Soo Seo, Yong Sam Lee, Hye Yeon Cha, Jae Ha Kim
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Patent number: 10504644Abstract: A coil component includes a body, including a coil and a support member supporting the coil, and an external electrode disposed on an external surface of the body. The coil component includes a machined surface formed on a boundary surface between a portion of the support member, removed in the vicinity of a junction portion between the external electrode and the coil, and the remainder of the support member. A cavity, from which the portion of the support member has been removed, is filled with a magnetic material, or an insulating layer is disposed in the cavity.Type: GrantFiled: August 14, 2017Date of Patent: December 10, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Yong Sam Lee, Eo Jin Choi, Jae Hun Kim, Ji Hyun Eom, Hye Yeon Cha
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Patent number: 10332670Abstract: An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap of the conductive coil and on an upper surface thereof, an insulating coating part formed to enclose an overall surface of the conductive coil on which the lamination part is formed, and upper and lower cover layers covering the overall surface of the conductive coil on which the insulating coating part is formed.Type: GrantFiled: October 9, 2017Date of Patent: June 25, 2019Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woon Chul Choi, Sung Hyun Kim, Hye Yeon Cha
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Publication number: 20190122811Abstract: A coil component includes a body including a magnetic material; a support member disposed in the body; and a coil pattern on the support member in the body. The coil pattern may include a first conductor layer formed on the support member and having a planar spiral shape; a second conductor layer formed on the first conductor layer and having a volume of a lower portion greater than a volume of an upper portion; and a third conductor layer formed to cover the second conductor layer from the outside of the second conductor layer.Type: ApplicationFiled: July 11, 2018Publication date: April 25, 2019Inventors: Jung Hyuk JUNG, Ki Young YOO, Dong Min KIM, Hye Yeon CHA
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Publication number: 20190103215Abstract: A thin film type inductor includes a body and external electrodes disposed on an external surface of the body. The body includes a support member and an internal coil supported by the support member, the internal coil includes an upper coil disposed on one surface of the support member and a lower coil disposed on the other surface thereof, and the upper and lower coils are connected to each other by a via electrode. Heights of a plurality of coil patterns arranged along a first virtual line are substantially equal to each other, and heights of a plurality of coil patterns arranged along a second virtual line increase toward the external surface of the body, where the first virtual line radiates from a center of a core of the body toward the via electrode and the second virtual line radiates in the opposite direction.Type: ApplicationFiled: July 31, 2018Publication date: April 4, 2019Inventors: Jung Hyuk JUNG, Ki Young YOO, Hye Yeon CHA, Ji Hye OH
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Patent number: 10109409Abstract: A chip electronic component may include a magnetic material body including an insulating substrate and coil conductor patterns formed on at least one surface of the insulating substrate, and external electrodes disposed on both end portions of the magnetic material body so as to be connected to end portions of the coil conductor patterns, respectively. In a cross section of the magnetic material body in a length direction, a thickness of an innermost loop/section of the coil conductor patterns may be smaller than a thickness of the remaining loops/sections of the coil conductor pattern.Type: GrantFiled: November 14, 2014Date of Patent: October 23, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Hwan Lee, Chan Yoon, Hye Yeon Cha, Jin Woo Han
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Patent number: 10102964Abstract: A coil electronic component includes: a magnetic body comprising a magnetic material; a coil part embedded inside the magnetic body; and a magnetic layer disposed on a surface of the magnetic body.Type: GrantFiled: November 24, 2015Date of Patent: October 16, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin-Soo Kim, Myung-Sam Kang, Kwang-Il Park, Young-Gwan Ko, Youn-Soo Seo, Woon-Chul Choi, Hye-Yeon Cha
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Patent number: 10102969Abstract: A method of manufacturing an electronic component having high inductance (L) and an excellent quality (Q) factor and direct current (DC)-bias characteristics includes forming a magnetic body in which internal coil parts are embedded, and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body.Type: GrantFiled: November 16, 2015Date of Patent: October 16, 2018Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Moon Soo Park, Jong Sik Yoon, Kyung Han Ahn, Dong Hwan Lee, Hye Yeon Cha, Jong Ho Lee
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Publication number: 20180268988Abstract: A coil component includes a body portion including a magnetic material, and a coil portion disposed in the body part. The coil portion includes a first coil pattern layer having a planar spiral pattern, an insulating layer formed of an insulating resin embedding at least a portion of the first coil pattern layer, and a second coil pattern layer disposed on the insulating layer and having a planar spiral pattern. The insulating layer includes a core material disposed between the first and second coil pattern layers, and a thickness of a lower region of the insulating layer disposed below the core material is greater than a thickness of an upper region of the insulating layer disposed above the core material.Type: ApplicationFiled: October 16, 2017Publication date: September 20, 2018Inventors: Sang Jae LEE, Youn Soo SEO, Jae Ha KIM, Hye Yeon CHA
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Publication number: 20180211762Abstract: A coil component includes a body including a magnetic material, a support member disposed inside the body, and a coil pattern disposed on the support member inside the body. The coil pattern includes a first conductive layer, having a planar spiral shape, and a second conductive layer, having a line width greater than a thickness thereof, while covering the first conductive layer. When viewed from a surface of the body cut in thickness and width directions, a line width of each of outermost and innermost patterns of the first conductive layer is different from a line width of at least one internal pattern disposed between the outermost and innermost patterns.Type: ApplicationFiled: October 17, 2017Publication date: July 26, 2018Inventors: Jung Hyuk Jung, Sung Hee Kim, Hye Yeon Cha