Abstract: A broadcast program summary generation system, method and medium are provided. The broadcast program summary generation system includes a format transformation unit to transform a broadcast format of digital broadcast data into a storage format, and a summary generation unit to decode video data of the transformed digital broadcast data, to analyze the decoded video data, to detect an important event by analyzing audio data of the transformed digital broadcast data, and to generate summary information based on the important event.

Abstract: A frequency conversion circuit comprises an input stage composed of one or more transistors, the input stage outputting a current corresponding to a voltage-type RF signal which is input to the gate of the transistor; a frequency conversion stage receiving an LO signal, causing the output RF signal to transit by the frequency of the LO signal so as to output an IF signal, and detecting an output voltage of the IF signal; a bleeding transistor connected to the input stage, supplying a current corresponding to a DC voltage, applied to a gate-source stage thereof, as a bleeding current to the transistor of the input stage, and in an AC manner, operating complementarily with the input stage to control a current flowing in the frequency conversion stage; a common mode feedback circuit comparing an output voltage provided from the frequency conversion stage with a preset reference voltage, adjusting the output voltage such that the output voltage is equalized to the reference voltage, and directly feeding the adjus

Abstract: A moving picture play system, method and medium which includes determining whether a driver of a vehicle is unable to view moving picture data, summarizing moving picture data when it is determined the driver of the vehicle is unable to view the moving picture data, and playing the summarized moving picture data or recorded moving picture data when it is determined the driver of the vehicle is able to view moving picture data.

Abstract: A package-on-package and a method of fabricating the same capable of increasing mounting density of a semiconductor package are provided. The method includes providing a flexible substrate first, second, and third printed circuit patterns formed on the upper and lower surfaces of the flexible substrate. First and second semiconductor chips and then respectively mounted to substantially central portions of the upper and lower surfaces of the flexible substrate and electrically connected to the first printed circuit patterns. A package body is formed by sealing the first printed circuit pattern and the semiconductor chips. Portions of the flexible substrate having the second and third printed circuit patterns are then bent towards and adhered to the upper and lower surfaces of the package body.

Abstract: Provided is an image editing apparatus and method. The image editing apparatus includes a containing region determination unit determining a plurality of containing regions from a frame image transmitted from a contents providing device based on first mapping information that maps the containing regions corresponding to a contents genre, a storage unit storing the containing regions determined by the containing region determination unit, and a containing region composition unit reading a main containing region and a sub containing region that are selected from among the containing regions determined by the containing region determination unit from the storage unit, composing the read main containing region and sub containing region, and providing an edited frame image resulting from the composition result.

Abstract: A method, medium, and apparatus detecting a real time event in a sports video. The method may include testing a confidence of an online model, calculated in a sports video stream, detecting an event by using an offline model in the sports video stream, when the confidence of the online model does not meet a threshold, training the online model through an event detected by using the offline model, and detecting an event by using the online model in the sports video stream, when the confidence of the online model meets the threshold.

Abstract: Provided is a method by which differently-sized chips may be stacked at the wafer level. The wafer level chip stack method utilizes first and second wafer assemblies that support first and second wafers on adhesive tapes. One or both of the supported wafers may be sawed or otherwise divided to obtain separate first and second chips that remain fixed to respective first ring frames. The first and second wafer assemblies may then be positioned and aligned so that a back surface of the second wafer faces an active surface of the first wafer. Each of the second chips may then be bonded to a corresponding first chip to form a chip stack using an adhesive layer. The chip stacks may then be detached from the wafer assemblies and attached to a substrate.

Abstract: A user authentication method includes varying a threshold value for human body recognition depending on the extent to which an input graphical password matches with a registered graphical password and determining whether to authenticate a user or not based on a result of comparing the user's human body recognition information with registered human body recognition information. Thus, it is possible to improve convenience, reliability, and security of user authentication based on a graphical password in a device, such as a PDA or other portable electronic device, not having a key manipulation unit. In addition, a biometrics unit that used to provide authentication functions and to carry out user authentication may be improved by lowering both FAR and FRR by variably setting a threshold value for biometrics depending on the result of user authentication using a graphical password.

Abstract: A die attaching method of a semiconductor chip simplifies the process of fabricating a package from the chip while preventing the chip form being damaged even when the chip is very thin. Warpage prevention material is adhered to a top surface of a wafer having a plurality of chips formed thereon, and then the wafer is cut to separate the chips from one another. Each semiconductor chip is then placed on and attached to a die pad of a base frame, while the warpage prevention material is detached from the semiconductor chip. Thus, the warpage prevention material is removed without requiring a process that is extraneous to the die attaching process.

Abstract: A method, system, and medium of providing various types of broadcast services such as a record, a summary, a navigation and a real-time event service with respect to a broadcast content, utilizing a home server, according to a user's request. A broadcast service providing method includes: storing broadcast summary data, navigation data and real-time event data which is generated by analyzing received broadcast data according to a broadcast record request from a user's portable device, in a database; and providing the user's portable device with a streaming service with respect to the stored broadcast summary data, the navigation data and the real-time event data, according to a summary selection request from the user's portable device.

Abstract: A user authentication method and apparatus including determining whether a password has been input; setting a first threshold value if the input password matches with a registered password and setting a second threshold value if the input password does not match with the registered password; and determining whether to authenticate the user or not based on a comparison of the user's biometrics information with registered biometrics information and the first or second threshold value.

Abstract: A method and an apparatus for generating textures for a three-dimensional (3D) facial model are provided.

Abstract: Example embodiments of a semiconductor chip packaging apparatus and method thereof are disclosed. The packaging apparatus includes a plating unit that is disposed in a direction to form a conductive plating layer on external terminals of the semiconductor chip package; and a reflow unit that is disposed with the plating unit to melt the conductive plating layer. The packaging apparatus may further include a rinsing unit that is disposed with the plating unit to clean and cool the conductive plating layer. Thus, it is possible to effectively suppress the growth of whiskers on the plating layer of the external terminals, and to secure economical efficiency, reducing costs, and allowing mass production.

Abstract: A circuit for compensating for an offset voltage in a PhotoDetector Integrated Circuit (PDIC). The circuit includes a temperature detection unit, a current transfer unit and a current adjustment unit. The temperature detection unit generates a current that varies with variation in surrounding temperature. The current transfer unit transfers the generated current. The current adjustment unit adjusts the current transferred from the current transfer unit at a predetermined ratio and outputs the adjusted current.

Abstract: Disclosed herein is a PhotoDiode Integrated Circuit (PDIC) having multiple gain states. The PDIC includes a current-voltage conversion unit, an input amplification stage circuit, a reference resistance unit, a feedback resistance unit, and a switching unit. The current-voltage conversion unit converts a current signal into a voltage signal. The input amplification stage circuit is connected to the current-voltage conversion unit to receive and amplify the voltage signal. The reference resistance unit is connected to the second input terminal of the input amplification stage circuit. The output amplification stage circuit is connected to the output terminal of the input amplification stage circuit. The feedback resistance unit is connected in parallel between the second input terminal and the output terminal of the output amplification stage circuit, and is configured to have a plurality of resistance elements. The switching unit selectively connects the plurality of resistance elements.

Abstract: A method may involve mounting a first supporting plate on an active surface of a wafer using an adhesive. A portion of the back surface of the wafer may be backlapped. A second supporting plate may be mounted on the back surface of the wafer using an adhesive. The first supporting plate may be removed from the active surface of the wafer. Conductive bumps may be provided on the active surface. A backlapping process may include a first grinding process, a second grinding process, and a polishing process. The first and the second supporting plates may be fabricated from a solid material. The adhesive may be an ultraviolet cure adhesive or a thermal cure adhesive.

Abstract: A photographing method, medium, and apparatus based on face detection in a portable camera. The portable photographing apparatus may include an image input unit that receives an image, a face detection unit that detects a face from the received image, a storage unit that stores the image detected by the face detection unit as a moving image in a first mode, and a quality evaluation unit that evaluates the quality of the image detected by the face detection unit and stores the same as a still image in a second mode upon satisfaction of predetermined conditions evaluated based on the quality evaluation of the still image.

Abstract: A die attaching method of a semiconductor chip simplifies the process of fabricating a package from the chip while preventing the chip form being damaged even when the chip is very thin. Warpage prevention material is adhered to a top surface of a wafer having a plurality of chips formed thereon, and then the wafer is cut to separate the chips from one another. Each semiconductor chip is then placed on and attached to a die pad of a base frame, while the warpage prevention material is detached from the semiconductor chip. Thus, the warpage prevention material is removed without requiring a process that is extraneous to the die attaching process.

Abstract: A method of forming a stack of thin wafers provides a wafer level stack to greatly reduce process time compared to a method where individually separated chips are stacked after a wafer is sawed. A rigid planar wafer support member stabilizes and planarizes each wafer while it is thin or its thickness is reduced and during subsequent wafer processing. Thinned wafers are stacked and the external support members are removed by applying heat or ultraviolet (UV) light to an expandable adhesive layer between the support members and the thin wafers. The stacked wafers then can be further processed and packaged without thin-wafer warping, cracking or breaking. A wafer level package made in accordance with the invented method also is disclosed.

Abstract: The present invention discloses a refrigerator which can individually cool a freezing chamber and a refrigerating chamber by dividing a heat exchange region of an evaporator into a freezing chamber side region and a refrigerating chamber side region, forming individual circulation passages for supplying cool air from each region to the freezing chamber and the refrigerating chamber, and forming a freezing chamber fan and a refrigerating chamber fan on each circulation passage, and method for controlling operation of the same which can efficiently perform a cooling operation and reduce power consumption by effectively controlling the operations of each component.