Abstract: A method for manufacturing semiconductor devices is provided in which an organic adhesive layer is formed on the backside of a semiconductor wafer after being thinned by a backlapping process and cured to form a B-stage adhesive layer. Using the B-stage adhesive layer, the semiconductor device may then be attached to a circuit substrate and then subjected to additional curing to form a C-stage adhesive layer. Such semiconductor devices may also be attached directly to a lower semiconductor chip or, in the alternative, may be attached to a spacer mounted that is or will be mounted on a lower semiconductor chip or the circuit substrate. The organic adhesive is selected to counteract stresses induced by a passivation layer formed on the active surface, thereby reducing or preventing warping of the semiconductor wafer and eliminating the need for a separate resin paste adhesive during the chip attaching process.

Abstract: Provided is a method by which differently-sized chips may be stacked at the wafer level. The wafer level chip stack method utilizes first and second wafer assemblies that support first and second wafers on adhesive tapes. One or both of the supported wafers may be sawed or otherwise divided to obtain separate first and second chips that remain fixed to respective first ring frames. The first and second wafer assemblies may then be positioned and aligned so that a back surface of the second wafer faces an active surface of the first wafer. Each of the second chips may then be bonded to a corresponding first chip to form a chip stack using an adhesive layer. The chip stacks may then be detached from the wafer assemblies and attached to a substrate.

Abstract: A method for manufacturing semiconductor devices is provided in which an organic adhesive layer is formed on the backside of a semiconductor wafer after being thinned by a backlapping process and cured to form a B-stage adhesive layer. Using the B-stage adhesive layer, the semiconductor device may then be attached to a circuit substrate and then subjected to additional curing to form a C-stage adhesive layer. Such semiconductor devices may also be attached directly to a lower semiconductor chip or, in the alternative, may be attached to a spacer mounted that is or will be mounted on a lower semiconductor chip or the circuit substrate. The organic adhesive is selected to counteract stresses induced by a passivation layer formed on the active surface, thereby reducing or preventing warping of the semiconductor wafer and eliminating the need for a separate resin paste adhesive during the chip attaching process.

Abstract: A user authentication method includes varying a threshold value for human body recognition depending on the extent to which an input graphical password matches with a registered graphical password and determining whether to authenticate a user or not based on a result of comparing the user's human body recognition information with registered human body recognition information. Thus, it is possible to improve convenience, reliability, and security of user authentication based on a graphical password in a device, such as a PDA or other portable electronic device, not having a key manipulation unit. In addition, a biometrics unit that used to provide authentication functions and to carry out user authentication may be improved by lowering both FAR and FRR by variably setting a threshold value for biometrics depending on the result of user authentication using a graphical password.

Abstract: A user authentication method and apparatus including determining whether a password has been input; setting a first threshold value if the input password matches with a registered password and setting a second threshold value if the input password does not match with the registered password; and determining whether to authenticate the user or not based on a comparison of the user's biometrics information with registered biometrics information and the first or second threshold value.

Abstract: The present invention relates to an apparatus and method for creating a three-dimensional caricature, and more particularly, to an apparatus and method for creating a three-dimensional caricature having a high degree of similarity to user's face by precisely extracting feature point information on facial features and modifying a three-dimensional polygon face basic model based on the feature point information using an ASM technique specialized for faces. The method comprises the steps of detecting the positions of eyes from an input facial image and normalizing the size of the facial image, detecting each initial position for facial features from the normalized facial image, loading ASMs in the normalized facial image so as to correspond to the detected initial position and then extracting feature points for the facial features, and creating a three-dimensional polygon face caricature by modifying the three-dimensional polygon face basic model according to coordinate values of the extracted feature points.

Abstract: A method and an apparatus for generating textures for a three-dimensional (3D) facial model are provided.

Abstract: A method for reporting a power fail in a communication system having a real-time clock (RTC) generator with a backup battery and for performing a reservation function stored in a nonvolatile memory. The method includes the steps of: (a) updating real-time data by storing real-time data from the RTC generator into the nonvolatile memory with a predetermined time interval; (b) initializing the communication system and searching a reservation registering area for a reserved job simultaneously; (c) printing the latest updated real-time data and a power fail title with a power fail time when a reserved job is searched in the step (b); (d) printing a title of the reserved job and reading contents of an unperformed reserved job stored into the nonvolatile memory so as to print the unperformed reserved job; and (e) searching for other reserved job at the completion of the step (d) and, if the other reserved job exists, jumping to the step (d).