Abstract: Disclosed is a manufacturing method including: a substrate loading operation of loading a substrate into a liquid treating chamber; a liquid treating operation of supplying a treatment solution to the substrate rotating in the liquid treating chamber through a nozzle; a substrate unloading operation of unloading the substrate from the liquid treating chamber, and a pressure control operation of changing a pressure of a space above the substrate at least one time in a period between the substrate loading operation and the substrate unloading operation.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a treating fluid to the inner space; and a fluid exhaust unit configured to exhaust the treating fluid from the inner space, and wherein the fluid exhaust unit includes: an exhaust line connected to the chamber; and a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space to a set pressure, and wherein the fluid supply unit includes: a fluid supply source; and a supply line provided between the fluid supply source and the chamber, and wherein at the supply line or the exhaust line a flow rate measuring member configured to measure a flow rate per unit time of the treating fluid flowing at the inner space is installed.

Abstract: The present invention provides an apparatus for treating a substrate, including: a process chamber including a first body and a second body which are combined with each other to form a treatment space for treating a substrate is treated therein; a driver which moves the process chamber to an open position or a close position; a support unit which supports a substrate within the treatment space; and a fluid supply unit which supplies a fluid to the treatment space, in which the support unit includes: a support pin coupled to the first body or the second body; and a guide member which is coupled to the support pin and extends in a lateral direction of the support pin to support the substrate.

Abstract: An apparatus for treating a substrate includes a body having an inner space in which the substrate is dried by a drying fluid in a supercritical state, a fluid supply unit that supplies the drying fluid into the inner space, a fluid exhaust unit that releases the drying fluid from the inner space, and a controller. The controller controls the fluid supply unit and the fluid exhaust unit to perform a pressure-raising step of raising pressure in the inner space to a set pressure and a flow step of generating a flow of the drying gas in the inner space by releasing, by the fluid exhaust unit, the drying fluid from the inner space while the fluid supply unit supplies the drying fluid into the inner space.

Abstract: Disclosed is a substrate treating apparatus including: a treating chamber for treating a substrate; a transfer unit for loading and unloading the substrate into and from a treatment space in which the substrate is treated in the treating chamber; and a heating unit provided to be loaded into and unloaded from the treatment space, and for cleaning the treatment space by heating, in which the treating chamber includes: a chamber body providing the treatment space; and a support unit for supporting the substrate within the treatment space; and a fluid supply unit for supplying a fluid, which treats the substrate, into the treatment space, and the heating unit includes: a base; and a heater installed on the base.

Abstract: An alignment apparatus includes a support substrate having a first alignment mark formed thereon, and a wafer mounted on the support substrate as aligned to the first alignment mark. The first alignment mark includes a first mark extending in a first direction, a second mark extending in a second direction and intersecting the first mark at a side of the first mark, and a third mark extending in the second direction and intersecting the first mark at another side of the first mark.

Abstract: Provided is an apparatus for processing a substrate, the apparatus including: a liquid treatment chamber; a drying chamber; and a light treatment chamber, in which the light treatment chamber includes: a treatment housing having a treatment space in which the substrate is processed; a support member for supporting the substrate in the treatment space; a light source for irradiating the substrate supported on the support member with light in the form of pulses; and a light filter for selecting a set range of wavelengths of the light generated by the light source and allowing the selected wavelengths to pass through.

Abstract: The present invention relates to polymer nanodiscs comprising a lipid bilayer and an amphiphilic polymer, and to a pharmaceutical composition comprising the polymer nanodiscs. The polymer nanodiscs of the present invention, comprising the lipid bilayer and the amphiphilic polymer, exhibit an antivirus effect when used, and thus may be used for preventing or treating virus infections.

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

Abstract: A semiconductor device including: first and second cell regions; a substrate including first and second surfaces; first to third active patterns extending in a first horizontal direction in the first cell region, the first to third active patterns spaced apart from each other in a second horizontal direction; a fourth active pattern extending in the first horizontal direction in the second cell region, the fourth active pattern is aligned with the second active pattern in the first horizontal direction; an active cut separating the second and fourth active patterns; a source/drain region on the second active pattern; a buried rail extending in the first horizontal direction on the second surface of the substrate, the first buried rail overlaps each of the second and fourth active patterns in a vertical direction; and a source/drain contact penetrating the substrate and second active pattern and connecting the source/drain region to the buried rail.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing an inner space; a fluid supply unit configured to supply a treating fluid to the inner space; and a fluid exhaust unit configured to exhaust the treating fluid from the inner space, and wherein the fluid exhaust unit includes: an exhaust line connected to the chamber; and a pressure adjusting member installed at the exhaust line and configured to maintain a pressure of the inner space to a set pressure, and wherein the fluid supply unit includes: a fluid supply source; and a supply line provided between the fluid supply source and the chamber, and wherein at the supply line or the exhaust line a flow rate measuring member configured to measure a flow rate per unit time of the treating fluid flowing at the inner space is installed.

Abstract: The present invention discloses an exhausting device and an exhausting method in substrate processing equipment, and more particularly, a technique for controlling a processing process environment by providing a buffer space for storing chemical fumes outside a ventilation unit of the substrate processing equipment, and discharging the chemical fumes into the buffer space in accordance with a processing process in a chamber interior space.

Abstract: The present invention provides a substrate treating apparatus. The substrate treating apparatus includes: a liquid treatment chamber configured to treat a substrate with a liquid; a drying chamber configured to dry the liquid-treated substrate; a transfer robot configured to transfer the substrate between the liquid treatment chamber and the drying chamber, and including a hand which is movable along an X-axis, a Y-axis, and a Z-axis and is rotatably driven based on the Z-axis, and on which the substrate is placed; an optical system configured to photograph a form of a liquid film of the substrate, in which when the substrate is transferred from the liquid treatment chamber to the drying chamber, the substrate is wetted with a chemical liquid and is transferred by the transfer robot in a state of being formed with a liquid film formed; and a controller configured to measure the form of the liquid film photographed by the optical system.

Abstract: The inventive concept provides a substrate treating method. The substrate treating method comprising: a liquid treating step for cleaning a substrate by supplying a treating liquid to the substrate in a first process chamber; a transfer step for transferring the substrate to a second process chamber after the liquid treating step; and a drying step for removing the treating liquid remaining on the substrate in the second process chamber, and wherein the method further comprises a standby step of a liquid treated substrate to standby in the first process chamber when the liquid treated substrate of the liquid treating step cannot be transferred to the second process chamber, and at the standby step the treating liquid is discharged until the substrate can be transferred to the second process chamber.

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

Abstract: The present invention provides an apparatus for treating a substrate, including: a process chamber including a first body and a second body which are combined with each other to form a treatment space for treating a substrate is treated therein; a driver which moves the process chamber to an open position or a close position; a support unit which supports a substrate within the treatment space; and a fluid supply unit which supplies a fluid to the treatment space, in which the support unit includes: a support pin coupled to the first body or the second body; and a guide member which is coupled to the support pin and extends in a lateral direction of the support pin to support the substrate.

Abstract: An apparatus for treating a substrate includes a body having an inner space in which the substrate is dried by a drying fluid in a supercritical state, a fluid supply unit that supplies the drying fluid into the inner space, a fluid exhaust unit that releases the drying fluid from the inner space, and a controller. The controller controls the fluid supply unit and the fluid exhaust unit to perform a pressure-raising step of raising pressure in the inner space to a set pressure and a flow step of generating a flow of the drying gas in the inner space by releasing, by the fluid exhaust unit, the drying fluid from the inner space while the fluid supply unit supplies the drying fluid into the inner space.

Abstract: An image forming device and method for supporting multiple platforms are provided. The image forming device includes a communication device, a processor, a memory, and a user interface device. The processor may request an app server for a list of apps usable by the image forming device, and receive the list from the app server. The processor may determine a first app to be controlled in the list. The processor may obtain information of the second app that provides a same or similar service as a service provided by the first app based on information of the first app, and is supported by a second platform different from a first platform supporting the first app. The processor may perform an operation to control a state of the second app on the second platform based on an operation to control a state of the first app on the first platform.

Abstract: An image forming device and method for supporting multiple platforms are provided. The image forming device includes a communication device, a processor, a memory, and a user interface device. The processor may request an app server for a list of apps usable by the image forming device, and receive the list from the app server. The processor may determine a first app to be controlled in the list. The processor may obtain information of the second app that provides a same or similar service as a service provided by the first app based on information of the first app, and is supported by a second platform different from a first platform supporting the first app. The processor may perform an operation to control a state of the second app on the second platform based on an operation to control a state of the first app on the first platform.