Patents by Inventor Hyo-Seok Choi

Hyo-Seok Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming semiconductor devices with metal silicide using pre-amorphization implants
    Patent number: 9240323
    Abstract: A method of forming a semiconductor device can be provided by forming an opening that exposes a surface of an elevated source/drain region. The size of the opening can be reduced and a pre-amorphization implant (PAI) can be performed into the elevated source/drain region, through the opening, to form an amorphized portion of the elevated source/drain region. A metal-silicide can be formed from a metal and the amorphized portion.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: January 19, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chung-Hwan Shin, Sang-Bom Kang, Dae-Yong Kim, Jeong-Ik Kim, Chul-Sung Kim, Je-Hyung Ryu, Sang-Woo Lee, Hyo-Seok Choi
  • METHODS OF FORMING SEMICONDUCTOR DEVICES WITH METAL SILICIDE USING PRE-AMORPHIZATION IMPLANTS AND DEVICES SO FORMED
    Publication number: 20130316535
    Abstract: A method of forming a semiconductor device can be provided by forming an opening that exposes a surface of an elevated source/drain region. The size of the opening can be reduced and a pre-amorphization implant (PAI) can be performed into the elevated source/drain region, through the opening, to form an amorphized portion of the elevated source/drain region. A metal-silicide can be formed from a metal and the amorphized portion.
    Type: Application
    Filed: March 7, 2013
    Publication date: November 28, 2013
    Inventors: Chung-Hwan Shin, Sang-Bom Kang, Dae-Yong Kim, Jeong-Ik Kim, Chul-Sung Kim, Je-Hyung Ryu, Sang-Woo Lee, Hyo-Seok Choi
  • Method for manufacturing semiconductor device
    Patent number: 5740065
    Abstract: A method for manufacturing a semiconductor device comprises the steps of extracting an optimal working condition by accumulatively averaging accumulated working conditions of lots previously performed in an expectation process to be currently performed in the manufacturing equipment, extracting a correction condition by extracting information for an alignment state of a lower layer performed by the expectation process, and setting the working condition by adding the correction condition to the optimal working condition.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: April 14, 1998
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Chul Jang, Hyo-Seok Choi, Dong-Heui Jang, Sun-Yong Lee