Patents by Inventor Hyouk Lee

Hyouk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same
    Patent number: 10522522
    Abstract: The semiconductor package according to the present invention comprises: an integrated substrate; a bottom chip stack, which is mounted on the integrated substrate, has multiple memory semiconductor dies stacked chip-on-chip, and takes charge of a part of the whole memory capacity; at least one top chip stack, which is mounted on the bottom package, has multiple memory semiconductor dies mounted therein, and takes charge of the rest of the whole memory capacity; an integration wire for electrically connecting the bottom chip stack and the top chip stack(s); and an integration protection member for sealing the integration wire.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: December 31, 2019
    Inventors: Young Hee Song, Hyouk Lee, Ki Hong Song, Jun Hee Jeong
  • Wearable smart device having flexible semiconductor package mounted on a band
    Patent number: 10474192
    Abstract: A wearable smart device of the present invention comprises: a main body on which a basic module is mounted; a band on which at least one auxiliary module is mounted, which is selectively attached and detached to the main body made of a polymer material or a rubber material to be bent; a connector electrically connecting the main body and the band; and a coupler physically connecting the main body and the band. According to a configuration of the present invention, the present invention is possible in realizing a high-capacity and high-performance smart device.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: November 12, 2019
    Inventors: Young Hee Song, Hyouk Lee, Ki Hong Song, Jun Hee Jeong
  • WEARABLE SMART DEVICE HAVING FLEXIBLE SEMICONDUCTOR PACKAGE MOUNTED ON A BAND
    Publication number: 20180210491
    Abstract: A wearable smart device of the present invention comprises: a main body on which a basic module is mounted; a band on which at least one auxiliary module is mounted, which is selectively attached and detached to the main body made of a polymer material or a rubber material to be bent; a connector electrically connecting the main body and the band; and a coupler physically connecting the main body and the band. According to a configuration of the present invention, the present invention is possible in realizing a high-capacity and high-performance smart device.
    Type: Application
    Filed: August 1, 2016
    Publication date: July 26, 2018
    Inventors: Young Hee SONG, Hyouk LEE, Ki Hong SONG, Jun Hee JEONG
  • PACKAGE SUBSTRATE COMPRISING SIDE PADS ON EDGE, CHIP STACK, SEMICONDUCTOR PACKAGE, AND MEMORY MODULE COMPRISING SAME
    Publication number: 20180211943
    Abstract: The semiconductor package according to the present invention comprises: an integrated substrate; a bottom chip stack, which is mounted on the integrated substrate, has multiple memory semiconductor dies stacked chip-on-chip, and takes charge of a part of the whole memory capacity; at least one top chip stack, which is mounted on the bottom package, has multiple memory semiconductor dies mounted therein, and takes charge of the rest of the whole memory capacity; an integration wire for electrically connecting the bottom chip stack and the top chip stack(s); and an integration protection member for sealing the integration wire.
    Type: Application
    Filed: August 1, 2016
    Publication date: July 26, 2018
    Inventors: Young Hee SONG, Hyouk LEE, Ki Hong SONG, Jun Hee JEONG
  • Electronic device
    Patent number: D797722
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: September 19, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Electronic device
    Patent number: D803175
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: November 21, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Hyouk Lee, Hyoung-Shin Park, Kwan-Ue Hong, Jong-Bo Jung, Gi-Young Lee
  • Electronic device
    Patent number: D803829
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: November 28, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Electronic device
    Patent number: D804469
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: December 5, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Electronic device
    Patent number: D808916
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: January 30, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-Gil Song, Jung-Hyuck Im, Min-Hyouk Lee
  • Electronic device
    Patent number: D812583
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: March 13, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Electronic device
    Patent number: D825507
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: August 14, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Ho Baik, Sun-Keun Park, Min-Hyouk Lee
  • Electronic device
    Patent number: D825508
    Type: Grant
    Filed: February 20, 2014
    Date of Patent: August 14, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Ho Baik, Sun-Keun Park, Min-Hyouk Lee
  • Electronic device
    Patent number: D828344
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: September 11, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Hyouk Lee, Min-Ah Koh, Dong-Hun Kim, Joo-Ho Seo
  • Electronic device
    Patent number: D832230
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: October 30, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min Hyouk Lee
  • Electronic device
    Patent number: D846522
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: April 23, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min Hyouk Lee
  • Electronic device
    Patent number: D848387
    Type: Grant
    Filed: September 3, 2015
    Date of Patent: May 14, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min Hyouk Lee
  • Electronic device
    Patent number: D880464
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: April 7, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Han-Gil Song, Jung-Hyuck Im, Min-Hyouk Lee
  • Electronic device
    Patent number: D898006
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 6, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo-Ho Seo, Dong-Hun Kim, Han-Gil Song, Min-Hyouk Lee
  • Electronic device
    Patent number: D898007
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 6, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo-Ho Seo, Dong-Hun Kim, Han-Gil Song, Min-Hyouk Lee
  • Electronic device
    Patent number: D898008
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: October 6, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo-Ho Seo, Dong-Hun Kim, Han-Gil Song, Min-Hyouk Lee