Patents by Inventor Hyouk Lee

Hyouk Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9743729
    Abstract: An attaching and detaching device of a protection cover for protecting an electronic device is provided. The attaching and detaching device includes one or more hook units provided on the protection cover; and one or more attaching and detaching units which are provided at positions corresponding to the hook units on a rear surface of the electronic device, and are latched and fixed to or released from the hook units.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: August 29, 2017
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jung-Min Yeo, Kuk-Hwan Kim, In-Young Yeo, Jae-Ho Baik, Min-Hyouk Lee
  • Patent number: 9710022
    Abstract: An electronic device is provided that includes a body having a first display unit. The electronic device also includes a cover device having a first cover member detachably coupled to the body, and a second cover member pivotable about the first cover member. A second display unit is fixed to and integrated with an inner surface of the second cover member. The second display unit is electrically connected to the body when the first cover member is coupled to the body.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: July 18, 2017
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Min-Hyouk Lee, Dong-Kyun Kim, Seon-Keun Park, Jin-le Ryu, Ji-Young Lee, Jin-Sang Hwang
  • Patent number: 9559080
    Abstract: An integrated circuit device package may include a flexible substrate having a first wiring, an integrated circuit device having a second wiring, a flexible insulation structure having a first opening and a second opening exposing the first wiring and the second wiring, respectively, a third wiring electrically connecting the first wiring to the second wiring, and a flexible protection member covering the third wiring. A stacked flexible integrated circuit device package may include a flexible substrate, a first flexible integrated circuit device including a first connection pad, a second flexible integrated circuit device including a second connection pad, a connection wiring electrically connecting the first and the second connection pads to an external device, and a flexible protection member disposed on the second flexible integrated circuit device.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: January 31, 2017
    Assignee: Hana Micron, Inc.
    Inventors: Jae-Sung Lim, Ju-Hyung Kim, Jin-Wook Jeong, Hyun-Joo Kim, Hyouk Lee
  • Patent number: D770408
    Type: Grant
    Filed: July 23, 2014
    Date of Patent: November 1, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Hyouk Lee, Won-Kyu Sung, Ji-Young Lee, Jae-Woong Chung, Sun-Hee Cha, Du-Yeong Choi
  • Patent number: D770431
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: November 1, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Hyouk Lee, Won-Kyu Sung, Ji-Young Lee, Jae-Woong Chung, Sun-Hee Cha, Du-Yeong Choi
  • Patent number: D770432
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: November 1, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Hyouk Lee, Won-Kyu Sung, Ji-Young Lee, Jae-Woong Chung, Sun-Hee Cha, Du-Yeong Choi
  • Patent number: D771620
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: November 15, 2016
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kuk-Hwan Kim, Jae-Ho Baik, Min-Hyouk Lee
  • Patent number: D777153
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: January 24, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Hyouk Lee, Won-Kyu Sung, Ji-Young Lee, Jae-Woong Chung, Sun-Hee Cha, Du-Yeong Choi
  • Patent number: D783558
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D783559
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D783560
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D783561
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D783562
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 11, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D784279
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: April 18, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D789340
    Type: Grant
    Filed: August 6, 2014
    Date of Patent: June 13, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Hyouk Lee, Min-Ah Koh, Dong-Hun Kim, Sung-Hun Kim, Joo-Ho Seo
  • Patent number: D792394
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: July 18, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D797723
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: September 19, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D797724
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: September 19, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D797725
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: September 19, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min-Hyouk Lee
  • Patent number: D797726
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: September 19, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Lee, Hyok Su Choi, Hong Ku Yeo, Min Hyouk Lee