Patents by Inventor Hyuk Lim

Hyuk Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145171
    Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Cha, Chang Min Lee, Hye Sung Yoon, Seon A Jang, Ji Hyuk Lim, Ki Yong Lee
  • Publication number: 20240104935
    Abstract: An apparatus for recognizing an object includes a camera that obtains a 2D image, a lidar that obtains a 3D image, and a processor. The processor generates a bird's-eye view (BEV) feature map by extracting features from a two-dimensional plane BEV generated based on 3D information. The processor also generates an image feature map by extracting features of a multi-channel 2D image in which the 3D information is added to the 2D image. The processor also generates a complex feature map by mixing the image feature map and the BEV feature map. The processor also recognizes the object by artificial intelligence learning the complex feature map.
    Type: Application
    Filed: April 5, 2023
    Publication date: March 28, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jun Hyung Kim, Hee Chul Choi, Jong Hyuk Lim, Tae Koan Yoo
  • Patent number: 11941637
    Abstract: Disclosed is a method of processing item sales information by an electronic apparatus including acquiring a purchase request including item information related to an item selected by a user and information related to a payment means, providing a purchase response including approval information corresponding to the purchase request before proceeding with payment through the payment means in response to the purchase request when the information related to the payment means satisfies a first condition, transmitting a release request for the item to a first server; and requesting payment for at least some of an amount corresponding to one or more purchase requests related to the payment means according to an arrival of settlement timing corresponding to the payment means.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: March 26, 2024
    Assignee: Coupang Corp.
    Inventors: Zee Young Min, Ki Hyun Jeong, Il Hyun Seo, Hyun Ju Cho, Jin Hwan Kim, Hyun Yong Jung, Min Yong Yuk, Ho Hyun Lim, Jin Hyuk Kim
  • Publication number: 20240094601
    Abstract: A camera module includes a housing, a movable body configured to move in a direction of an optical axis of the housing; a reinforcing member formed integrally on one surface of the movable body, and configured to increase a rigidity of the movable body; and a first buffer member formed in the reinforcing member, and configured to reduce an impactive force between the housing and the movable body.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 21, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Hyuk LEE, Soo Cheol LIM, Byung Woo KANG, Young Bok YOON, Jong Woo HONG, Jung Seok LEE
  • Publication number: 20240097799
    Abstract: Disclosed is an amplification circuit, which includes a first amplifier that receives an external signal and performs first band pass filtering on the external signal to output a first filter signal, and a second amplifier that receives the first filter signal and performs second band pass filtering on the first filter signal to output a second filter signal, and a frequency pass bandwidth of the second band pass filtering is narrower than a frequency pass bandwidth of the first band pass filtering.
    Type: Application
    Filed: June 26, 2023
    Publication date: March 21, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Kyung Hwan PARK, Mi Jeong PARK, Hyung-IL PARK, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In Gi LIM
  • Publication number: 20240076127
    Abstract: Provided is a ceiling storage system capable of correcting a working position and constantly checking stability of a structure by detecting an amount of change in a facility. According to the ceiling storage system, a transport vehicle moves to an upper portion of a first storage area of a plurality of storage areas in a state of gripping an article, and the transport vehicle measures a first distance value between the transport vehicle and the first storage area using a distance sensor and measures a relative position value between the transport vehicle and the first storage area using a vision sensor, before unloading the article from the first storage area.
    Type: Application
    Filed: May 23, 2023
    Publication date: March 7, 2024
    Inventors: Sang Kyung LEE, Seung Gyu KANG, Hyun Jae KANG, Young Wook KIM, Sang A BANG, Yong-Jun AHN, Min Kyun LEE, Hyun Woo LEE, Jeong Hun LIM, Jun Hyuk CHANG
  • Patent number: 11923882
    Abstract: A hybrid communication device, an operation method thereof, and a communication system including the same are provided. The hybrid communication device includes a contact unit that includes an antenna for receiving a first communication signal and an electrode for receiving a second signal, a switch controller that includes a first switch and a second switch and controls the first switch and the second switch based on a change in capacitance of the electrode, and a signal processing unit that receives at least one of the first communication signal and the second communication signal from the contact unit via the first switch and processes the received signal. The first switch is connected to the contact unit, and the signal processing unit is connected to the first switch.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: March 5, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Tae Wook Kang, Sung Eun Kim, Hyung-Il Park, Jae-Jin Lee, Hyuk Kim, Kyung Hwan Park, Mi Jeong Park, Kyung Jin Byun, Kwang Il Oh, In Gi Lim
  • Patent number: 11908626
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a laminate body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and including a dielectric layer, and a first internal electrode and a second internal electrode stacked in the third direction with the dielectric layer interposed therebetween, a first and a second margin portion; a first connection portion and a second connection portion. The first connection portion includes a first lead electrode connected to the first internal electrode, and the second connection portion includes a second lead electrode connected to the second internal electrode.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: February 20, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung Eun Noh, Ji Hyuk Lim, Jong Yun Kim, Eun Jung Lee
  • Patent number: 11901128
    Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Cha, Chang Min Lee, Hye Sung Yoon, Seon A Jang, Ji Hyuk Lim, Ki Yong Lee
  • Publication number: 20230421404
    Abstract: A method for a first user terminal to use a messenger service of a group chat room is proposed. The method may include receiving, from a server, invitation information associated with a second user's inviting a first user to the group chat room, and displaying chat room information on the group chat room. The method may also include in response to the second user not being registered as a friend of the first user in the messenger service, displaying information on the second user and an interface for deciding whether to participate in the group chat room. The method may further include acquiring an interaction regarding a decision to participate in the group chat room through the interface, and displaying a message created in the group chat room.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 28, 2023
    Inventors: Chang Min CHUNG, Go En CHOI, Hyo Sun KIM, Ju Ho CHUNG, Yoo Hyuk LIM, Yu Ju IM, Hye Sun KIM, Hyeon Woo KIM, Euing Hyeok KIM, Ah Seong KIM, Soo Hun PARK, Tae Mi KIM, Yoon A HEO, Seung Sup KIM, Dong Woon KIM
  • Publication number: 20230411498
    Abstract: A method for fabricating semiconductor device may include forming a source/drain pattern on a fin-type pattern, forming an etch stop film and an interlayer insulating film on the source/drain pattern, forming a contact hole in the interlayer insulating film, forming a sacrificial liner along a sidewall and a bottom surface of the contact hole, performing an ion implantation process while the sacrificial liner is present, removing the sacrificial liner and forming a contact liner along the sidewall of the contact hole, and forming a source/drain contact on the contact liner. The ion implantation process may include implant impurities into the source/drain pattern. The source/drain contact may be connected to the source/drain pattern.
    Type: Application
    Filed: February 28, 2023
    Publication date: December 21, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kyu-Hee HAN, Bong Kwan BAEK, Sang Shin JANG, Koung Min RYU, Jong Min BAEK, Jung Hoo SHIN, Jun Hyuk LIM, Jung Hwan CHUN
  • Publication number: 20230400493
    Abstract: Disclosed is a radio wave device test system, comprising a fixed part configured to fix a radio wave device; a positioner system configured to control a rotation of the radio wave device by controlling the fixed part; an arch structure whose central point is located at a position where the radio wave device is located; a plurality of probes disposed to be spaced apart from one another at fixed intervals in the arch structure, and configured to receive a radio frequency (RF) signal from the raid wave device; and a plurality of receiving modules located at the plurality of probes, respectively, and configured to transform the RF signal into in-phase/quadrature (I/Q) data by carrying out digital transformation for the RF signal and to detect information on amplitude and a phase from the I/Q data.
    Type: Application
    Filed: September 24, 2022
    Publication date: December 14, 2023
    Applicant: National Radio Research Agency
    Inventors: KANG WOOK KIM, SOON SOO OH, YOUNG BAE JUNG, JONG HYUK LIM, JUNG KUY PARK, SAM YOUNG JUNG
  • Publication number: 20230395667
    Abstract: Provided is a semiconductor device including an active pattern extended in a first direction, a plurality of gate structures including a gate electrode and a gate spacer disposed to be spaced apart from each other in the first direction on the active pattern and extended in a second direction, a source/drain pattern on the active pattern, a source/drain contact on the source/drain pattern, and a contact liner structure extended along a sidewall of the source/drain contact, being in contact with the sidewall of the source/drain contact. The contact liner structure includes a first contact liner and a second contact liner on the first contact liner. The first contact liner includes a first bottom portion, and a first vertical portion protruded from the first bottom portion and extended in a third direction. A lower surface of the contact liner structure is higher than an upper surface of the source/drain pattern.
    Type: Application
    Filed: March 6, 2023
    Publication date: December 7, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu-Hee HAN, Bong Kwan Baek, Jung Hwan Chun, Koung Min RYN, Jong Min Baek, Jung Hoo Shin, Jun Hyuk Lim, Sang Shin Jang
  • Patent number: 11830654
    Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed to an external surface of the body, and a protrusion embedded in the body to be connected to the lead-out portion, and spaced apart from the external surface of the body and each of the coil portion.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: November 28, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Min Kim, Jae Hun Kim, Ji Hyuk Lim, Jong Yun Kim
  • Patent number: 11800929
    Abstract: An embodiment of the present invention provides a pull-out system comprising: at least two slide rails each having a fixed rail, a middle rail slidably arranged on the fixed rail, and a movable rail slidably arranged on the middle rail; and a synchronization means for synchronizing the movement of the movable rail, wherein the synchronization means comprises a roller unit, a synchronization bar connected to the roller unit, and a deflectable element having an end portion fixe to the roller unit and an opposite end portion connected to the movable rail, and the movable rail is configured to move as much as the amount of rotation of the roller unit.
    Type: Grant
    Filed: March 11, 2020
    Date of Patent: October 31, 2023
    Assignee: SEGOS CO., LTD.
    Inventors: Doo Myun Lee, Sung Joon Kang, In Suk Ra, Jung Kyu Lim, Sung Woo Kim, Jae Hyuk Lim, Dong Wook Kim
  • Publication number: 20230326964
    Abstract: Semiconductor devices with improved performance and reliability and methods for forming the same are provided. The semiconductor devices include an active pattern extending in a first direction, gate structures spaced apart from each other in the first direction on the active pattern, a source/drain pattern on the active pattern, a source/drain contact on the source/drain pattern, and a contact liner extending along a sidewall of the source/drain contacts. A carbon concentration of the contact liner at a first point of the contact liner is different from a carbon concentration of the contact liner at a second point of the contact liner, and the first point is at a first height from an upper surface of the active pattern, the second point is at a second height from the upper surface of the active pattern, and the first height is smaller than the second height.
    Type: Application
    Filed: November 18, 2022
    Publication date: October 12, 2023
    Inventors: Bong Kwan Baek, Jun Hyuk Lim, Jung Hwan Chun, Kyu-Hee Han, Jong Min Baek, Koung Min Ryu, Jung Hoo Shin, Sang Shin Jang
  • Publication number: 20230268276
    Abstract: There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor device may include a first interlayer insulating film containing therein a plurality of pores, a first line structure in the first interlayer insulating film, an inserted insulating film extending along and on a upper surface of the first interlayer insulating film and in contact with the first interlayer insulating film, a barrier insulating film in contact with the inserted insulating film and extending along an upper surface of the inserted insulating film and an upper surface of the first line structure, a second interlayer insulating film on the barrier insulating film and a second line structure disposed in the second interlayer insulating film and connected to the first line structure.
    Type: Application
    Filed: December 5, 2022
    Publication date: August 24, 2023
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang Hoon AHN, Kyung Seok OH, Seung-Heon LEE, Jun Hyuk LIM
  • Publication number: 20230214800
    Abstract: A method and apparatus for a remittance service are disclosed. An operation method of a server providing a remittance service includes receiving, from a remitter participating in an anonymous chatroom by using a first temporary profile, a request for a remittance to a second temporary profile participating in the anonymous chatroom, verifying a remittance qualification of an account of the remitter, generating remittance transaction information for remitting an amount corresponding to the remittance request to an account of a remittee corresponding to the second temporary profile, and transmitting, to the account of the remittee a remittance notification including information on the first temporary profile as remitter information.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 6, 2023
    Inventors: Young Min PARK, Jee Won YOU, Soo Bum KIM, Eung Ju PARK, Yoo Hyuk LIM, Gi Young NAM, Gi Woo KANG, Sang Woo LEE
  • Patent number: 11694838
    Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: July 4, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Min Kim, Jae Hun Kim, Ji Hyuk Lim, Jong Yun Kim
  • Patent number: 11673948
    Abstract: Disclosed is anti-TNF/IFN scFv-Fc bispecific antibody and a pharmaceutical composition for prevention or treatment of inflammatory bowel disease, the composition containing the antibody. The bispecific antibody has a structure in which an Fc fragment is conjugated to an scFv bispecific antibody. Thus, a purification process thereof may be easy. The bispecific antibody may effectively and simultaneously conjugate to TNF-? and IFN-? which independently play an important role in inducing Crohn's disease. Thus, the bispecific antibody may exhibit excellent effects in the treatment of inflammatory bowel disease including Crohn's disease.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: June 13, 2023
    Assignee: JP DUETBIO CO., LTD
    Inventors: Dong-Il Kim, Hyun-Myoung Cha, Jin-Hyuk Lim