Patents by Inventor Hyuk Lim

Hyuk Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11673948
    Abstract: Disclosed is anti-TNF/IFN scFv-Fc bispecific antibody and a pharmaceutical composition for prevention or treatment of inflammatory bowel disease, the composition containing the antibody. The bispecific antibody has a structure in which an Fc fragment is conjugated to an scFv bispecific antibody. Thus, a purification process thereof may be easy. The bispecific antibody may effectively and simultaneously conjugate to TNF-? and IFN-? which independently play an important role in inducing Crohn's disease. Thus, the bispecific antibody may exhibit excellent effects in the treatment of inflammatory bowel disease including Crohn's disease.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: June 13, 2023
    Assignee: JP DUETBIO CO., LTD
    Inventors: Dong-Il Kim, Hyun-Myoung Cha, Jin-Hyuk Lim
  • Publication number: 20230141461
    Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.
    Type: Application
    Filed: March 25, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Cha, Chang Min Lee, Hye Sung Yoon, Seon A Jang, Ji Hyuk Lim, Ki Yong Lee
  • Publication number: 20230069131
    Abstract: A bill storage unit of an automated teller machine according to an embodiment includes: a lower cassette and an upper cassette which have bills stored therein and are vertically stacked; an external control board disposed outside the lower cassette and the upper cassette to perform power supply and communication signal transmission to the lower cassette and the upper cassette; first and second internal control boards electrically connected to the external control board and disposed inside the lower cassette and the upper cassette to perform power supply and communication signal transmission to each of components inside the lower cassette and components inside the upper cassette; a plurality of connectors interconnected to electrically connect the external control board and the first and second internal control boards; and a position alignment means configured to, when the upper cassette is being stacked on the lower cassette, guide the plurality of connectors to be interconnected at correct positions.
    Type: Application
    Filed: July 13, 2022
    Publication date: March 2, 2023
    Inventors: Tae Gang KIM, Ji Youn CHO, Gun Hyuk LIM, Chang Ho LEE, Sang Hyun LEE
  • Publication number: 20230019730
    Abstract: Embodiments provide a polishing composition for a semiconductor process facilitating the formation of a microcircuit pattern and minimizing the generation of defects and scratches and a method of preparing a polished article using the same. Embodiments provide a polishing composition for a semiconductor process, in which the absorbance ratio of a group having a specific size of particle diameter compared to the overall average particle size (D50) is a predetermined ratio or less with respect to the absorbance of a group having a particle diameter more than 0.5 times and 2.5 times or less the overall average particle size.
    Type: Application
    Filed: July 7, 2022
    Publication date: January 19, 2023
    Applicants: SKC solmics Co., Ltd., SK HYNIX INC.
    Inventors: SEUNG CHUL HONG, DEOK SU HAN, JIN HYUK LIM, DONGHYUN KIM, JIEUN LEE
  • Patent number: 11546101
    Abstract: A cloud-based Wi-Fi network architecture consisting of a CU and RAUs is proposed as an improvement on the conventional Wi-Fi architecture with traditional access points (APs). In addition, a method for uplink data transmission in a cloud-based Wi-Fi network is proposed. In a conventional Wi-Fi network with independently operating APs, APs close to each other may not be able to utilize the same frequency band efficiently because of significant amounts of interference. However, in a cloud-based Wi-Fi network, the CU coordinates RAUs so that they can operate in the same frequency band by transmitting or receiving signals through the shared wireless medium to improve spectral efficiency. For each frequency band, the proposed system utilizes a diversity combining that combines multiple signals and introduces a single improved signal with high signal-to-noise ratio for uplink transmission in the cloud-based Wi-Fi network.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: January 3, 2023
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyuk Lim, Gyung Min Kim, Yong Gang Kim
  • Publication number: 20220392800
    Abstract: There is provided a semiconductor device including an etching stop film which is placed disposed on a substrate; an interlayer insulating film which is disposed on the etching stop film; a trench which penetrates the interlayer insulating film and the etching stop film; a spacer which extends along side walls of the trench; a barrier film which extends along the spacer and a bottom surface of the trench; and a filling film which fills the trench on the barrier film. The trench includes a first trench and a second trench which are spaced apart from each other in a first direction and have different widths from each other in the first direction. A bottom surface of the second trench is placed disposed below a bottom surface of the first trench.
    Type: Application
    Filed: May 7, 2022
    Publication date: December 8, 2022
    Inventors: Jun Hyuk LIM, Jong Min BAEK, Deok Young JUNG, Sung Jin KANG, Jang Ho LEE
  • Publication number: 20220392841
    Abstract: A semiconductor device includes an etching stop film disposed on a substrate; an interlayer insulating film on the etching stop film; a first trench and a second trench which are spaced apart in a first direction, and penetrate the etching stop film and the interlayer insulating film, the first trench having a side wall that exposes the interlayer insulating film, and the second trench having a side wall that exposes the interlayer insulating film; a first spacer which covers the interlayer insulating film exposed by the side wall of the first trench and does not cover a portion of the side wall of the first trench; a second spacer which covers the interlayer insulating film exposed by the side wall of the second trench and does not cover a portion of the side wall of the second trench; a first barrier layer which extends along a side wall of the first spacer, the portion of the side wall of the first trench not covered by the first spacer, and a bottom surface of the first trench; a first filling film which
    Type: Application
    Filed: February 14, 2022
    Publication date: December 8, 2022
    Inventors: Sung Jin KANG, Jong Min BAEK, Deok Young JUNG, Jun Hyuk LIM
  • Publication number: 20220177571
    Abstract: Disclosed is anti-TNF/IFN scFv-Fc bispecific antibody and a pharmaceutical composition for prevention or treatment of inflammatory bowel disease, the composition containing the antibody. The bispecific antibody has a structure in which an Fc fragment is conjugated to an scFv bispecific antibody. Thus, a purification process thereof may be easy. The bispecific antibody may effectively and simultaneously conjugate to TNF-? and IFN-? which independently play an important role in inducing Crohn's disease. Thus, the bispecific antibody may exhibit excellent effects in the treatment of inflammatory bowel disease including Crohn's disease.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 9, 2022
    Applicant: JP DUETBIO CO., LTD
    Inventors: Dong-Il KIM, Hyun-Myoung Cha, Jin-Hyuk Lim
  • Publication number: 20220174083
    Abstract: Provided are a method and device for detecting malicious activity over an encrypted secure channel. The method includes (a) extracting at least one record from a plurality of packets each including a header and a payload and (b) determining whether the plurality of packets correspond to a malicious flow using feature information based on the at least one record.
    Type: Application
    Filed: November 19, 2021
    Publication date: June 2, 2022
    Applicant: GIST (Gwangju Institute of Science and Technology)
    Inventors: Hyuk LIM, Ji Won YANG
  • Patent number: 11339857
    Abstract: One embodiment of the present invention provides an actuator comprising: a housing having a mounting space part formed therein; a motor part provided inside the housing and generating power; a reduction gear part of which a plurality of gears respectively having an internal gear and an external gear sequentially engage with each other so as to transmit the power generated in the motor part; and a rod part engaging with the gear disposed at the last position, and linearly moving according to the rotation of the gear, wherein one of the plurality of gears is formed such that the internal gear and the external gear can rotate together or rotate independently.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: May 24, 2022
    Assignee: SEGOS CO., LTD.
    Inventors: Doo Myun Lee, Sung Joon Kang, In Suk Ra, Jung Kyu Lim, Sung Woo Kim, Jae Hyuk Lim
  • Patent number: 11336622
    Abstract: An apparatus for deploying a firewall on a software-defined network (SDN) includes a public key distributor configured to transmit a public key, a resource monitor configured to monitor resources of a network, a host monitor configured to receive a firewall rule of at least one host, which is encrypted by the public key, a decryption unit configured to decrypt information received from the host monitor by using a secret key, a merge unit configured to merge the decrypted information to provide a merged firewall rule, and a firewall deployment unit configured to deploy the merged firewall rule to a switch.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: May 17, 2022
    Assignee: GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyuk Lim, Sung Hwan Kim, Jargalsaikhan Narantuya, Seung Hyun Yoon
  • Publication number: 20220142363
    Abstract: An embodiment of the present invention provides a pull-out system comprising: at least two slide rails each having a fixed rail, a middle rail slidably arranged on the fixed rail, and a movable rail slidably arranged on the middle rail; and a synchronization means for synchronizing the movement of the movable rail, wherein the synchronization means comprises a roller unit, a synchronization bar connected to the roller unit, and a deflectable element having an end portion fixe to the roller unit and an opposite end portion connected to the movable rail, and the movable rail is configured to move as much as the amount of rotation of the roller unit.
    Type: Application
    Filed: March 11, 2020
    Publication date: May 12, 2022
    Inventors: Doo Myun LEE, Sung Joon KANG, In Suk RA, Jung Kyu LIM, Sung Woo KIM, Jae Hyuk LIM, Dong Wook KIM
  • Publication number: 20220093339
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a laminate body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and including a dielectric layer, and a first internal electrode and a second internal electrode stacked in the third direction with the dielectric layer interposed therebetween, a first and a second margin portion; a first connection portion and a second connection portion. The first connection portion includes a first lead electrode connected to the first internal electrode, and the second connection portion includes a second lead electrode connected to the second internal electrode.
    Type: Application
    Filed: July 12, 2021
    Publication date: March 24, 2022
    Inventors: Jung Eun Noh, Ji Hyuk Lim, Jong Yun Kim, Eun Jung Lee
  • Publication number: 20210398738
    Abstract: A coil component includes a body having one surface and the other surface, opposing each other, and both end surfaces, opposing each other, a support substrate disposed inside the body, and including a core portion, and a support portion connected to the core portion, a coil portion disposed on the core portion, and a lead portion disposed on the support portion and connected to the coil portion to be exposed to one surface of the body. The support portion is disposed to be more adjacent to the one surface of the body than the core portion.
    Type: Application
    Filed: April 5, 2021
    Publication date: December 23, 2021
    Inventors: Yong Min KIM, Jae Hun KIM, Ji Hyuk LIM, Jong Yun KIM
  • Patent number: 11084771
    Abstract: The present invention relates to a method for purifying phenol, which comprises: contacting a phenol stream comprising hydroxyacetone, 2-methylbenzofuran, 3-methylbenzofuran and phenol with an acyl chloride in the presence of an organic sulfonic acid to convert one or more selected from the group consisting of hydroxyacetone, 2-methylbenzofuran and 3-methylbenzofuran into a high boiling point compound having a boiling point higher than that of the phenol; and recovering the high boiling point compound from the phenol stream.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: August 10, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Hyun Nam, Young Ho Lee, Ki Yong Yoon, Jun Hyuk Lim, Kyung Moo Lee
  • Publication number: 20210198170
    Abstract: The present invention relates to a method for purifying phenol, which comprises: contacting a phenol stream comprising hydroxy acetone, 2-methylbenzofuran, 3-methylbenzofuran and phenol with an acyl chloride in the presence of an organic sulfonic acid to convert one or more selected from the group consisting of hydroxyacetone, 2-methylbenzofuran and 3-methylbenzofuran into a high boiling point compound having a boiling point higher than that of the phenol; and recovering the high boiling point compound from the phenol stream.
    Type: Application
    Filed: January 11, 2018
    Publication date: July 1, 2021
    Inventors: Hyun NAM, Young Ho LEE, Ki Yong YOON, Jun Hyuk LIM, Kyung Moo LEE
  • Patent number: 11028876
    Abstract: A slide unit includes a fixed rail fixed to a main body, and provided with a first accommodation space, a movable rail connected to a drawer body to allow the drawer body to be pulled out from and pushed into the main body, provided with a second accommodation space, and configured to be movable with respect to the fixed rail, an inner rail configured such that a first end thereof is inserted in the first accommodation space and a second end thereof is inserted in the second accommodation space, so as to allow the movable rail to be slidable with respect to the fixed rail, and a plurality of slide balls inserted in the first accommodation space to be disposed between the fixed rail and the inner rail, and inserted in the second accommodation space to be disposed between the movable rail and the inner rail.
    Type: Grant
    Filed: November 23, 2018
    Date of Patent: June 8, 2021
    Assignee: SEGOS CO., LTD.
    Inventors: Doo Myun Lee, Sung Joon Kang, Duc Hoi Kim, In Suk Ra, Jung Kyu Lim, Sung Woo Kim, Jae Hyuk Lim
  • Patent number: 10903196
    Abstract: A semiconductor package includes first and second semiconductor dies, first and second redistributed line structures, a first bridge die, and a vertical connector. The first semiconductor die and the first bridge die are disposed on the first redistributed line structure. The first bridge die is disposed to provide a level difference between the first semiconductor die and the first bridge die, the first bridge die having a height that is less than a height of the first semiconductor die. The second redistributed line structure has a protrusion, laterally protruding from a side surface of the first semiconductor die when viewed from a plan view, and a bottom surface of the second redistributed line structure is in contact with a top surface of the first semiconductor die. The second semiconductor die is disposed on the second redistributed line structure. The vertical connector is disposed between the bridge die and the protrusion of the second redistributed line structure to support the protrusion.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: January 26, 2021
    Assignee: SK hynix Inc.
    Inventors: Ki Jun Sung, Sang Hyuk Lim
  • Publication number: 20210010574
    Abstract: One embodiment of the present invention provides an actuator comprising: a housing having a mounting space part formed therein; a motor part provided inside the housing and generating power; a reduction gear part of which a plurality of gears respectively having an internal gear and an external gear sequentially engage with each other so as to transmit the power generated in the motor part; and a rod part engaging with the gear disposed at the last position, and linearly moving according to the rotation of the gear, wherein one of the plurality of gears is formed such that the internal gear and the external gear can rotate together or rotate independently.
    Type: Application
    Filed: March 4, 2019
    Publication date: January 14, 2021
    Inventors: Doo Myun LEE, Sung Joon KANG, In Suk RA, Jung Kyu LIM, Sung Woo KIM, Jae Hyuk LIM
  • Publication number: 20200402699
    Abstract: A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed to an external surface of the body, and a protrusion embedded in the body to be connected to the lead-out portion, and spaced apart from the external surface of the body and each of the coil portion.
    Type: Application
    Filed: November 26, 2019
    Publication date: December 24, 2020
    Inventors: Yong Min KIM, Jae Hun KIM, Ji Hyuk LIM, Jong Yun KIM