Patents by Inventor Hyun Cheol Bae

Hyun Cheol Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11333349
    Abstract: Disclosed herein are a fluid sand falling type circulating fluidized bed boiler with a plurality of risers for preventing erosion and corrosion of water tubes and increasing combustion efficiency, and a method of operating the same. The fluid sand falling type circulating fluidized bed boiler with a plurality of risers includes a boiler section into which fuel and oxidizer are injected, a riser section connected to the boiler section so that the fuel and fluid sand supplied from the boiler section are introduced from the bottom of the riser section and flow up, and a relay section provided on the boiler section to supply the fluid sand having passed through the riser section to the boiler section, wherein the fuel is injected from the top of the boiler section and burned while flowing down therein.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: May 17, 2022
    Assignees: Korea Institute of Industrial Technology, Korea Institute of Energy Research, Korea Institute of Machinery & Materials
    Inventors: Uen Do Lee, Byeong Ryeol Bang, Young Doo Kim, Soo Hwa Jeong, Chang Won Yang, Jae Goo Lee, Tae Young Mun, Myung Won Seo, Ji Hong Moon, Hyun Seol Park, Joon Mok Shim, Young Cheol Park, Do Won Shun, Jong Ho Moon, Dal Hee Bae, Sung Ho Jo, Yun Tae Hwang, Sang In Keel, Jin Han Yun, ChungKyu Lee, Pil Woo Heo
  • Patent number: 11333891
    Abstract: Provided are a wearable display device and a light guide element thereof, the display device including: a display element configured to project a first light forming a virtual image; and a light guide element configured to guide the first light from the display element and a second light input from outside of the wearable display device to a predetermined position. The light guide element includes: a first optical surface facing the display element; a second optical surface and a third optical surface configured to reflect the first light input through the first optical surface; and a fourth optical surface configured to reflect the reflected first light to the predetermined position. The first to third optical surfaces are flat surfaces, and the fourth optical surface is a rotationally asymmetric reflective surface.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: May 17, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Cheol Bae, Myong-Jo Choi, Jun-ho Koh, Chang-han Kim, Hyun-jung Kim
  • Publication number: 20210358885
    Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
    Type: Application
    Filed: July 28, 2021
    Publication date: November 18, 2021
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun-cheol BAE
  • Patent number: 11107790
    Abstract: A laser bonding method includes forming a bonding part including an adhesive layer and a conductive particle disposed within the adhesive layer on a substrate; aligning a bonding target by disposing the bonding target on a surface of the bonding part opposite the substrate; disposing a pressing part on a surface of the bonding target that is opposite to the bonding part and pressing the bonding target onto the bonding part through the pressing part; heating the bonding target by irradiating at least the pressing part with a laser and conducting heat from the pressing part to the bonding target and from the bonding target to the bonding part; and bonding together the bonding part and the bonding target by the heat conducted from the bonding target to the bonding part so that the conductive particle electrically connects the substrate and the bonding target. The pressing part may be removed.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: August 31, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong Choi, Yong Sung Eom, KeonSoo Jang, Seok-Hwan Moon, Hyun-cheol Bae
  • Publication number: 20210162674
    Abstract: Provided is an apparatus for supplying a pellet, the apparatus including a supply chamber accommodating a pellet, a rotation unit connected to a driving unit, and a supply unit coupled to the supply chamber. Here, the rotation unit includes a rotation shaft extending in a first direction, a screw coupled to an outer surface of the rotation shaft and progressing in the first direction, and a scraper extending from the outer surface of the rotation shaft in a direction crossing the first direction. Also, the supply unit surrounds the screw, and the scraper is disposed in the supply chamber while being positioned higher than the screw.
    Type: Application
    Filed: December 2, 2020
    Publication date: June 3, 2021
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kyung Hyun KIM, Hyun-cheol BAE
  • Patent number: 10636761
    Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: April 28, 2020
    Assignee: Electronics and Telecommunications Reearch Institute
    Inventors: Kwang-Seong Choi, Yong-Sung Eom, Keon-Soo Jang, Seok Hwan Moon, Hyun-Cheol Bae, Ieeseul Jeong, Wagno Alves Braganca Junior
  • Publication number: 20200075535
    Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong CHOI, Yong Sung EOM, KeonSoo JANG, Seok-Hwan MOON, Hyun-cheol BAE
  • Publication number: 20190287870
    Abstract: The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 19, 2019
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: KeonSoo JANG, Yong Sung EOM, KWANG-SEONG CHOI, Seok-Hwan MOON, Hyun-cheol BAE
  • Publication number: 20190211231
    Abstract: Provided are an adhesive film, and a method of fabricating a semiconductor package using the same. The adhesive film includes a thermoplastic resin containing a hydroxyl group, a thermosetting resin, and an anhydride.
    Type: Application
    Filed: December 14, 2018
    Publication date: July 11, 2019
    Inventors: KeonSoo JANG, Yong Sung EOM, Kwang-Seong CHOI, Seok-Hwan MOON, Hyun-cheol BAE
  • Publication number: 20190067235
    Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Kwang-Seong CHOI, Yong-Sung Eom, Keon-Soo Jang, Seok Hwan Moon, Hyun-Cheol Bae, leeseul Jeong, Wagno Alves Braganca Junior
  • Patent number: 10033546
    Abstract: The system for reprogramming a plurality of control units includes a first control unit and a second control unit connected by one CAN bus, and a diagnosing unit. The diagnosing unit includes a first controller configured to reprogram the first control unit and a second controller configured to reprogram the second control unit. The diagnosing unit is configured to perform bidirectional reprogramming for the first control unit and the second control unit while sharing information between the first controller and the second controller.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: July 24, 2018
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: So Jin Lee, Hyun Cheol Bae, Kang Ju Cha, Chung Hi Lee, Ji Hwon Kim
  • Patent number: 9980393
    Abstract: A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: May 22, 2018
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Yong Sung Eom, Kwang-Seong Choi, Hyun-cheol Bae, Jung Hyun Noh, Jong Tae Moon
  • Patent number: 9853010
    Abstract: Provided is a method of fabricating a semiconductor package. The method includes providing a package substrate including a pad, mounting a semiconductor chip with a solder ball on the package substrate to allow the solder ball to be disposed on the pad, filling a space between the package substrate and the semiconductor chip with a underfill resin including a reducing agent comprising a carboxyl group, and irradiating the semiconductor chip with a laser to bond the solder ball to the pad, wherein the bonding of the solder ball to the pad comprises changing a metal oxide layer formed on surfaces of the pad and the solder ball to a metal layer by heat generated by the laser.
    Type: Grant
    Filed: December 3, 2015
    Date of Patent: December 26, 2017
    Assignee: ELECTGRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong Choi, Hyun-cheol Bae, Yong Sung Eom, Jin Ho Lee, Haksun Lee
  • Publication number: 20170141071
    Abstract: Provided is a method of fabricating a semiconductor package. The method includes providing a package substrate including a pad, mounting a semiconductor chip with a solder ball on the package substrate to allow the solder ball to be disposed on the pad, filling a space between the package substrate and the semiconductor chip with a underfill resin including a reducing agent comprising a carboxyl group, and irradiating the semiconductor chip with a laser to bond the solder ball to the pad, wherein the bonding of the solder ball to the pad comprises changing a metal oxide layer formed on surfaces of the pad and the solder ball to a metal layer by heat generated by the laser.
    Type: Application
    Filed: December 3, 2015
    Publication date: May 18, 2017
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong CHOI, Hyun-cheol BAE, Yong Sung EOM, Jin Ho LEE, Haksun LEE
  • Patent number: 9538666
    Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: January 3, 2017
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Kwang-Seong Choi, Hyun-cheol Bae, Haksun Lee, Yong Sung Eom
  • Publication number: 20160358892
    Abstract: Provided is a method for manufacturing a semiconductor package, which includes providing a first substrate, providing, over the first substrate, a second substrate including an active region in which a semiconductor element is disposed and a periphery region surrounding the active region, providing an adhesive membrane between the first and second substrates, and mounting the second substrate on the first substrate, wherein the mounting of the second substrate includes aligning the second substrate on the first substrate by using an alignment member protruding from the periphery region of the second substrate.
    Type: Application
    Filed: June 2, 2016
    Publication date: December 8, 2016
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Haksun LEE, KWANG-SEONG CHOI, Hyun-cheol BAE, Yong Sung EOM
  • Patent number: 9432207
    Abstract: An Ethernet based vehicle network message transferring system is provided that includes a gateway switch that connects the Ethernet to vehicle networks having different protocols and an Ethernet switch that switches Ethernet messages between the gateway switch and vehicle devices to transfer the Ethernet messages. The Ethernet switch includes a processing module that transfers the Ethernet messages received via the gateway switch in the different vehicle networks, a vehicle network process module that switches the messages transferred from the processing module, and a lookup table in which information necessary for switching the vehicle network process module is stored.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: August 30, 2016
    Assignees: Hyundai Motor Company, Kia Motors Corporation, Research & Business Foundation Sungkyunkwan University
    Inventors: Suk Hyun Seo, Hyun Cheol Bae, Chung Hi Lee, Jae Wook Jeon, Jin Ho Kim
  • Publication number: 20160094258
    Abstract: Provided are a transceiver module and a communication apparatus including the same. The transceiver module includes a lower substrate, a thermoelectric device on the lower substrate, and an upper substrate which is disposed on the thermoelectric device and on which high frequency devices cooled by the thermoelectric device are mounted. The upper substrate includes a ceramic printed circuit board (PCB).
    Type: Application
    Filed: September 17, 2015
    Publication date: March 31, 2016
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Hyun-cheol BAE, Yong Sung EOM, Haksun LEE, KWANG-SEONG CHOI
  • Patent number: 9293795
    Abstract: An apparatus and a method for controlling cooling of a battery of an environment-friendly vehicle which transmits only a control condition from a BMS to a motor controller for cooling is provided. In particular, a cooling fan motor controller and the battery management system (BMS) are connected through a controller area network (CAN) communication, and a backup controller to which a backup power is supplied operates the cooling fan motor controller, when CAN communication is abnormal, to instruct a control condition for a cooling fan motor controller. As such, a stable control for a cooling fan motor for cooling the battery is provided.
    Type: Grant
    Filed: October 23, 2013
    Date of Patent: March 22, 2016
    Assignee: Hyundai Motor Company
    Inventors: Mun Soon Kwon, Won Seon Sim, Dae Sung Kim, Hyun Cheol Bae
  • Patent number: 9231967
    Abstract: An apparatus for detecting an in-vehicle network attack, is configured to cumulatively count packets for each device that has a respective ID and is connected to an in-vehicle network bus. The apparatus is configured to cumulate a check value every time the packets are cumulatively counted to calculate a cumulated value, and determine that an attack is conducted when an average cumulated value obtained by dividing the cumulated value by a cumulative counted value does not exceed a first threshold value.
    Type: Grant
    Filed: June 17, 2013
    Date of Patent: January 5, 2016
    Assignees: HYUNDAI MOTOR COMPANY, SNU R&DB FOUNDATION, INDUSTRY-ACADEMIC COOPERATION FOUNDATION, CHOSAUN UNIVERSITY
    Inventors: Hyun Soo Ahn, Chung Hi Lee, Byoung Wook Lee, Hyun Cheol Bae, Jong Seon No, Ji Youp Kim, Jun Young Woo, Chang Min Cho, Young Sik Kim, Young Sik Moon