Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.

Abstract: A laser bonding method includes forming a bonding part including an adhesive layer and a conductive particle disposed within the adhesive layer on a substrate; aligning a bonding target by disposing the bonding target on a surface of the bonding part opposite the substrate; disposing a pressing part on a surface of the bonding target that is opposite to the bonding part and pressing the bonding target onto the bonding part through the pressing part; heating the bonding target by irradiating at least the pressing part with a laser and conducting heat from the pressing part to the bonding target and from the bonding target to the bonding part; and bonding together the bonding part and the bonding target by the heat conducted from the bonding target to the bonding part so that the conductive particle electrically connects the substrate and the bonding target. The pressing part may be removed.

Abstract: Provided is an apparatus for supplying a pellet, the apparatus including a supply chamber accommodating a pellet, a rotation unit connected to a driving unit, and a supply unit coupled to the supply chamber. Here, the rotation unit includes a rotation shaft extending in a first direction, a screw coupled to an outer surface of the rotation shaft and progressing in the first direction, and a scraper extending from the outer surface of the rotation shaft in a direction crossing the first direction. Also, the supply unit surrounds the screw, and the scraper is disposed in the supply chamber while being positioned higher than the screw.

Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.

Abstract: Provides is a laser bonding method. The method includes forming a bonding part on a substrate; aligning a bonding target on the bonding part and bonding the bonding part and the bonding target. The bonding includes heating the bonding part using a laser. The bonding part formed on the substrate includes an adhesive layer and a conductive particle located in the adhesive layer.

Abstract: The inventive concept relates to a filling composition for a semiconductor package. The filling composition for a semiconductor package may include a resin, a curing agent, and an insulating filler. The insulating filler may include a first filler body part, a second filler body part, a polymer chain coupled to the first filler body part and the second filler body part, and supramolecules coupled to the polymer chain.

Abstract: Provided are an adhesive film, and a method of fabricating a semiconductor package using the same. The adhesive film includes a thermoplastic resin containing a hydroxyl group, a thermosetting resin, and an anhydride.

Abstract: Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.

Abstract: The system for reprogramming a plurality of control units includes a first control unit and a second control unit connected by one CAN bus, and a diagnosing unit. The diagnosing unit includes a first controller configured to reprogram the first control unit and a second controller configured to reprogram the second control unit. The diagnosing unit is configured to perform bidirectional reprogramming for the first control unit and the second control unit while sharing information between the first controller and the second controller.

Abstract: A pattern-forming method for forming a conductive circuit pattern, the pattern-forming method including the steps of: preparing a pattern-forming composition composed of: Cu powder; solder particles for electrically coupling the Cu powder; a polymer resin; a deforming agent that is selected from among acrylate oligomer, polyglycols, glycerides, polypropylene glycol, dimethyl silicon, simethinecone, tributyl phosphare, and polymethylsiloxane, and that increases bonding force between the Cu powder and the solder particles; a curing agent; and a reductant; forming a circuit pattern by printing the pattern-forming composition on a substrate; heating the circuit pattern at a temperature effective to cure the pattern-forming composition and provide the conductive circuit pattern; and electrolytically plating a metal layer onto the conductive circuit pattern. A circuit pattern having superior conductivity is formed at low cost.

Abstract: Provided is a method of fabricating a semiconductor package. The method includes providing a package substrate including a pad, mounting a semiconductor chip with a solder ball on the package substrate to allow the solder ball to be disposed on the pad, filling a space between the package substrate and the semiconductor chip with a underfill resin including a reducing agent comprising a carboxyl group, and irradiating the semiconductor chip with a laser to bond the solder ball to the pad, wherein the bonding of the solder ball to the pad comprises changing a metal oxide layer formed on surfaces of the pad and the solder ball to a metal layer by heat generated by the laser.

Abstract: Provided is a method of fabricating a semiconductor package. The method includes providing a package substrate including a pad, mounting a semiconductor chip with a solder ball on the package substrate to allow the solder ball to be disposed on the pad, filling a space between the package substrate and the semiconductor chip with a underfill resin including a reducing agent comprising a carboxyl group, and irradiating the semiconductor chip with a laser to bond the solder ball to the pad, wherein the bonding of the solder ball to the pad comprises changing a metal oxide layer formed on surfaces of the pad and the solder ball to a metal layer by heat generated by the laser.

Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

Abstract: Provided is a method for manufacturing a semiconductor package, which includes providing a first substrate, providing, over the first substrate, a second substrate including an active region in which a semiconductor element is disposed and a periphery region surrounding the active region, providing an adhesive membrane between the first and second substrates, and mounting the second substrate on the first substrate, wherein the mounting of the second substrate includes aligning the second substrate on the first substrate by using an alignment member protruding from the periphery region of the second substrate.

Abstract: An Ethernet based vehicle network message transferring system is provided that includes a gateway switch that connects the Ethernet to vehicle networks having different protocols and an Ethernet switch that switches Ethernet messages between the gateway switch and vehicle devices to transfer the Ethernet messages. The Ethernet switch includes a processing module that transfers the Ethernet messages received via the gateway switch in the different vehicle networks, a vehicle network process module that switches the messages transferred from the processing module, and a lookup table in which information necessary for switching the vehicle network process module is stored.

Abstract: Provided are a transceiver module and a communication apparatus including the same. The transceiver module includes a lower substrate, a thermoelectric device on the lower substrate, and an upper substrate which is disposed on the thermoelectric device and on which high frequency devices cooled by the thermoelectric device are mounted. The upper substrate includes a ceramic printed circuit board (PCB).

Abstract: An apparatus and a method for controlling cooling of a battery of an environment-friendly vehicle which transmits only a control condition from a BMS to a motor controller for cooling is provided. In particular, a cooling fan motor controller and the battery management system (BMS) are connected through a controller area network (CAN) communication, and a backup controller to which a backup power is supplied operates the cooling fan motor controller, when CAN communication is abnormal, to instruct a control condition for a cooling fan motor controller. As such, a stable control for a cooling fan motor for cooling the battery is provided.

Abstract: An apparatus for detecting an in-vehicle network attack, is configured to cumulatively count packets for each device that has a respective ID and is connected to an in-vehicle network bus. The apparatus is configured to cumulate a check value every time the packets are cumulatively counted to calculate a cumulated value, and determine that an attack is conducted when an average cumulated value obtained by dividing the cumulated value by a cumulative counted value does not exceed a first threshold value.

Abstract: Provided is a stack module package including: a first substrate where a first device is mounted, and a second substrate where a second device is mounted. The second substrate has a greater thickness than the first substrate, and the second device has a greater thickness than the first device. The first and second devices are vertically connected to each other.

Abstract: A backbone network system for a vehicle enables high-speed and large-capacity data transmission between integrated control modules mounted in the vehicle, such that communication can be maintained through another alternative communication line when an error occurs in a specific communication line. The backbone network system enables various kinds of integrated control modules mounted in the vehicle to perform large-capacity and high-speed communications, based on Ethernet communication, by connecting domain gateways of the integrated control modules through an Ethernet backbone network, and provides a fast fail-safe function so that domain gateways can perform communications through another communication line when an error occurs in a communication line between the domain gateways.