Abstract: Provided is a semiconductor device. The semiconductor device includes: a first semiconductor layer having a first region with a first device and a second region with a second device; a device isolation pattern provided in the first semiconductor layer and electrically separating the first device and the second device from each other; a drain provided on a lower surface of the first region of the first semiconductor layer; and a second semiconductor layer provided on a lower surface of the second region of the first semiconductor layer.

Abstract: The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost.

Abstract: Provided is a semiconductor device and a method of manufacturing the same. In the method of manufacturing a semiconductor device, a substrate is prepared which is transparent and has a plurality of first electrodes thereon, and a semiconductor chip having a plurality of second electrodes thereon is disposed on the substrate to allow the first and second electrodes to respectively face each other. A polymer layer including solder particles and an oxidizing agent is formed between the substrate and the semiconductor chip, and the solder particles is locally fused between the first and second electrodes by using a laser beam and a fused solder layer is formed which electrically connects between the first and second electrodes.

Abstract: Provided is a semiconductor device. The semiconductor device includes: a first semiconductor layer having a first region with a first device and a second region with a second device; a device isolation pattern provided in the first semiconductor layer and electrically separating the first device and the second device from each other; a drain provided on a lower surface of the first region of the first semiconductor layer; and a second semiconductor layer provided on a lower surface of the second region of the first semiconductor layer.

Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.

Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.

Abstract: An Ethernet backbone network system for a vehicle and a method for controlling a fail safe of the Ethernet backbone network system enable high-speed and large-capacity data transmission between integrated control modules mounted in the vehicle, such that communication can be maintained through another alternative communication line when an error occurs in a specific communication line. The Ethernet backbone network system enables various kinds of integrated control modules mounted in the vehicle to perform large-capacity and high-speed communications, based on Ethernet communication, by connecting domain gateways of the integrated control modules through an Ethernet backbone network, and provides a fast fail-safe function so that domain gateways can perform communications through another communication line when an error occurs in a communication line between the domain gateways.

Abstract: Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction.

Abstract: An Ethernet based vehicle network message transferring system is provided that includes a gateway switch that connects the Ethernet to vehicle networks having different protocols and an Ethernet switch that switches Ethernet messages between the gateway switch and vehicle devices to transfer the Ethernet messages. The Ethernet switch includes a processing module that transfers the Ethernet messages received via the gateway switch in the different vehicle networks, a vehicle network process module that switches the messages transferred from the processing module, and a lookup table in which information necessary for switching the vehicle network process module is stored.

Abstract: Provided is a method of fabricating a solder particle including adding a first magnetic bar in a first container including a mixture containing first solder particles formed through a mixing process, disposing the first container in a second container including a second magnetic bar, operating the first magnetic bar and the second magnetic bar, and applying heat to the first container to melt the first solder particles.

Abstract: An apparatus and a method for controlling cooling of a battery of an environment-friendly vehicle which transmits only a control condition from a BMS to a motor controller for cooling is provided. In particular, a cooling fan motor controller and the battery management system (BMS) are connected through a controller area network (CAN) communication, and a backup controller to which a backup power is supplied operates the cooling fan motor controller, when CAN communication is abnormal, to instruct a control condition for a cooling fan motor controller. As such, a stable control for a cooling fan motor for cooling the battery is provided.

Abstract: Provided are methods of forming a bump and a semiconductor device with the same. The method may include providing a substrate with pads, forming a bump maker layer to cover the pads and include a resin and solder particles, thermally treating the bump maker layer to aggregate the solder particles onto the pads, removing the resin to expose the aggregated solder particles, forming a resin layer to cover the aggregated solder particles, and reflowing the aggregated solder particles to form bumps on the pads.

Abstract: The system for reprogramming a plurality of control units includes a first control unit and a second control unit connected by one CAN bus, and a diagnosing unit. The diagnosing unit includes a first controller configured to reprogram the first control unit and a second controller configured to reprogram the second control unit. The diagnosing unit is configured to perform bidirectional reprogramming for the first control unit and the second control unit while sharing information between the first controller and the second controller.

Abstract: An apparatus and a method for modeling a controller of a CAN bus are provided. The apparatus for modeling a controller of a CAN bus includes a modeling device for modeling a communication unit of a controller of the CAN bus and for evaluating the communication unit in a configuration of a CAN bus topology of the CAN bus. The modeling device includes an evaluation item determiner for determining the evaluation item used for simulating the configuration of the CAN bus topology, a factor determiner for determining factors that affect the evaluation result of the determined evaluation items, and a circuit design device for designing the circuit configured to include the determined factors.

Abstract: A steering device having a tilting function and a telescopic function that includes a steering handle that is manipulated by a driver to adjust a running direction of a vehicle. A sensing unit is formed in one region of the steering handle and is configured to sense a contact of an object or contact pressure applied thereto. A tilting device and a telescope device are configured to tilt the steering handle or adjust a length of a steering column In addition, a controller is configured to adjust a tilting angle of the steering handle and a length of the steering column by operating the tilting device and the telescope device based on a direction in which a contacted portion moves or a direction in which contact pressure is applied, which is sensed by the sensing unit.

Abstract: A system for providing parking information based on dual wireless communication including a vehicle terminal configured to connect to a server via a first wireless communication network when a parking information request is generated, and configured to connect to the server via a second wireless communication network if a connection via the first wireless communication network is failed, thereby receiving and displaying the parking information on a screen.

Abstract: An apparatus for detecting an in-vehicle network attack, is configured to cumulatively count packets for each device that has a respective ID and is connected to an in-vehicle network bus. The apparatus is configured to cumulate a check value every time the packets are cumulatively counted to calculate a cumulated value, and determine that an attack is conducted when an average cumulated value obtained by dividing the cumulated value by a cumulative counted value does not exceed a first threshold value.

Abstract: Disclosed is a silicon interposer that can reduce the entire area of a semiconductor package and increase the degree of integration by forming inductors at a lower part in addition to an upper part of a silicon substrate. The silicon interposer includes a silicon substrate, an upper inductor layer formed at the upper part of the silicon substrate and a lower inductor layer formed at the lower part of the silicon substrate.

Abstract: A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin.

Abstract: The disclosed system includes a first unit including at least one sensor. The first unit senses driving situations (characteristics) of a vehicle through the at least one sensor. Furthermore a second unit is configured to receive location-based information about the vehicle, and a control unit which includes an operation statistic unit calculates an acceptable range to be output by the first unit on a particular type of road based on the information detected by the sensing unit and the information received by the location second unit. The control unit also includes an abnormal driving determination unit which compares values sensed by the first unit with values calculated by the operation statistic unit to determine whether or not the vehicle is being driven in an abnormal state.