Abstract: A circuit board according to an embodiment includes an insulating layer; and a via portion disposed in a via hole formed in the insulating layer; wherein the via portion includes: a first pad disposed on a lower surface of the insulating layer; a second pad disposed on an upper surface of the insulating layer; a third pad disposed in the via hole and disposed on the first pad; and a connection portion disposed in the via hole and disposed between the second pad and the third pad.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 ?m to 0.31 ?m.

Abstract: A circuit board, according to an embodiment, comprises: a first insulating layer; a second insulating layer disposed on one surface of the first insulating layer; and a third insulating layer disposed on the other surface of the first insulating layer. A circuit pattern is disposed on at least one insulating layer from among the first to third insulating layers, at least one insulating layer from among the first to third insulating layers comprises glass fiber, at least one insulating layer from among the first to third insulating layers does not comprise glass fiber, and the thicknesses of the first to third insulating layers are different from each other.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 ?m to 0.31 ?m.

Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.

Abstract: A circuit board according to an embodiment of the present invention comprises: a first metal layer; an insulating layer disposed on the first metal layer and comprising boron nitride agglomerate particles coated with a resin; and a second metal layer disposed on the insulating layer, wherein: one of both surfaces of the first metal layer, on which the insulating layer is disposed, is in at least partial contact with one surface of the insulating layer; one of both surfaces of the second metal layer, on which the insulating layer is disposed, is in at least partial contact with the other surface of the insulating layer; a plurality of grooves are formed on a surface which is one of both surfaces of at least one of the first metal layer and the second metal layer and which has the insulating layer disposed thereon; at least some of the particles are arranged in at least some of the plurality of grooves; the width (W) of at least one of the plurality of grooves is 1 to 1.

Abstract: A light-emitting device according to an embodiment of the present invention includes a substrate; a light-emitting structure provided on the substrate, and including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer provided between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode provided on the light-emitting structure; a first connecting electrode provided on the first electrode; a second electrode provided on the light-emitting structure; a second connecting electrode provided on the second electrode; and a support layer provided around the first electrode, the first connecting electrode, the second electrode and the second connecting electrode. The support layer includes a first support layer having a first coefficient of thermal expansion, and a second support layer provided on the first support layer and having a second coefficient of thermal expansion.

Abstract: An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.

Abstract: A light-emitting device according to an embodiment of the present invention includes a substrate; a light-emitting structure provided on the substrate, and including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer provided between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode provided on the light-emitting structure; a first connecting electrode provided on the first electrode; a second electrode provided on the light-emitting structure; a second connecting electrode provided on the second electrode; and a support layer provided around the first electrode, the first connecting electrode, the second electrode and the second connecting electrode. The support layer includes a first support layer having a first coefficient of thermal expansion, and a second support layer provided on the first support layer and having a second coefficient of thermal expansion.

Abstract: A printed circuit board having an improved heat radiation performance, and a light-emitting device including the same are provided. The printed circuit board includes a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, and a second electrode layer disposed on the first insulation layer. The first insulation layer includes a cavity formed through a part thereof. At least a portion of the one surface of the first electrode layer may be exposed to the outside through the cavity.

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract: A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract: An inorganic filler included in an epoxy resin composition includes a coating layer formed on a surface thereof, and the surface of the coating layer includes at least two elements selected from the group consisting of C, N and O.

Abstract: The present invention relates to a printed circuit board having an improved heat radiation performance, and a light-emitting device including the same. A printed circuit board according to an embodiment of the present invention comprises: a first electrode layer, a first insulation layer disposed on one surface of the first electrode layer, the first insulation layer including at least a cavity formed through a part thereof; and a second electrode layer disposed on the first insulation layer, wherein at least a part of the one surface of the first electrode layer can be exposed to the outside through the cavity.

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract: A light emitting element module according to an embodiment of the present invention includes a first metal substrate; a second metal substrate on the first metal substrate; an insulation layer on the second metal substrate and including at least one of a carbide-based insulation material and a nitride-based insulation material; a circuit pattern on the insulation layer; and a light emitting element on the insulation layer.

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.

Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.