Patents by Inventor Hyun Gu IM

Hyun Gu IM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INORGANIC FILLER, RESIN COMPOSITION COMPRISING THE SAME AND HEAT RADIATION SUBSTRATE USING THE SAME
    Publication number: 20160222195
    Abstract: An inorganic filler according to an embodiment of the present invention includes a boron nitride agglomerate and a coating layer formed on the boron nitride agglomerate and including a —Si—R—NH2 group, and R is selected from the group consisting of an alkyl group having 1 to 3 carbon atoms, an alkene group having 2 to 3 carbon atoms, and an alkyne group having 2 to 3 carbon atoms.
    Type: Application
    Filed: March 4, 2015
    Publication date: August 4, 2016
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Sang A JU, Hyun Gu IM, Jae Man PARK
  • Printed circuit board and light emitting device
    Patent number: 9241399
    Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: January 19, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang In Yoon, Jeong Han Kim, Jeung Ook Park, Hyun Gu Im
  • PRINTED CIRCUIT BOARD AND LIGHT EMITTING DEVICE
    Publication number: 20150181691
    Abstract: A printed circuit board according to an embodiment of the present invention includes a substrate including a first metal layer, a second metal layer formed on one surface of the first metal layer, and a third metal layer formed on the other surface of the first metal layer, an insulating layer formed on the second metal layer, and a circuit pattern formed on the insulating layer. A cavity configured to accommodate a light emitting element package is formed in the insulating layer. A thermal conductivity of the first metal layer is greater than thermal conductivities of the second metal layer and the third metal layer.
    Type: Application
    Filed: December 23, 2014
    Publication date: June 25, 2015
    Inventors: Sang In YOON, Jeong Han Kim, Jeung Ook Park, Hyun Gu IM