Patents by Inventor Hyun Hak Kim

Hyun Hak Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7002522
    Abstract: Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.
    Type: Grant
    Filed: July 20, 2004
    Date of Patent: February 21, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hak Kim, Chul Ho Kim, Gi Tae Do, Il Hwan Park, Jeong Sik Seo
  • Patent number: 6992633
    Abstract: Disclosed herein is a multi-layered chip antenna using double coupling feeding.
    Type: Grant
    Filed: June 3, 2004
    Date of Patent: January 31, 2006
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hak Kim, Chul Ho Kim, Gi Tae Do, Jeong Sik Seo, Il Hwan Park
  • Publication number: 20050259012
    Abstract: Disclosed herein is a chip antenna for terrestrial DMB. The chip antenna comprises a dielectric block, a main antenna device formed with conductive patterns in the dielectric block such that a plurality of unit lamination structures of the conductive patterns having a meander line structure in the direction of the Z-axis in an XZ plane are arranged in the direction of the Y axis while adjacent unit lamination structures are connected to each other, forming a lamination structure having the meander line structure in the directions of the Y-axis, and the plurality of lamination structures are arranged in the direction of the X-axis and adjacent lamination structures are connected to each other in the direction of the X-axis to have the meander line structure, and a T-shaped assistant antenna device formed at an upper or lower dielectric layer in the main antenna device.
    Type: Application
    Filed: July 20, 2004
    Publication date: November 24, 2005
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hak Kim, Chul Ho Kim, Gi Tae Do, Il Hwan Park, Jeong Seo
  • Patent number: 6819289
    Abstract: A chip antenna, which is used for a mobile communication terminal, local area networks (LAN), or at blue tooth (BT) band, includes: a base block made of one selected from a diaelectric material and a magnetic material and including an upper surface, a lower surface, and four side surfaces disposed between the upper surface and the lower surface; inverted F-type first conductive patterns formed on a part of the base block; inverted L-type second conductive patterns formed on another part of the base block and connected in parallel with the first patterns; and parasitic elements spaced from the first and second patterns by a designated distance and forming an electromagnetic coupling with the first and second conductive patterns.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: November 16, 2004
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hak Kim, Jae Chan Lee
  • Publication number: 20030227411
    Abstract: Disclosed is a chip antenna which is used for a mobile communication terminal, local area networks (LAN), or at blue tooth (BT) band, and more particularly a chip antenna with parasitic elements which forms an electromagnetic coupling with conductive patterns, thereby generating double or multiple resonances between the parasitic elements and the conductive patterns connected to a power-feeding terminal.
    Type: Application
    Filed: December 27, 2002
    Publication date: December 11, 2003
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Hak Kim, Jae Chan Lee