Patents by Inventor Hyun Hee Gu
Hyun Hee Gu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8941971Abstract: There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 ?m to 30 ?m, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions.Type: GrantFiled: August 8, 2012Date of Patent: January 27, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Jun Park, Kyu Ha Lee, Da Young Choi, Chang Hoon Kim, Hyun Hee Gu, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
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Patent number: 8941972Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.Type: GrantFiled: August 10, 2012Date of Patent: January 27, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Jun Park, Sang Hoon Kwon, Chang Hoon Kim, Hyun Hee Gu, Jae Young Park, Da Young Choi, Kyu Ha Lee, Byung Jun Jeon
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Publication number: 20150022940Abstract: There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof.Type: ApplicationFiled: October 23, 2013Publication date: January 22, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Hwan HAN, Byoung Jin Chun, Kyung Pyo Hong, Hyun Hee Gu, Byung Jun Jeon
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Patent number: 8842413Abstract: There is provided a multilayered ceramic electronic component having a reduced thickness and exhibiting hermetic sealing. In multilayered ceramic electronic component, an external electrode includes two layers, that is, first and second layers, and the first and second layers contain glass with different compositions, respectively. Therefore, the multilayered ceramic electronic component having high reliability, such as strong adhesion between the external electrode and the internal electrode, prevention of glass exudation, or the like, may be obtained.Type: GrantFiled: January 18, 2012Date of Patent: September 23, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Jun Park, Da Young Choi, Byong Gyun Kim, Ji Sook Kim, Byung Jun Jeon, Hyun Hee Gu, Kyu Ha Lee, Gun Jung Yoon, Eun Sang Na
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Patent number: 8837112Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05?A/B?0.6 is satisfied.Type: GrantFiled: September 14, 2012Date of Patent: September 16, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyun Hee Gu, Myung Jun Park, Kyu Ha Lee, Da Young Choi, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
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Publication number: 20140240899Abstract: Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film.Type: ApplicationFiled: February 25, 2014Publication date: August 28, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hae Sock CHUNG, Doo Young KIM, Ki Won KIM, Tae Jin JANG, Hyun Hee GU, Ji Hee MOON, Jin Hyung LIM, Youn Sik JIN, Byung Jun JEON
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Publication number: 20140233148Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te?0.6 ?m, N>200, and 3 ?m?t<L, so that the occurrence of radial cracks can be prevented and thus reliability can be improved.Type: ApplicationFiled: May 24, 2013Publication date: August 21, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Jun JEON, Kyu Ha LEE, Hyun Hee GU, Chang Hoon KIM, Myung Jun PARK
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Publication number: 20140233149Abstract: There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by TA, and a thickness of the ceramic body is denoted by Tc, T?10 ?m, TA/TC>0.8, and t?5 ?m, so that a multilayer ceramic electronic component having excellent reliability may be realized.Type: ApplicationFiled: May 24, 2013Publication date: August 21, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Jun JEON, Kyu Ha LEE, Hyun Hee GU, Chang Hoon KIM, Myung Jun PARK
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Patent number: 8792223Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls?10 ?m is satisfied.Type: GrantFiled: September 14, 2012Date of Patent: July 29, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyun Hee Gu, Myung Jun Park, Kyu Ha Lee, Da Young Choi, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
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Publication number: 20140196936Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the plurality of dielectric layers and alternately exposed to both end surfaces of the ceramic body; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the respective first and second internal electrodes; and first and second non-conductive epoxy resin layers formed on peripheral surfaces of the first and second external electrodes except for mounting surfaces of the first and second external electrodes.Type: ApplicationFiled: March 15, 2013Publication date: July 17, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Pyo HONG, Hyun Hee GU, Doo Young KIM, Young Ghyu AHN, Chang Hoon KIM
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Publication number: 20140192453Abstract: There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles.Type: ApplicationFiled: March 11, 2013Publication date: July 10, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Pyo HONG, Hyun Hee GU, Byoung Jin CHUN, Jae Hwan HAN
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Patent number: 8767375Abstract: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.Type: GrantFiled: August 8, 2012Date of Patent: July 1, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Jun Park, Sang Hoon Kwon, Jae Young Park, Kyu Ha Lee, Byung Jun Jeon, Da Young Choi, Hyun Hee Gu, Chang Hoon Kim
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Publication number: 20140146437Abstract: There is provided a multi-layered ceramic electronic component including a ceramic body including a dielectric layer, first and second internal electrodes disposed within the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, wherein the first and second external electrodes include a conductive metal and glass and further include a second phase material occupying an area of 1 to 80% with respect to an area of glass in the first and second external electrodes.Type: ApplicationFiled: May 14, 2013Publication date: May 29, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyu Ha LEE, Eun Joo CHOI, Hye Seong KIM, Byung Jun JEON, Hyun Hee GU, Jeong Ryeol KIM, Seung Hee YOO, Chang Joo LEE
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Publication number: 20140116766Abstract: There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers.Type: ApplicationFiled: May 24, 2013Publication date: May 1, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Byung Jun JEON, Byoung Hwa LEE, Hyun Hee GU, Chang Hoon KIM, Young Ghyu AHN
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Patent number: 8675343Abstract: There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20?a?60, 20?b?60, and 2?c?25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved.Type: GrantFiled: February 28, 2012Date of Patent: March 18, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Jun Park, Sung Bum Sohn, Hyun Hee Gu, Chang Hoon Kim, Sang Hoon Kwon
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Publication number: 20140063683Abstract: There are provided a conductive paste for an external electrode including: 100 parts by weight of a conductive metal particle; 5 to 30 parts by weight of a base resin; and 0.5 to 10 parts by weight of a spherical cross-linked polymer.Type: ApplicationFiled: December 6, 2012Publication date: March 6, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyun Hee GU, Sung Koo KANG, Kyung Pyo HONG, Byung Jun JEON
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Publication number: 20140063684Abstract: There is provided conductive paste composition for an external electrode including: a first metal powder particle having a spherical shape and formed of a fine copper; and a second metal powder particle coated on a surface of the first metal powder particle and having a melting point lower than that of the copper.Type: ApplicationFiled: December 20, 2012Publication date: March 6, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyu Ha LEE, Chang Joo LEE, Jae Hwan HAN, Hye Seong KIM, Chang Hoon KIM, Hyun Hee GU, Kyung Pyo HONG, Sung Koo KANG, Byoung Jin CHUN, Byung Jun JEON
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Publication number: 20140043724Abstract: There is provided a multilayer ceramic electronic part having high reliability including: a ceramic body including a dielectric layer; internal electrodes formed in the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween; an electrode layer formed on the exterior of the ceramic body and electrically connected to the internal electrodes; a conductive resin layer formed on the electrode layer; and a plating layer formed on the conductive resin layer, wherein the conductive resin layer includes a first conductive resin layer contacting the electrode layer, and a second conductive resin layer formed on the exterior of the first conductive resin layer, contacting the plating layer and having a resin content different from that of the first conductive resin layer.Type: ApplicationFiled: December 26, 2012Publication date: February 13, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Koo KANG, Hyun Hee GU, Kyung Pyo HONG, Byung Jun JEON, Chang Hoon KIM
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Publication number: 20140002949Abstract: There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed within the ceramic body to face each other, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the plurality of internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and glass portions, and when an average length of the glass portions in a length direction of the external electrodes is Ls, Ls?10 ?m is satisfied.Type: ApplicationFiled: September 14, 2012Publication date: January 2, 2014Inventors: Hyun Hee GU, Myung Jun Park, Kyu Ha Lee, Da Young Choi, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon
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Publication number: 20140002950Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 ?m or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05?A/B?0.6 is satisfied.Type: ApplicationFiled: September 14, 2012Publication date: January 2, 2014Inventors: Hyun Hee GU, Myung Jun Park, Kyu Ha Lee, Da Young Choi, Jae Young Park, Sang Hoon Kwon, Byung Jun Jeon