Abstract: There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

Abstract: There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 ?m or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T1, 0.8?|T1/Tc|?1.0 is satisfied.

Abstract: A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 ?m or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T1, 0.5?|T1/Tc|?1.0 is satisfied.

Abstract: There are provided a conductive paste for an external electrode, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. More particularly, there are provided a conductive paste for an external electrode including: a conductive metal powder; and a spherical glass frit having an average particle size of 0.05 to 3.0 ?m, a multilayer ceramic electronic component using the same, and a method of manufacturing the same. According to the present invention, a spherical glass frit having fine particles may be applied at the time of preparing the conductive paste for an external electrode, thereby realizing external electrodes having excellent compactness at a low temperature and suppressing the occurrence of cracks, and thus, a multilayer ceramic electronic component having excellent reliability can be implemented.

Abstract: There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 ?m to 30 ?m, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions.

Abstract: There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented.

Abstract: There are provided a conductive paste for an external electrode, a multilayered ceramic electronic component using the same, and a fabrication method thereof. The conductive paste for external electrode includes: a conductive metal; and a conductive amorphous metal including a (Cu, Ni)-bZr-c(Al, Sn) that satisfies conditions of a+b+c=100, 20?a?60, 20?b?60, and 2?c?25. A degradation of connectivity between external electrodes and internal electrodes and defective plating due to a glass detachment may be solved.

Abstract: There are provided a multilayer ceramic electronic component, and a method of fabricating the same. The multilayer ceramic electronic component includes: a ceramic main body including a dielectric layer; first and second internal electrodes disposed to face each other within the ceramic main body; and a first external electrode and a second external electrode, wherein the first and second external electrodes include a conductive metal and glass, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of the glass in a central part thereof is 35% to 80% of the total area of the central part. A multilayer ceramic electronic component having improved reliability may be implemented by enhancing chip air-tightness.

Abstract: There is provided a multilayered ceramic electronic component having a reduced thickness and exhibiting hermetic sealing. In multilayered ceramic electronic component, an external electrode includes two layers, that is, first and second layers, and the first and second layers contain glass with different compositions, respectively. Therefore, the multilayered ceramic electronic component having high reliability, such as strong adhesion between the external electrode and the internal electrode, prevention of glass exudation, or the like, may be obtained.

Abstract: There are provided a conductive paste composition for a termination electrode, and a multilayer ceramic capacitor including the same and a manufacturing method thereof. The conductive paste composition includes 100 parts by weight of conductive metal powder and 0.1 to 10 parts by weight of ceramic powder having an average particle size of 50 to 500 nm. The conductive paste composition described above may achieve a high firing density even in the case that it is used in the manufacturing of a thin film, and inhibit the occurrence of blisters, a delamination failure of the termination electrode during calcination of the electrode, thereby producing a compact and thin film.

Abstract: There are provided a conductive paste composition for a termination electrode, a multilayer ceramic capacitor having the same, and a method thereof. The conductive paste composition for a termination electrode includes a conductive metal powder and a glass frit represented by the following Formula: aSiO2-bB2O3-cAl2O3-dTMxOy-eR12O-fR2O, where TM is a transition metal selected from a group consisting of zinc (Zn), titanium (Ti), copper (Cu), vanadium (V), manganese (Mn), iron (Fe) and nickel (Ni); R1 is selected from a group consisting of lithium (Li), sodium (Na) and potassium (K); R2 is selected from a group consisting of magnesium (Mg), calcium (Ca), strontium (Sr) and barium (Ba); each of x and y is larger than 0; and ‘a’ ranges from 15 to 70 mol %, ‘b’ ranges from 15 to 45 mol %, ‘c’ ranges from 1 to 10 mol %, ‘d’ ranges from 1 to 50 mol %, ‘e’ ranges from 2 to 30 mol % and ‘f’ ranges from 5 to 40 mol %.

Abstract: Disclosed herein is an apparatus for forming an electrode on a surface of a ceramic laminate. The apparatus for forming an electrode includes: a blast surface plate having ruggedness to which an electrode material paste is applied; and a moving device moving a ceramic laminate so that the ceramic laminate contacts the blast surface plate.

Abstract: Provided are a conductive paste for an external electrode, a multilayer ceramic capacitor including the same, and a manufacturing method thereof. The conductive paste compound for an external electrode includes a first powder and a second powder. The first powder includes copper and has a mean grain size of 3 ?m or less, and the second powder has a lower diffusion speed and a higher melting point than the copper and has a mean grain size of 180 nm or less.